Semiconductor testing method

Abstract

A semiconductor testing method is provided. The method includes: extending a probe of a probe card assembly to contact an electrical bump of an integrated circuit (IC) die, the IC die including a silicon photonic element thereon; extending an optical fiber of the probe card assembly to contact the silicon photonic element; and performing an electrooptical test on the IC die by a test head in electrical communication with the probe card assembly, including: transmitting a first test signal from the test head to the electrical bump via the probe, the first test signal being an electrical test signal; transmitting a second test signal via the probe card assembly to the silicon photonic element, the second test signal being an optical test signal.

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