Assembly comprising opto-electronic components for data transfer and method for producing the same
TW202638096APending Publication Date: 2026-09-16BLACK SEMICON GMBH
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Patent Information
- Application Number
- TW114142667
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-04
- Filing Date
- 2025-11-03
- Publication Date
- 2026-09-16
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Figure TWG2TA001076384_001 
Figure TWG2TA001076384_002 
Figure TWG2TA001076384_003
Abstract
An assembly comprising a. a first sub-assembly comprising i. a first layer of a first kind comprising a first plurality of electronic components; ii. a first plurality of waveguides; iii. a first plurality of opto-electronic components that are adapted and arranged to modify electromagnetic waves propagating in a first longitudinal portion of at least one waveguide, of the first plurality of waveguides; iv. a first plurality of connectors, wherein A. at least one connector, of the first plurality of connectors, is adapted and arranged to electrically connect at least one electronic component with at least one opto-electronic component; wherein an average minimum distance FX between the first longitudinal portions and the first plurality of connectors is in the range from
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