Film adhesives, die-cutting bonding monolithic films, and semiconductor devices and methods for manufacturing the same.

Abstract

This disclosure provides a film-forming adhesive comprising epoxy resin, phenolic resin, acrylic rubber, inorganic filler, and a dispersant with polar groups. The inorganic filler is a filler composed of a substance with a thermal conductivity of 10–2000 W / (m·K) at 20°C. Based on the total amount of the film-forming adhesive, the content of the inorganic filler is 50–90% by mass. Relative to 100 parts by mass of the total inorganic filler, the content of the dispersant with polar groups is 0.15 parts by mass or more.

Images