Cooling device
TW202637986APending Publication Date: 2026-09-16NIDEC CORP(JP)
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW115107925
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-07
- Filing Date
- 2026-03-04
- Publication Date
- 2026-09-16
Smart Images
Figure 00000000_0000_ABST
Abstract
This invention provides a cooling device capable of suppressing stress concentration at the junction of a flow tube and a connector. An exemplary embodiment of the cooling device includes a connector, a flow tube, and a first protective member. The connector includes a connector body and a first protrusion. The connector body has an internal flow path. The first protrusion protrudes from the connector body, has an internal flow path, and is fluidly connected to the connector body. The flow tube engages with the first protrusion and is fluidly connected to the connector. The first protective member covers the outer peripheral surface of the junction between the first protrusion and the flow tube.
Need to check novelty before this filing date? Find Prior Art