Adhesives for semiconductors, adhesive tapes, manufacturing methods for semiconductor devices, and semiconductor devices

TW202637801APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information

Application Number
TW114149553
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-19
Filing Date
2025-12-17
Publication Date
2026-09-16

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Abstract

An adhesive for semiconductors comprises a thermosetting resin, a curing agent, a thermoplastic resin, and a filler. The thermosetting resin includes an epoxy resin that is solid at 30°C and an epoxy resin that is liquid at 30°C. The epoxy resin that is solid at 30°C comprises a compound having a structure in which two or more rings selected from the group consisting of aliphatic rings and aromatic rings are directly bonded, and a monocyclic aromatic ring having at least one hydrogen atom substituted by a glycidyloxy group.
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