High-low temperature testing system and method

Abstract

This invention provides a compact high-low temperature testing system designed to enhance testing efficiency while avoiding frequent movement of chips. The invention comprises a testing base, a heating device, and a cooling device. The testing base is used to secure the chip under test. The heating device includes a heating plate that utilizes thin-film heating technology to supply thermal energy for heating the chip to the temperature required for high-temperature testing. The cooling device consists of a cooling plate, a compressor, and a refrigerant circulation unit, which effectively absorbs thermal energy through refrigerant circulation to cool the chip to the required low-temperature testing conditions. The heating plate and cooling plate are vertically connected and achieve high-low temperature switching by alternately activating and deactivating their functions, reducing the need for frequent chip relocation. This invention not only improves testing efficiency but also reduces space requirements. Moreover, by maintaining a stable testing environment, it enhances the accuracy of test results, making it suitable for high-precision and high-performance chip testing applications.

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