Electronic device and heat dissipation assembly

Abstract

An electronic device includes a heat dissipation assembly and at least one hard disk. The heat dissipation assembly includes a vapor chamber and a plurality of thermally conducting structures. Each of the plurality of thermally conducting structures includes a thermally conducting plate. The plurality of thermally conducting plates are thermally coupled to the vapor chamber, and are arranged side by side on two opposite sides of the vapor chamber to form a plurality of heat dissipation spaces. The at least one hard disk is located in one of the heat dissipation spaces, and is thermally coupled to one of the thermally conducting plates. The extension direction of the thermally conducting plates is perpendicular to the extension direction of the vapor chamber.

Images