Surface conditioning processes for semiconductor processing chamber parts

TW202637878APending Publication Date: 2026-09-16APPLIED MATERIALS INC
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Patent Information

Application Number
TW114146177
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-09
Filing Date
2025-11-26
Publication Date
2026-09-16

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Abstract

Surface conditioning processes for semiconductor processing chamber parts are described. The surface conditioning processes can be used to condition a ceramic material surface in a semiconductor processing chamber.
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