Curing components, dry film, cured material and printed wiring boards

Abstract

This invention provides a curable composition capable of forming a hardened material with low dielectric properties and inhibiting the formation of cracks after desmear treatment. One embodiment of this invention is a curable composition. The aforementioned curable composition comprises: polyphenylene ether (A), which includes: a functional group (a) having an unsaturated carbon bond; and a compound (B), which, within the same molecule, respectively has one or more of the following: a functional group (b) having an unsaturated carbon bond and a thiol group. The aforementioned functional group (b) is a styrene group.