Optical packaging module and manufacturing method thereof

TW202638091APending Publication Date: 2026-09-16SILICONWARE PRECISION IND CO LTD
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Patent Information

Application Number
TW114109380
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-13
Publication Date
2026-09-16

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Abstract

The present invention provides an optical packaging module and its manufacturing method. It mainly places a photonic component on an electronic module containing electronic components and electrically connects the photonic component to the electronic component to process optical signals. At the same time, an electromagnetic shielding layer covering the photonic component is formed on the electronic module. The electromagnetic shielding layer is filled with a plurality of magnetic metal particles so that the photonic component has anti-electromagnetic wave function.
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