Backlight module

Abstract

A backlight module includes at least one light bar structure disposed on a side of a metal structure. The light bar structure includes a printed circuit board, a positive contact pad, a negative heat spreader, a plurality of light sources and a connector. The printed circuit board has a plurality of first openings. The positive contact pad is disposed on the printed circuit board. The negative heat spreader is disposed on the printed circuit board and has a plurality of first bending portions. The first bending portions at least partially penetrate through the first openings and contact with the side of the metal structure. The light sources are respectively electrically connected with the negative heat spreader and the positive contact pad. The connector is electrically connected with the negative heat spreader and the positive contact pad.

Description

[Technical Field]

[0001] This disclosure relates to a backlight module, and more particularly to a backlight module suitable for commercial video conferencing machines. [Previous Technology]

[0002] In traditional display device backlight modules, the LED strips are typically fixed to a metal backplate, and the LED strips and other circuit components, such as the main circuit board, dissipate heat through the metal backplate. Recently, various commercial display devices have adopted an increasing number of functional modules, many of which also require heat dissipation through a metal backplate. This significantly reduces the heat dissipation efficiency of the backlight module, easily leading to LED strip damage. Therefore, there is an urgent need for a method to improve the heat dissipation performance of backlight modules. [Summary of the Invention]

[0003] One of the purposes of this disclosure is to provide a backlight module that can reduce the risk of damage to the light source due to overheating and extend the service life of the backlight module, thereby improving the overall stability and durability of the display.

[0004] According to one embodiment of the present disclosure, a backlight module includes at least one LED strip structure disposed on one side of a metal structure. The LED strip structure includes a printed circuit board, a positive electrode contact pad, a negative electrode heat sink, a plurality of light sources, and a connector. The printed circuit board has a plurality of first openings. The positive electrode contact pad is disposed on the printed circuit board. The negative electrode heat sink is disposed on the printed circuit board and has a plurality of first bends, the first bends at least partially passing through the first openings and contacting the aforementioned side of the metal structure. The light sources are electrically connected to the negative electrode heat sink and the positive electrode contact pad, respectively. The connector is electrically connected to the negative electrode heat sink and the positive electrode contact pad.

[0005] In one or more embodiments disclosed herein, the negative electrode heat sink includes a first body. The first body abuts against a printed circuit board and has a plurality of second openings and a plurality of recesses. A first bent portion is connected to the first body and is adjacent to a corresponding one of the second openings. The recesses are recessed from the outer edge of the first body. The first body defines a plurality of contact areas, which are adjacent to a corresponding one of the recesses and connected to a corresponding one of the light sources. The positive electrode contact pad includes a second body and a plurality of contact portions. The second body abuts against the printed circuit board and is adjacent to the first body. The contact portions are connected to the second body and are located at a corresponding one of the recesses, and the contact portions are respectively connected to a corresponding one of the light sources.

[0006] In one or more embodiments disclosed herein, the light source described above directly contacts one of the grounding areas and the corresponding one of the contact portions.

[0007] In one or more embodiments disclosed herein, each of the above-mentioned electrical contact areas is located between two adjacent ones in the first bend.

[0008] In one or more embodiments disclosed herein, the first body has a plurality of first inner edges, each defining a second opening. Each of the first bends includes a first sub-bend and a second sub-bend. The first sub-bend is located away from and substantially parallel to the first body. The second sub-bend connects the first sub-bend to a corresponding one of the first inner edges. The second sub-bend extends abutting against one side of the metal structure.

[0009] In one or more embodiments disclosed herein, the metal structure has a plurality of second inner edges on one side, the second inner edges defining a third opening, and a first sub-bent extending beyond one of the second inner edges, wherein the metal structure further has a second bend extending to cover at least a portion of the third opening.

[0010] In one or more embodiments disclosed herein, the first sub-bend extends relative to the first inner edge, wherein at least the lengths of the first sub-bends are different.

[0011] In one or more embodiments disclosed herein, an air gap is separated between one side of the metal structure and the printed circuit board, and the distance of the air gap is between 2 mm and 5 mm.

[0012] In one or more embodiments disclosed herein, the above-described light strip structure further includes an insulating layer. The positive electrode contact pad and the negative electrode heat sink are sandwiched between the printed circuit board and the insulating layer.

[0013] In one or more embodiments disclosed herein, the negative electrode heat sink is made of a material with a thermal conductivity greater than 150 watts per meter kelvin (W / mK).

[0014] According to one embodiment of the present disclosure, a backlight module includes at least one LED strip structure disposed on one side of a metal structure. The LED strip structure includes a printed circuit board, a contact pad, a heat sink, and a plurality of light sources. The printed circuit board has a plurality of first openings. The contact pad is disposed on the printed circuit board. The heat sink is disposed on the printed circuit board and has a plurality of first bends, the first bends at least partially passing through the first openings and contacting the aforementioned side of the metal structure. The light sources directly contact the heat sink and the contact pad, respectively. The aforementioned side of the metal structure has a plurality of second bends, the first bends partially extending below the second bends.

[0015] The above-described embodiments disclosed herein have at least the following advantages:

[0016] (1) Since the negative heat sink is in direct contact with the light source and the first bent portion of the negative heat sink extends and is at least partially exposed to the third opening of the metal structure, the negative heat sink can conduct and radiate away the heat generated by the light source.

[0017] (2)Since there is an air gap between the metal structure plate and the printed circuit board, the light source can be isolated from the heat source on the back of the plate through the air gap, which can effectively protect the operational stability and heat dissipation performance of the backlight module. Moreover, the air gap provides a heat dissipation convection channel inside the display, further enhancing the heat dissipation effect.

[0018] (3) Through heat dissipation by conduction, convection and radiation, the backlight module can achieve better heat dissipation effect. In addition to avoiding damage to the light source due to overheating, it also extends the service life of the backlight module, thus improving the overall stability and durability of the display.

Implementation Method

[0020] Several embodiments of this disclosure will be disclosed below with reference to the drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, in some embodiments of this disclosure, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and elements will be shown in the drawings in a simple schematic manner, and in all drawings, the same reference numerals will be used to denote the same or similar elements. And, where feasible, features of different embodiments can be applied interchangeably.

[0021] Unless otherwise defined, all terms used herein (including technical and scientific terms) have their ordinary meanings, meanings that are understandable to those skilled in the art. Furthermore, the definitions of the aforementioned terms in commonly used dictionaries should be interpreted in the context of this specification as having the meanings consistent with the relevant field of this disclosure. Unless specifically defined, these terms will not be interpreted as having idealized or overly formal meanings.

[0022] Please refer to Figure 1. Figure 1 is a perspective view illustrating a backlight module 100 according to an embodiment of the present disclosure. In this embodiment, as shown in Figure 1, a backlight module 100 includes a plurality of light strip structures 110 and a metal structure 120. The light strip structures 110 are disposed on one side of the metal structure 120, that is, on the front side of the plate 121 of the metal structure 120, and each of the light strip structures 110 extends along a first direction D1, while the light strip structures 110 are arranged along a second direction D2. The first direction D1 is perpendicular to the second direction D2. However, the present disclosure is not limited to this. The light strip structures 110 may extend simultaneously in both the first direction D1 and the second direction D2 to form a light panel. The backlight module 100 may also have only a single light strip structure 110 or have multiple light strip structures 110 of different shapes.

[0023] Please refer to Figure 2. Figure 2 is a partial exploded view of the backlight module 100 shown in Figure 1. In this embodiment, as shown in Figure 2, each of the light strip structures 110 includes a printed circuit board 111, a positive electrode contact pad 112, a negative electrode heat sink 113, a plurality of light sources 114, a plurality of lenses 117, a connector 115, and an insulating layer 116. The light source 114 can be various types of light-emitting diodes, and the lens 117 covers the light source 114 to adjust the beam direction of the light source 114 and improve the optical performance. However, it is not limited to this; the light strip structure 110 may also have only the light source 114 without the lens 117. Both the positive electrode contact pad 112 and the negative electrode heat sink 113 are disposed on the printed circuit board 111, and the insulating layer 116 covers the positive electrode contact pad 112 and the negative electrode heat sink 113, that is, the positive electrode contact pad 112 and the negative electrode heat sink 113 are sandwiched between the printed circuit board 111 and the insulating layer 116. The printed circuit board 111 is made of rigid material, providing good structural strength for the light strip structure 110 and enabling the light strip structure 110 to be modularized. The bottom of the printed circuit board 111 has a bottom insulating layer. Furthermore, the printed circuit board 111 has a plurality of first openings OP1. The negative electrode heat sink 113 has a plurality of first bends 1132, the first bends 1132 being configured to at least partially pass through the first openings OP1 of the printed circuit board 111. The insulating layer 116 has multiple fourth openings OP4, and the light source 114 and the connector 115 are respectively located in the fourth openings OP4 of the insulating layer 116. They pass through the insulating layer 116 to connect the negative heat sink 113 and the positive contact pad 112. The connector 115 is configured to connect to an external power supply or controller (not shown) to drive the light source 114 to emit light.

[0024] In some embodiments, the negative electrode heat sink 113 is made of a material with high thermal conductivity, having a thermal conductivity greater than 150 watts per meter kelvin (W / mK). That is, the negative electrode heat sink 113 is made of a material with high thermal conductivity. For example, the negative electrode heat sink 113 may be oxygen-free copper Cu1100, high-purity aluminum Al1050, or a high thermal conductivity metal material with graphene coated on its surface, but this disclosure is not limited thereto.

[0025] Specifically, as shown in Figure 2, the negative electrode heat sink 113 further includes a first body 1131. The first body 1131 is configured to abut against the printed circuit board 111 and has a plurality of first inner edges 1131b and a plurality of recesses R. The first inner edges 1131b define second openings OP2. In fact, the first body 1131 and the first bending portion 1132 are integrally formed, and the first bending portion 1132 is connected to the first inner edges 1131b respectively, that is, the first bending portion 1132 is adjacent to the second openings OP2 respectively. The recesses R are formed by recessing from the outer edge 1131a of the first body 1131. The first body 1131 defines a plurality of contact areas Z, which are adjacent to the recesses R and connected to the light source 114 respectively. That is, the contact areas Z correspond to a plurality of fourth openings OP4 of the insulating layer 116 respectively. On the other hand, the positive electrode contact pad 112 includes a second body 1121 and a plurality of contact portions 1122. The second body 1121 is configured to abut against the printed circuit board 111 and adjacent to the first body 1131. The contact portion 1122 is connected to the second body 1121 and is located in the clearance portion R of the first body 1131. The contact portion 1122 is connected to the light source 114. That is, the contact portion 1122 corresponds to the plurality of fourth openings OP4 of the insulating layer 116 and the clearance portion R of the negative electrode heat sink 113.

[0026] Please refer to Figure 3. Figure 3 is a cross-sectional view showing line segment AA in Figure 1. In this embodiment, as shown in Figure 3, the light source 114 directly contacts both the contact area Z of the negative heat sink 113 and the contact portion 1122 of the positive contact pad 112, electrically connecting the negative heat sink 113 and the positive contact pad 112. When the backlight module 100 is operating, current flows from the positive contact pad 112 through the light source 114 to the negative heat sink 113, energizing the light source 114 and causing it to emit light.

[0027] However, in practice, the light source 114 can directly contact the contact area Z of the negative heat sink 113 and the contact portion 1122 of the positive contact pad 112, while the light source 114 is not electrically connected to the negative heat sink 113 and the positive contact pad 112. In other words, the light source 114 is electrically insulated from the negative heat sink 113 and the positive contact pad 112. In this case, the negative heat sink 113 only provides heat dissipation for the light source 114, while the positive contact pad 112 does not supply power to the light source 114, and the light source 114 is electrically connected to other power sources (not shown).

[0028] Please refer to Figure 4. Figure 4 is a cross-sectional view showing the line segment BB in Figure 1. In this embodiment, as shown in Figure 4, the connector 115 passes through the fourth opening OP4 of the insulating layer 116 and simultaneously makes direct contact with the contact area Z of the negative heat sink 113 and the contact portion 1122 of the positive contact pad 112, thereby electrically connecting the negative heat sink 113 and the positive contact pad 112 and receiving power from the light source 114.

[0029] Please refer to Figure 5. Figure 5 is a schematic diagram illustrating the installation of the backlight module 100 in Figure 1. In this embodiment, as shown in Figures 2 and 5, the metal structure 120 can actually be the backplate of a direct-lit backlight module, which includes a plate 121 and a plurality of second bends 122. The second bends 122 are connected to the plate 121 and are integrally formed with the plate 121. When the first bend 1132 of the negative electrode heat sink 113 passes through the first opening OP1 of the printed circuit board 111, the lamp strip structure 110 moves along the second direction D2 toward the second bend 122 of the metal structure 120 so that the first bend 1132 corresponds to the second bend 122. As shown in Figure 5, in some embodiments, the first bend 1132 is embedded in the gap of the second bend 122, thereby fixing the lamp strip structure 110 to the metal structure 120. In one embodiment of this disclosure, the metal structure 120 may be located on the side of the side-lit backlight module, and it also has a plate 121 and a plurality of second bent portions 122 integrally formed with the plate 121. In one embodiment of this disclosure, the metal structure 120 may also be formed at other locations where the light strip structure 110 can be installed, and is not limited to the backlight module 100.

[0030] Please refer to Figure 6. Figure 6 is a cross-sectional perspective view showing the line segment CC in Figure 1. In this embodiment, as shown in Figure 6, each of the first bending portions 1132 includes a first sub-bending portion 11321 and a second sub-bending portion 11322. The first sub-bending portion 11321 is located away from and substantially parallel to the first body 1131, while the second sub-bending portion 11322 is connected between the first sub-bending portion 11321 and the first inner edge 1131b of the first body 1131. In some embodiments, the first sub-bending portion 11321 and the second sub-bending portion 11322 extend substantially perpendicular to each other, the second sub-bending portion 11322 extends to abut against the front of the plate 121 of the metal structure 120, and the first sub-bending portion 11321 extends along the plate 121 of the metal structure 120. On the other hand, the plate 121 of the metal structure 120 has a plurality of second inner edges 121a, each of which defines a third opening OP3. The third opening OP3 at least partially corresponds to the first sub-bend 11321 and the second bend 122 of the metal structure 120, meaning that the first sub-bend 11321 partially contacts the plate 121 of the metal structure 120, and extends beyond the second inner edges 121a, partially extending above the third opening OP3 and below the second bend 122. The second bend 122 of the metal structure 120 connects to the second inner edges 121a and extends above the third opening OP3 and a portion of the first sub-bend 11321. In some embodiments, the second bend 122 of the metal structure 120 is substantially parallel to the extension portion of the first sub-bend 11321 of the first bend 1132. In some embodiments, the extension of the second bend 122 of the metal structure 120 abuts against the first sub-bend 11321 or the second sub-bend 11322.

[0031] When the backlight module 100 is in operation, the light source 114 is powered on and emits light, which continuously generates heat. This heat can be conducted through the contact area Z to the first body 1131 of the negative electrode heat sink 113, and then through the first bend 1132 to the metal structure 120. Since the negative electrode heat sink 113 is made of a highly thermally conductive material, it can quickly conduct the heat generated by the light source 114, preventing heat accumulation in the light source 114 and preventing the light source 114 from being damaged or having its lifespan shortened due to overheating. Moreover, as shown in Figure 2, the contact area Z is located between two adjacent openings in the second opening OP2, that is, the light source 114 is located between two adjacent openings in the first bend 1132. In this way, the efficiency of the negative electrode heat sink 113 in conducting the heat generated by the light source 114 can be further improved.

[0032] Furthermore, as described above, the third opening OP3 of the metal structure 120 at least partially exposes the first sub-bend 11321 of the first bend 1132, which facilitates the first sub-bend 11321 to dissipate heat through the third opening OP3 in a radiating manner, and prevents the light source 114 from absorbing heat from the circuit components on the back of the board 121.

[0033] Furthermore, as shown in Figure 6, the metal structure 120 plate 121 and the printed circuit board 111 are separated by a distance X to define an air gap AG. In order to achieve better heat convection, in this embodiment, the distance X is between 2 mm and 5 mm.

[0034] Please refer to Figure 7. Figure 7 is a schematic diagram illustrating the application of the backlight module 100 in Figure 1. In this embodiment, as shown in Figure 7, the backlight module 100 is disposed within the housing 250 of the display 200, which is, for example, a commercial video conferencing machine. Generally, in the internal structure of the display 200, the camera module, along with the speaker and drive controller 210, power supply module 220, motherboard module 230, and signal source board 240, are usually disposed on the back of the board 121, that is, on the side of the metal structure 120 away from the light source 114, and these circuit components continuously generate heat during operation. However, in the backlight module 100, since there is an air gap AG between the plate 121 of the metal structure 120 and the printed circuit board 111 of the lamp strip structure 110 (see Figure 6), the light source 114 can be isolated from the heat source on the back of the plate 121 by means of the air gap AG, which can effectively protect the operational stability and heat dissipation performance of the backlight module 100.

[0035] Furthermore, as shown in Figure 7, the air gaps AG of the LED strip structure 110 provide a heat dissipation convection channel in the second direction D2. Specifically, air outside the display 200 can enter the housing 250 through the lower vent V2 of its housing 250 and form thermal convection with the air gaps AG arranged in the second direction D2. The heat is then carried away by the airflow through the upper vent V1 of the housing 250, thereby enhancing the heat dissipation effect. That is to say, the housing 250 has upper vents V1 and lower vents V2 on opposite sides, and multiple air gaps AG are formed between the LED strip structure 110 and the plate 121. The communication direction of the air gaps AG is the opposite side of the housing 250 with upper vents V1 and lower vents V2.

[0036] Through the above-mentioned heat dissipation methods of conduction, convection and radiation, the backlight module 100 can achieve better heat dissipation effect. In addition to avoiding damage to the light source 114 due to overheating, it also extends the service life of the backlight module 100, thus improving the overall stability and durability of the display 200.

[0037] It is worth noting that when the display 200 is operating, the circuit components disposed on the back of the board 121 within the display 200 generate heat to varying degrees. Therefore, as shown in Figure 6, the first sub-bend 11321 has an extension length L relative to the first inner edge 1131b or the second sub-bend 11322, and the extension lengths L of at least two first sub-bends 11321 are different. Depending on the position of the light strip structure 110 on the front of the board 121, if there is a light source 114 corresponding to a heat source that generates a large amount of heat on the back of the board 121, the adjacent first sub-bend 11321 may have a longer extension length L. For example, as shown in Figure 6, corresponding to the heating conditions of different modules, the first sub-bend 11321 adjacent to the middle light source 114 has an extension length L1, while the first sub-bend 11321 adjacent to the right light source 114 has an extension length L2, and the extension length L1 is greater than the extension length L2. In some embodiments, apart from the different extension lengths of some of the first sub-bends 11321, only some of the light sources 114 are equipped with negative heat sinks 113 corresponding to the second bends 122 and the third opening OP3 of the metal structure 120. Other light sources 114 are not equipped with negative heat sinks 113 or first bends 1132, for example, in locations where heat dissipation efficiency does not need to be improved or where they are far from the heat source.

[0038] By using the different extension lengths L of the first sub-bending portion 11321, the lifespan of the light source 114 at each position can be improved, and the lifespan curve and light emission decay of each light source 114 in the backlight module 100 can be made closer, so that the brightness of the backlight module 100 remains consistent after long-term operation, which can greatly improve the reliability of the backlight module 100.

[0039] Please refer to Figure 8. Figure 8 is a cross-sectional view illustrating a backlight module 100 according to another embodiment of this disclosure. In some embodiments, as shown in Figure 8, the metal structure 120 further includes a plurality of heat dissipation fins 123 disposed on the board 121 and abutting against the printed circuit board 111 of the lamp strip structure 110, and the heat dissipation fins 123 are at least partially arranged along a first direction D1 and respectively extend along a second direction D2 to further improve the heat dissipation effect of the backlight module 100. In some embodiments, the heat dissipation fins 123 may be disposed below the bottom insulating layer of the printed circuit board 111 and abut against the board 121. In some embodiments, the heat dissipation fins 123 are only disposed between a portion of the board 121 and a portion of the printed circuit board 111, for example, where improved heat dissipation efficiency is required or near a heat source. In some embodiments, the heat dissipation fins 123 can coexist with the aforementioned negative heat dissipation fins 113, the second bend 122, and the third opening OP3. For example, the heat dissipation fins 123 may be located in the air gap AG, or the positions of the heat dissipation fins 123 and the negative heat dissipation fins 113, the second bend 122, and the third opening OP3 may be offset. Alternatively, some light sources 114 of the light strip structure 110 may be configured with negative heat dissipation fins 113 corresponding to the second bend 122 and the third opening OP3 of the metal structure 120, while other light sources 114 may be positioned corresponding to the heat dissipation fins 123 of the metal structure 120. In some embodiments, the extending direction of the heat dissipation fins 123 is the same as the communication direction of the air gap AG, forming a heat convection channel.

[0040] In one embodiment, the technical solution disclosed in the above-described embodiments has at least the following advantages:

[0041] (1) Since the negative heat sink is in direct contact with the light source and the first bent portion of the negative heat sink extends and is at least partially exposed to the third opening of the metal structure, the negative heat sink can conduct and radiate away the heat generated by the light source.

[0042] (2)Since there is an air gap between the metal structure plate and the printed circuit board, the light source can be isolated from the heat source on the back of the plate through the air gap, which can effectively protect the operational stability and heat dissipation performance of the backlight module. Moreover, the air gap provides a heat dissipation convection channel inside the display, further enhancing the heat dissipation effect.

[0043] (3)The backlight module can achieve better heat dissipation through conduction, convection and radiation. In addition to avoiding damage to the light source due to overheating, it also extends the service life of the backlight module, thus improving the overall stability and durability of the display.

[0044] Although the present disclosure has been disclosed above with reference to embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0019] Figure 1 is a perspective view illustrating a backlight module according to one embodiment of the present disclosure. Figure 2 is a partial exploded view illustrating the backlight module of Figure 1. Figure 3 is a cross-sectional view along line segment AA of Figure 1. Figure 4 is a cross-sectional view along line segment BB of Figure 1. Figure 5 is an installation diagram illustrating the backlight module of Figure 1. Figure 6 is a perspective view showing a cross-sectional view along line segment CC of Figure 1. Figure 7 is an application diagram illustrating the backlight module of Figure 1. Figure 8 is a cross-sectional view illustrating a backlight module according to another embodiment of the present disclosure. [Biomaterial Storage]

[0046] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A backlight module comprising: at least one light strip structure disposed on one side of a metal structure, the at least one light strip structure comprising: a printed circuit board having a plurality of first openings; a positive electrode contact pad disposed on the printed circuit board; a negative electrode heat sink disposed on the printed circuit board and having a plurality of first bends, the first bends at least partially passing through the first openings and contacting the side of the metal structure; a plurality of light sources electrically connected to the negative electrode heat sink and the positive electrode contact pad respectively; and a connector electrically connected to the negative electrode heat sink and the positive electrode contact pad.

2. The backlight module as claimed in claim 1, wherein the negative heat sink comprises: a first body abutting the printed circuit board and having a plurality of second openings and a plurality of recesses, the first bends connecting to the first body and respectively adjacent to one of the second openings, the recesses being recessed from one outer edge of the first body, the first body defining a plurality of contact areas respectively adjacent to one of the recesses and connected to one of the light sources; the positive contact pad comprises: a second body abutting the printed circuit board and adjacent to the first body; and a plurality of contacts connecting to the second body and respectively located at one of the recesses, the contacts being respectively connected to one of the light sources.

3. The backlight module as described in claim 2, wherein the light sources respectively directly contact one of the electrical contact areas and the corresponding one of the contact portions.

4. The backlight module as claimed in claim 2, wherein each of the power contact areas is located between two adjacent first bends.

5. The backlight module as claimed in claim 2, wherein the first body has a plurality of first inner edges defining the second openings, each of the first bends comprising: a first sub-bend, located away from and substantially parallel to the first body; and a second sub-bend connected between the first sub-bend and a corresponding one of the first inner edges; wherein the second sub-bend extends abutting against that side of the metal structure.

6. The backlight module as claimed in claim 5, wherein the side of the metal structure has a plurality of second inner edges defining a third opening, the first sub-bend extending beyond one of the second inner edges, wherein the side of the metal structure further has a second bend extending to cover at least a portion of the third opening.

7. The backlight module as claimed in claim 5, wherein the first sub-bends extend relative to the first inner edges, wherein at least two of the first sub-bends extend at different lengths.

8. The backlight module as claimed in claim 1, wherein an air gap is separated between the side of the metal structure and the printed circuit board, and one of the distances of the air gap is between 2 mm and 5 mm.

9. The backlight module as claimed in claim 1, wherein the light strip structure further comprises: an insulating layer, wherein the positive electrode contact pad and the negative electrode heat sink are sandwiched between the printed circuit board and the insulating layer.

10. The backlight module as claimed in claim 1, wherein the negative heat sink is made of a material with a thermal conductivity greater than 150 watts per meter kelvin (W / mK).

11. A backlight module comprising: at least one light strip structure disposed on one side of a metal structure, the at least one light strip structure comprising: a printed circuit board having a plurality of first openings; a contact pad disposed on the printed circuit board; a heat sink disposed on the printed circuit board and having a plurality of first bends, the first bends at least partially passing through the first openings and contacting the side of the metal structure; and a plurality of light sources respectively directly contacting the heat sink and the contact pad; wherein the side of the metal structure has a plurality of second bends, the first bends partially extending below the second bends.

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