Techniques to prevent underfill interference in photonic fiber couplers

TW202638103APending Publication Date: 2026-09-16LIGHTMATTER INC
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114144349
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-13
Filing Date
2025-11-13
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001076423_001
    Figure TWG2TA001076423_001
  • Figure TWG2TA001076423_002
    Figure TWG2TA001076423_002
  • Figure TWG2TA001076423_003
    Figure TWG2TA001076423_003
Patent Text Reader

Abstract

Described herein are robust fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides defined near an edge of a PIC and corresponding optical fibers, thereby facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by minimizing damage associated with die-sawing processes, reducing surface roughness and preventing underfill intrusion into the edge coupling region.
Need to check novelty before this filing date? Find Prior Art