Transfer laminate and method for manufacturing transfer laminate

TW202637855APending Publication Date: 2026-09-16OIKE & CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114145062
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-11
Filing Date
2025-11-19
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001076454_001
    Figure TWG2TA001076454_001
  • Figure TWG2TA001076454_002
    Figure TWG2TA001076454_002
  • Figure TWG2TA001076454_003
    Figure TWG2TA001076454_003
Patent Text Reader

Abstract

[Problem] A transfer printed laminate used for forming a circuit board and showing good stripping property even when no heat load is applied during the circuit formation process, and a method for manufacturing the transfer printed laminate are provided. [Solution] A transfer printed laminate sequentially comprises a substrate, a conductive layer, a stripping layer, and a conductive auxiliary layer. The conductive layer comprises copper; the stripping layer comprises an alloy of nickel and chromium or an alloy of nickel and copper; and the conductive auxiliary layer comprises copper. The maximum value of the oxygen concentration, determined by depth-direction compositional analysis using X-ray photoelectron spectroscopy in the thickness direction of the stripping layer, is
Need to check novelty before this filing date? Find Prior Art