Electroplating apparatus and electroplating method

Abstract

This application relates to the field of semiconductor manufacturing, specifically to an electroplating apparatus and an electroplating method. The electroplating apparatus includes: a clamp for holding a substrate; an electroplating chamber including an anode chamber, the anode chamber including a first anode region and a second anode region arranged from the inside out and separated from each other; a first anode structure including a first anode disposed within the first anode region; a second anode structure including a second anode disposed within the second anode region; the first anode and the second anode having the same initial height; and a controller configured to: during the electroplating process of the substrate, when the consumption of the first anode reaches a first preset value or the consumption of the second anode reaches a second preset value, simultaneously control the first anode to rise at a first moving speed or remain stationary, and the second anode to rise at a second moving speed, wherein the first moving speed is less than the second moving speed, thereby improving the uniformity of the coating thickness distribution on the substrate surface.

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