Deposition equipment with shield cooling device

Abstract

The invention is a deposition equipment with shield cooling device, which comprises a chamber, a shield, a fixed ring, a carrier, and a cooling device. One end of the shield is connected to the chamber, while the other end supports the fixed ring. The carrier is used to support a wafer, where the carrier is located below the fixed ring and can drive the supported wafer to displace relative to the fixed ring and the shield, causing the fixed ring to contact the edge of the wafer and fix the wafer on the carrier. The cooling device is connected to the fixed ring, wherein the cooling device contains a cooling fluid and receives heat from the fixed ring through heat conduction to reduce the temperature of the fixed ring. By reducing the temperature of the fixed ring, the formation of a film at the interface between the fixed ring and the wafer can be avoided, and the adhesion between the fixed ring and the wafer can be effectively prevented.

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