Assembly comprising opto-electronic components for data transfer and method for producing the same

TW202638096APending Publication Date: 2026-09-16BLACK SEMICON GMBH
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Patent Information

Application Number
TW114142667
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-04
Filing Date
2025-11-03
Publication Date
2026-09-16

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    Figure TWG2TA001076384_003
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Abstract

An assembly comprising a. a first sub-assembly comprising i. a first layer of a first kind comprising a first plurality of electronic components; ii. a first plurality of waveguides; iii. a first plurality of opto-electronic components that are adapted and arranged to modify electromagnetic waves propagating in a first longitudinal portion of at least one waveguide, of the first plurality of waveguides; iv. a first plurality of connectors, wherein A. at least one connector, of the first plurality of connectors, is adapted and arranged to electrically connect at least one electronic component with at least one opto-electronic component; wherein an average minimum distance FX between the first longitudinal portions and the first plurality of connectors is in the range from
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