Semiconductor manufacturing equipment
TW202637892APending Publication Date: 2026-09-16KIOXIA CORP
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Patent Information
- Application Number
- TW114125271
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-14
- Filing Date
- 2025-07-03
- Publication Date
- 2026-09-16
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Abstract
The present invention provides a semiconductor manufacturing apparatus capable of suppressing the backflow of unwanted byproducts contained in exhaust gas. The semiconductor manufacturing apparatus comprises: a piping through which exhaust gas from a process chamber flows in a first direction; and a plurality of traps spaced apart on the inner circumferential surface of the piping in the first direction. Each of the plurality of traps has: a recess on the inner circumferential surface recessed towards the outer side of the piping; and a shielding surface extending from the edge of the recess into the piping along a second direction intersecting the first direction.
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