Polishing compositions and methods of use thereof
TW202637808APending Publication Date: 2026-09-16FUJIFILM ELECTRONIC MATERIALS U S A INC
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Patent Information
- Application Number
- TW115113285
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2019-09-24
- Filing Date
- 2020-09-23
- Publication Date
- 2026-09-16
Abstract
A polishing composition includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a first low-k removal rate inhibitor; a second low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a cobalt corrosion inhibitor. This disclosure also relates to a method of polishing a substrate that comprises cobalt using the polishing compositions described herein.
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