Components, electronic parts and semiconductor devices
TW202637778APending Publication Date: 2026-09-16TOKUYAMA CORP
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Patent Information
- Application Number
- TW114149563
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-23
- Filing Date
- 2025-12-17
- Publication Date
- 2026-09-16
Abstract
The composition of the present invention is characterized by comprising (A) Ga or Ga alloy, (B) thermally conductive ceramic filler, and (C) hydrophilic silicon dioxide, wherein the average particle size D50 of the aforementioned (C) hydrophilic silicon dioxide is 0.15 μm or more. By means of the present invention, a composition with excellent flowability in a composition comprising Ga (gallium) or Ga alloy and thermally conductive ceramic filler can be provided.
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