Composition, adhesive, curing agent, and fiber array
TW202637803APending Publication Date: 2026-09-16NAMICS CORPORATION
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Patent Information
- Application Number
- TW115105402
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-12
- Filing Date
- 2026-02-11
- Publication Date
- 2026-09-16
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Abstract
This invention provides a composition that provides a cured material with excellent delamination resistance. Additionally, it provides an adhesive that provides a cured material with excellent delamination resistance, a cured material with excellent delamination resistance, and an optical fiber array comprising said cured material. One composition comprises a compound (A) having a reactive functional group and a polymerization initiator (B), wherein the polymerization initiator (B) comprises a photoacid generator (B1) whose anionic species is at least one selected from the group consisting of phosphates, antimonates, gallates, and sulfonates, and the glass transition temperature (Tg) of the cured material is below 0°C.
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