Prepreg, prepreg curing, multilayer board, printed circuit board and semiconductor package

Abstract

This invention provides a prepreg that can suppress poor forming of the insulating layer. The invention further provides a cured form of the prepreg, a multilayer board, a printed circuit board, and a semiconductor package obtained using the prepreg. Specifically, the aforementioned prepreg is a prepreg containing a fiber substrate and a thermosetting resin composition or a semi-cured form of the aforementioned thermosetting resin composition, wherein the aforementioned thermosetting resin composition contains (B) an inorganic filler material with a volume average particle size of 2.0 μm or more, the aforementioned thermosetting resin composition or the semi-cured form of the aforementioned thermosetting resin composition overflows from the surface of the aforementioned fiber substrate, and the thickness of the layer of the aforementioned thermosetting resin composition or the semi-cured form of the aforementioned thermosetting resin composition overflowing from the surface of the aforementioned fiber substrate is 10 μm or more.

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