Photonic package device and photonic package system
TW202638108APending Publication Date: 2026-09-16SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- TW115106926
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-08-29
- Filing Date
- 2026-02-25
- Publication Date
- 2026-09-16
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Figure TWG2TA001077233_001 
Figure TWG2TA001077233_002 
Figure TWG2TA001077233_003
Abstract
Disclosed herein are methods, devices and systems including a substrate supporting one or more processing units and one or more optical engines, the substrate coupling the one or more processing units and the one or more optical engines. The one or more optical engines include a first near compute device and a first bi-directional optical coupler, and the one or more optical engines may convert an incoming optical signal received by the first bi-directional optical coupler to an electrical signal, and the one or more optical engines may route the electrical signal to the first near compute device or the one or more processing units via the one or more optical engines.
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