Underfill material, semiconductor package and method of manufacturing semiconductor package
TW202637754APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information
- Application Number
- TW114144491
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-05
- Filing Date
- 2025-11-14
- Publication Date
- 2026-09-16
Abstract
An underfill material contains a polyfunctional epoxy resin including two or more epoxy groups in one molecular, a filler and a monofunctional epoxy resin including one epoxy group in one molecular.
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