Metal substrate and method for surface treatment

Abstract

A metal substrate and a method for surface treatment are provided. The method for surface treatment includes: immersing a metal copper clad substrate into a first plating solution for a first electroless plating process to form a first silver layer onto the metal copper clad substrate; and immersing the metal copper clad substrate into a second plating solution for a second electroless plating process to form a second silver layer onto the first silver layer. The first plating solution includes a silver precursor, a chelating agent, a polyol, and a reducing agent. The second plating solution includes a silver precursor, a chelating agent, a polyol, a reducing agent, and an azobenzene compound. A concentration of the azobenzene compound in the second plating solution ranges from

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