Heated valve for semiconductor processing tools

TW202637882APending Publication Date: 2026-09-16LAM RES CORP
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115101581
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-08
Filing Date
2026-01-15
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001077056_001
    Figure TWG2TA001077056_001
  • Figure TWG2TA001077056_002
    Figure TWG2TA001077056_002
  • Figure TWG2TA001077056_003
    Figure TWG2TA001077056_003
Patent Text Reader

Abstract

One example provides a heated valve for a semiconductor processing tool. The heated valve comprises a valve body comprising an internal side, and a heater assembly configured to heat at least a portion of the internal side of the valve body. The heater assembly comprises a heater including an electrical insulator and a resistive trace embedded within the electrical insulator. The heater is configured to output different watt densities as a function of a location on the heater.
Need to check novelty before this filing date? Find Prior Art