Apparatus and method for optically inspecting and removing micro LED on substrate

Abstract

A apparatus for optically inspecting and removing a micro LED on a substrate is provided, which is used to remove at least one defective chip among a plurality of micro LEDs on the substrate. The apparatus comprises an image recognition module, a laser source, and a carrier platform. The image recognition module recognizes the plurality of micro LEDs to generate a chip map, wherein the chip map comprises the location of the at least one defective chip. The laser source generates a laser ray. The carrier platform moves the substrate according the chip map to align the at least one defective chip with the laser ray so that the at least one defective chip is removed from the substrate. The carrier platform moves the substrate to the image recognition module so as to capture a dumped image at the location of the at least one defective chip and confirm the content of the dumped image.

Claims

1. An apparatus for optically detecting and removing micro-light-emitting diodes (LEDs) on a substrate, for removing at least one defective chip from a plurality of micro-LEDs on a carrier substrate, comprising: an image recognition module for identifying the plurality of micro-LEDs to generate a chip positioning map, wherein the chip positioning map includes the position of the at least one defective chip; a laser source disposed on an opposite side relative to the carrier substrate and the plurality of micro-LEDs, generating laser light and focusing it on a release layer of the carrier substrate; and a carrier platform for moving the carrier substrate according to the chip positioning map, aligning the at least one defective chip with the laser light, thereby removing the at least one defective chip from the focused release layer; wherein the movement of the carrier platform on the carrier substrate enables the image recognition module to capture a removed image of the position of the at least one defective chip and to confirm the content of the removed image.

2. The apparatus for optically detecting and removing micro light-emitting diodes on a substrate as claimed in claim 1, wherein the image recognition module comprises: a first image capturing unit disposed on the same side relative to the carrier platform and the laser source; and a second image capturing unit disposed on the opposite side relative to the carrier platform and the laser source.

3. The apparatus for optically inspecting and removing micro-light-emitting diodes on a substrate as described in claim 2, wherein the first image capturing unit is configured to capture a plurality of inspection images of the plurality of micro-light-emitting diodes, and the second image capturing unit is configured to capture the removed image at the location of the defective wafer.

4. The apparatus for optically inspecting and removing micro light-emitting diodes on a substrate as described in claim 3, wherein the first image capturing unit identifies the at least one defective wafer and generates a wafer positioning map based on the plurality of inspected images.

5. The apparatus for optically detecting and removing micro light-emitting diodes on a substrate as described in claim 4, wherein the second image capturing unit updates the chip positioning map after confirming the content of the removed image.

6. The apparatus for optically detecting and removing micro light-emitting diodes on a substrate as described in claim 5, wherein the first image capturing unit and the second image capturing unit are a visible light camera, a short-wave infrared camera, or a thermal imaging camera.

7. A method for optically detecting and removing micro-light-emitting diodes (LEDs) on a substrate, for removing at least one defective wafer from a plurality of micro-LEDs on a carrier substrate, comprising: identifying the plurality of micro-LEDs to generate a wafer positioning map, wherein the wafer positioning map includes the position of the at least one defective wafer; moving the carrier substrate according to the wafer positioning map, aligning the at least one defective wafer with a laser beam, and focusing the laser beam on a release layer of the carrier substrate, thereby removing the at least one defective wafer from the release layer which has lost adhesion due to focusing, wherein the laser beam originates from a side opposite to the carrier substrate and the plurality of micro-LEDs; moving the carrier substrate to capture a removal image of the position of the at least one defective wafer, and confirming the content of the removal image; and if the content indicates that the at least one defective wafer has not been successfully removed, returning to and performing the step of removing the at least one defective wafer.

8. The method for optically inspecting and removing micro-light-emitting diodes on a substrate as described in claim 7, wherein the identification step further comprises: capturing a plurality of inspection images of the plurality of micro-light-emitting diodes to identify the at least one defective wafer and generating a wafer positioning map.

9. The method for optically inspecting and removing micro-light-emitting diodes on a substrate as described in claim 8, wherein the identification step uses an artificial intelligence machine model to identify and confirm the pattern of the defect.

10. The method for optically detecting and removing micro-light-emitting diodes on a substrate as described in claim 9, wherein the step of confirming the content of the removed image is to use an artificial intelligence machine model to identify and confirm the pattern of the content.

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