Heat dissipation device and server

Abstract

The invention relates to a heat dissipation device and a server. A first side has a cooling recess, and is configured to be connected to a component to be heat-dissipated. The second side has a first communicating hole and a second communicating hole. The first communicating hole and the second communicating hole are both in fluid communication with the cooling recess. A mounting component is assembled with the second side. A side of the mounting component facing a cover has a first liquid cooling recess and a second liquid cooling recess. The first liquid cooling recess and the second side are surrounded and form a first liquid cooling chamber. The second liquid cooling recess and the second side are surrounded and form a second liquid cooling chamber. The first liquid cooling chamber is in fluid communication with the first communicating hole. The second liquid cooling chamber is in fluid communication with the second communicating hole. The mounting component further has a first infusion port and a second infusion port. The first infusion port is in fluid communication with the first liquid cooling chamber. The second infusion port is in fluid communication with the second liquid cooling chamber. A cooling component is assembled with the first side. The cooling component and the cooling recess are surrounded and form a cooling chamber. At least two of the projection of the cooling chamber toward the component to be heat-dissipated, the projection of the first liquid cooling chamber toward the component to be heat-dissipated and the projection of the second liquid cooling chamber toward the component to be heat-dissipated are misaligned.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a server. Prior Technology

[0002] With the development of AI technology, the power consumption of GPU chips is increasing, leading to greater heat generation. Traditionally, a cold plate is used to dissipate heat from the GPU. However, traditional cold plates cannot effectively cool the high-heat areas of the GPU, resulting in poor heat dissipation and affecting the GPU's computing speed. Summary of the Invention

[0003] Therefore, it is necessary to provide a heat dissipation device and server to address the problem of poor GPU heat dissipation caused by traditional cold plates, which affects the GPU's computing speed.

[0004] The technical solution is as follows:

[0005] One embodiment provides a heat dissipation device, including:

[0006] The cover has a first side and a second side facing each other. The first side is provided with a cooling groove for connecting to the component to be cooled. The second side is provided with a first connecting hole and a second connecting hole, both of which are connected to the cooling groove.

[0007] The mounting component is assembled with the second side. The mounting component has a first liquid cooling tank and a second liquid cooling tank on the side facing the cover. The first liquid cooling tank and the second side surround each other to form a first liquid cooling cavity, and the second liquid cooling tank and the second side surround each other to form a second liquid cooling cavity. The first liquid cooling cavity communicates with the first communicating hole, and the second liquid cooling cavity communicates with the second communicating hole. The mounting component also has a first inlet and a second inlet, the first inlet communicating with the first liquid cooling cavity and the second inlet communicating with the second liquid cooling cavity.

[0008] A cooling component, which is assembled with the first side, and the cooling component and the cooling tank surround to form a cooling cavity, wherein at least two of the projections of the cooling cavity toward the component to be scaldredged, the projections of the first liquid cooling cavity toward the component to be scaldredged, and the projections of the second liquid cooling cavity toward the component to be scaldredged are misaligned.

[0009] In the aforementioned heat dissipation device, a cooling tank is located on the first side of the cover, and a cooling component covers the cooling tank to form a cooling cavity on the first side. The second side of the cover covers the first liquid cooling tank and the second liquid cooling tank, thereby forming the first liquid cooling cavity and the second liquid cooling cavity on the second side. Coolant enters the first liquid cooling cavity from the first inlet and then enters the cooling cavity through the first connecting hole, subsequently enters the second cooling cavity through the second connecting hole, and finally exits through the second inlet. When the first side of the cover is connected to the component to be scald, at least two of the projections of the cooling cavity, the first liquid cooling cavity, and the second liquid cooling cavity toward the component to be scald are misaligned, thus providing a more stable heat dissipation effect to the component to be scald. Furthermore, since the cooling cavity is located on the first side of the cover, the heat dissipation device can achieve more sufficient heat dissipation in the area of ​​the component to be scald corresponding to the cooling component. Compared with conventional technology, the aforementioned heat dissipation device can target the high-heat areas of the component to be scald, improve the heat dissipation effect of the component to be scald, and ensure that the component to be scald can be at a normal operating temperature and operate normally.

[0010] In one embodiment, the mounting component is provided with a first flow groove, which is connected to the first liquid cooling tank. The first flow groove and the second side are arranged to form a first flow channel. The first connecting hole is a strip-shaped through hole, the first direction of which matches the extension direction of the first flow channel, and the strip-shaped through hole is connected to the first flow channel.

[0011] In one embodiment, the mounting component is provided with a second flow groove, which is connected to the second liquid cooling tank. The second flow groove and the second side are arranged to form a second flow channel. The second connecting hole is a strip-shaped through hole, the second direction of which matches the extension direction of the second flow channel, and the strip-shaped through hole is connected to the second flow channel.

[0012] In one embodiment, the heat dissipation device further includes a first heat exchange structure, which is disposed in the first liquid cooling tank and abuts against the second side.

[0013] In one embodiment, the first heat exchange structure includes at least two first fin groups, all of which surround the outer periphery of the first infusion port.

[0014] In one embodiment, the first heat exchange structure further includes two first fin groups and a blocking member, wherein one of the first fin groups is spaced apart from the other to form a heat exchange channel, and the blocking member is located at at least one end of the heat exchange channel.

[0015] In one embodiment, the heat dissipation device further includes a second heat exchange structure, which is disposed in the second liquid cooling tank and abuts against the second side.

[0016] In one embodiment, the second heat exchange structure includes at least two second fin groups, all of which surround the outer periphery of the second infusion port.

[0017] In one embodiment, the cooling component includes a cooling plate and a toothed radiator, the cooling plate and the cooling groove forming the cooling cavity, and the toothed radiator is disposed on one side of the cooling plate and located inside the cooling cavity.

[0018] Another embodiment provides a server that includes a heat-dissipating component and a heat dissipation device as described above, the heat dissipation device being disposed on the heat-dissipating component. Simple Explanation of the Diagram

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort. Figure 1 is a schematic diagram of the installation of the heat dissipation device in one embodiment of the present invention. Figure 2 is an exploded view of the heat dissipation device in one embodiment of the present invention. Figure 3 is an exploded view of the heat dissipation device from another angle in one embodiment of the present invention. Figure 4 is a schematic diagram of the structure of the mounting component in one embodiment of the present invention. Figure 5 is a schematic diagram of the structure of the second side of the cover in another embodiment of the present invention. Figure 6 is a structural schematic diagram of the first side of the cover in another embodiment of the present invention. Figure 7 is a top view of the mounting component in another embodiment of the present invention. Figure 8 is a top view of the mounting component in another embodiment of the present invention. Implementation

[0020] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0021] In the description of this invention, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0022] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a mechanical connection or an electrical connection; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] In this invention, unless otherwise explicitly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact, or indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0025] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Where applicable, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only possible implementation.

[0026] Please refer to Figures 1 to 4. One embodiment of the present invention provides a heat dissipation device 10, including a cover 100, a mounting member 200, and a cooling member 300. The cover 100 has a first side 110 and a second side 120 facing each other. The first side 110 is provided with a cooling groove 111 for connecting with the component 20 to be cooled. The second side 120 is provided with a first connecting hole 121 and a second connecting hole 122, both of which communicate with the cooling groove 111. The mounting member 200 is assembled with the second side 120. The side of the mounting member 200 facing the cover 100 is provided with a first liquid cooling groove 210 and a second liquid cooling groove 220. The first liquid cooling groove 210 and the second side 120 surround each other to form a first liquid cooling cavity 211, and the second... The liquid cooling tank 220 and the second side 120 are arranged to form a second liquid cooling cavity 221. The first liquid cooling cavity 211 is connected to the first connecting hole 121, and the second liquid cooling cavity 221 is connected to the second connecting hole 122. The mounting component 200 is also provided with a first liquid inlet 231 and a second liquid inlet 232. The first liquid inlet 231 is connected to the first liquid cooling cavity 211, and the second liquid inlet 232 is connected to the second liquid cooling cavity 221. The cooling component 300 is assembled with the first side 110, and the cooling component 300 and the cooling tank 111 are arranged to form a cooling cavity 112. At least two of the projections of the cooling cavity 112 toward the heat-dissipating component 20, the projections of the first liquid cooling cavity 211 toward the heat-dissipating component 20, and the projections of the second liquid cooling cavity 221 toward the heat-dissipating component 20 are misaligned.

[0027] The aforementioned heat dissipation device 10 has a cooling tank 111 located on the first side 110 of the cover 100. A cooling component 300 covers the cooling tank 111 to form a cooling cavity 112 on the first side 110. The second side 120 of the cover 100 covers the first liquid cooling tank 210 and the second liquid cooling tank 220, thereby forming a first liquid cooling cavity 211 and a second liquid cooling cavity 221 on the second side 120. Coolant enters the first liquid cooling cavity 211 from the first inlet 231, and then enters the cooling cavity 112 through the first connecting hole 121. It then enters the second cooling cavity 112 through the second connecting hole 122, and finally exits through the second inlet 232. When the first side 110 of the cover 100 is in contact with the cooling component 210, the cooling tank 111 is positioned on the first side 110 of the cover 100. When connected to the 0-type heat sink, since at least two of the projections of the cooling chamber 112, the first liquid cooling chamber 211, and the second liquid cooling chamber 221 toward the heat sink 20 are misaligned, a more stable heat dissipation effect can be provided to the heat sink 20. In addition, since the cooling chamber 112 is located on the first side 110 of the cover 100, the heat dissipation device 10 can achieve more sufficient heat dissipation in the area of ​​the heat sink 20 corresponding to the cooling component 300. Compared with conventional technology, the above-mentioned heat dissipation device 10 can perform targeted heat dissipation in the high-heat area of ​​the heat sink 20, improve the heat dissipation effect of the heat sink 20, and ensure that the heat sink 20 can be at the normal operating temperature and operate normally.

[0028] As an explanation, since the cooling cavity 112 is located on the first side 110 of the cover 100, and the first liquid cooling cavity 211 and the second liquid cooling cavity 221 are located on the second side 120 of the cover 100, when the heat-dissipating component 20 is assembled with the first side 110 of the cover 100, the cooling cavity 112 is closer to the heat-dissipating component 20 than the first liquid cooling cavity 211 and the second liquid cooling cavity 221, thereby achieving more sufficient heat dissipation in the area of ​​the heat-dissipating component 20 corresponding to the cooling component 300.

[0029] As further explained, at least two of the projections of the cooling cavity 112 toward the heat-dissipating component 20, the projection of the first liquid cooling cavity 211 toward the heat-dissipating component 20, and the projection of the second liquid cooling cavity 221 toward the heat-dissipating component 20 are misaligned. This can mean that any two of the three projections partially overlap, or that all three projections are misaligned. The choice can be made flexibly according to the needs of the heat-dissipating component 20, and no specific limitation is made here.

[0030] Furthermore, the projections of the cooling cavity 112 toward the heat-dissipating component 20, the first liquid cooling cavity 211 toward the heat-dissipating component 20, and the second liquid cooling cavity 221 toward the heat-dissipating component 20 are misaligned, thereby providing a more reliable heat dissipation effect for the heat-dissipating component 20.

[0031] Please refer to Figures 2 and 3. In one embodiment, the heat sink 20 is provided with a first region 21, a second region 22, and a third region 23. The first region 21 is the projection area of ​​the first liquid cooling cavity 211 onto the heat sink 20, the second region 22 is the projection area of ​​the second liquid cooling cavity 221 onto the heat sink 20, and the third region 23 is the projection area of ​​the cooling cavity 112 onto the heat sink 20. The first region 21, the second region 22, and the third region 23 are misaligned. Typically, the third region 23 is the core heat-generating area of ​​the heat sink 20. For example, when the heat sink 20 is a GPU, the third region 23 is the area where the GPU chip is located. Another example is when the heat sink 20 is a computer motherboard. The area where the CPU chip is located; in the above embodiment, the cooling cavity 112 located on the first side 110 of the cover 100 is closer to the heat-dissipating component 20 than the first liquid cooling cavity 211 and the second liquid cooling cavity 221 located on the second side 120 of the cover 100. Therefore, when the coolant flows through the cooling cavity 112, it can fully dissipate heat from the core heat-generating area of ​​the heat-dissipating component 20, namely the third area 23. The heat generated by the first area 21 and the second area 22 of the heat-dissipating component 20 is smaller than that of the third area 23. Therefore, the first liquid cooling cavity 211 and the second liquid cooling cavity 221 located on the second side 120 of the cover 100 are used to dissipate heat from the first area 21 and the second area 22, respectively. The heat dissipation design is reasonable and the heat dissipation effect is better.

[0032] As a further explanation, since the amount of cold energy carried by the same flow rate of coolant is limited, in order to ensure that most of the cold energy carried by the coolant can be exchanged with the third region 23 of the heat-dissipating component 20, when the coolant enters the first liquid cooling chamber 211 through the first inlet 231, since the first liquid cooling chamber 211 is located on the second side 120 of the cover 100 and the heat generation of the first region 21 is relatively small, the heat exchange with the first region 21 when the coolant flows through the first liquid cooling chamber 211 is relatively small. This allows the coolant to still carry a high amount of cold energy when it enters the cooling chamber 112 after passing through the first liquid cooling chamber 211, ensuring that most of the cold energy in the coolant can be exchanged with the third region 23. Finally, the coolant enters the second liquid cooling chamber 221. At this time, the amount of cold energy carried by the coolant is greatly reduced, but since the heat generation of the second region 22 is relatively small, even if the amount of cold energy carried by the coolant in the second liquid cooling chamber 221 is small, it can still fully dissipate heat from the second region 22.

[0033] In one embodiment, the cooling element 300 is plate-shaped and can cover the cooling tank 111, thereby forming a cooling cavity 112 with the cooling tank 111. The side of the cooling element 300 away from the cooling tank 111 can contact the heat-dissipating component 20. The coolant in the cooling cavity 112 can exchange heat with the heat-dissipating component 20 through the cooling element 300, thereby achieving the cooling of the third region 23 of the heat-dissipating component 20.

[0034] In addition, the cover 100, the mounting component 200 and the cooling component 300 are set separately so that the cover 100, the mounting component 200 and the cooling component 300 can be produced separately in a modular manner during production, and then assembled after production is completed, thereby improving production efficiency and reducing production costs.

[0035] Referring to Figure 3, in one embodiment, the first infusion port 231 and the second infusion port 232 are located on the side of the mounting member 200 away from the cover 100.

[0036] Furthermore, there is no limit to the number of the first infusion port 231 and the second infusion port 232. They can be flexibly set according to the actual working conditions, and no specific limitation is made here.

[0037] Optionally, in some embodiments, the first infusion port 231 can be either an inlet or an outlet, and correspondingly, the second infusion port 232 can be either an outlet or an inlet, which will not be elaborated here.

[0038] Please refer to Figures 1 to 3. In one embodiment, the mounting member 200 is plate-shaped to match the cover 100, which will not be described in detail here.

[0039] Please refer to Figures 2 to 4. In one embodiment, the mounting component 200 is provided with a first flow groove 240, which is connected to a first liquid cooling tank 210. The first flow groove 240 and the second side 120 are arranged to form a first flow channel 241. The first connecting hole 121 is a strip-shaped through hole, and the first direction of the strip-shaped through hole matches the extension direction of the first flow channel 241. The strip-shaped through hole is connected to the first flow channel 241.

[0040] The second side 120 of the cover 100 covers the first flow groove 240, thereby forming a first flow channel 241 on the second side 120. Thus, when the coolant enters the first flow channel 241, it can enter the cooling chamber 112 through the first connecting hole 121. The first direction of the first connecting hole 121 matches the extension direction of the first flow channel 241, thereby forming a strip-shaped through hole. This arrangement not only increases the speed of the coolant entering the cooling chamber 112 through the strip-shaped through hole from the first flow channel 241, but also improves the flow uniformity of the coolant entering the cooling chamber 112 through the strip-shaped through hole, thereby improving the heat dissipation effect of the coolant in the cooling chamber 112 on the heat sink 20.

[0041] For illustrative purposes, the first direction in the above embodiment is the length direction of the strip-shaped through hole (i.e., direction A in Figure 3).

[0042] Furthermore, the coolant enters the first flow channel 241 and flows within it to dissipate heat from the area on the heat-dissipating component 20 corresponding to the first flow channel 241. Therefore, when manufacturing the heat dissipation device 10, the designer will design the extension direction of the first flow channel 240 according to the heat-generating area of ​​the heat-dissipating component 20, thereby ensuring the heat dissipation effect of the coolant flowing within the first flow channel 241 on the heat-dissipating component 20.

[0043] Please refer to Figures 2 to 4. In one embodiment, the mounting component 200 is provided with a second flow groove 250, which is connected to the second liquid cooling tank 220. The second flow groove 250 and the second side 120 surround each other to form a second flow channel 251. The second connecting hole 122 is a strip-shaped through hole, and the second direction of the strip-shaped through hole matches the extension direction of the second flow channel 251. The strip-shaped through hole is connected to the second flow channel 251.

[0044] The second side 120 of the cover 100 covers the second flow groove 250, thereby forming a second flow channel 251 on the second side 120. In this way, the coolant in the cooling chamber 112 can enter the second flow channel 251 through the second connecting hole 122 and enter the second liquid cooling chamber 221 from the second flow channel 251. The second direction of the second connecting hole 122 matches the extension direction of the second flow channel 251, thereby forming a strip-shaped through hole. This arrangement can not only increase the speed of the coolant entering the second liquid cooling chamber 221 from the second flow channel 251 through the strip-shaped through hole, but also improve the flow uniformity of the coolant entering the second liquid cooling chamber 221 from the strip-shaped through hole, thereby improving the heat dissipation effect of the coolant flowing in the second liquid cooling chamber 221 on the heat sink 20.

[0045] For illustrative purposes, the second direction in the above embodiment is the length direction of the strip-shaped through hole (i.e., direction B in Figure 3).

[0046] Furthermore, the coolant enters the second flow channel 251 and flows within it to dissipate heat from the area on the heat-dissipating component 20 corresponding to the second flow channel 251. Therefore, when manufacturing the heat dissipation device 10, the designer will design the extension direction of the second flow channel 250 according to the heat-generating area of ​​the heat-dissipating component 20, thereby ensuring the heat dissipation effect of the coolant flowing within the second flow channel 251 on the heat-dissipating component 20.

[0047] Please refer to Figures 2 to 4. In one embodiment, the first flow channel 240 is provided with at least two channels, and the first connecting hole 121 is provided with at least two channels and is configured to correspond one-to-one with the first flow channel 240.

[0048] Please refer to Figures 2 to 4. In one embodiment, the second flow channel 250 is provided with at least two lines, and the second connecting hole 122 is provided with at least two lines and is configured to correspond one-to-one with the second flow channel 250.

[0049] Further, referring to Figures 2 to 4, in one embodiment, a first flow channel 240 is provided, and two second flow channels 250 are provided. The first flow channel 240 is located between the two second flow channels 250. Correspondingly, a first connecting hole 121 is provided and is arranged corresponding to the first flow channel 240, and two second connecting holes 122 are provided and are arranged one-to-one with the two second flow channels 250. The two second connecting holes 122 are respectively located on both sides of the first connecting hole 121. In this way, the coolant enters the liquid cooling cavity through the first connecting hole 121 and flows out of the liquid cooling cavity through the second connecting holes 122 on both sides of the first connecting hole 121. Under the premise that the total flow rate of the coolant remains unchanged, the flow area of ​​the coolant flowing in from one first connecting hole 121 is smaller. Therefore, the flow velocity of the coolant flowing into the liquid cooling cavity is greater, the Reynolds number increases, the Nusselt number increases, and the convective heat transfer coefficient also increases accordingly. This makes the heat dissipation device 10 have a better heat dissipation effect on the position of the heat sink 20 corresponding to the liquid cooling cavity.

[0050] Furthermore, two second flow channels 250 are respectively disposed on both sides of the first flow channel 240 to dissipate heat in the corner areas of the heat sink 20, thereby ensuring the heat dissipation effect of the heat sink 20.

[0051] Please refer to FIGS. 7 to 8. In one embodiment, a first flow dividing portion 212 is provided in the first liquid cooling tank 210. The arrangement of the first flow dividing portion 212 can divide the space in the first liquid cooling tank 210 into multiple branches, making the flow process of the cooling liquid in the first liquid cooling cavity 211 more complex. The cooling liquids in each branch collide with each other, making the flow more intense, thereby increasing the local Reynolds number and further enhancing the heat exchange effect.

[0052] Please refer to FIGS. 7 to 8. In one embodiment, a second flow dividing portion 222 is provided in the second liquid cooling tank 220. The effect of the second flow dividing portion 222 is similar to that of the first flow dividing portion 212, and details will not be described here again.

[0053] Further, in the embodiment shown in FIG. 8, the first flow dividing portion 212 can divide the space in the first liquid cooling tank 210 into branches in a "field" shape. The cooling liquids in the branches collide with each other, further enhancing the heat exchange effect; the second flow dividing portion 222 can divide the space in the second liquid cooling tank 220 into branches in a "field" shape. Similar to the first flow dividing portion 212, details will not be described here again.

[0054] Please refer to FIGS. 5 to 6. In one embodiment, there are multiple first through holes 121 and multiple second through holes 122. All the first through holes 121 and all the second through holes 122 together form a hole array structure. Thus, when the extending directions of the first liquid cooling tank 210 and the second liquid cooling tank 220 change, the hole array structure formed by the combination of the first through holes 121 and the second through holes 122 does not need to change, thereby realizing the unified and standardized production of the cover body 100 and reducing the production cost.

[0055] Please refer to FIGS. 2 and 4. In one embodiment, the heat dissipation device 10 further includes a first heat exchange structure 400. The first heat exchange structure 400 is disposed in the first liquid cooling tank 210 and abuts against the second side 120.

[0056] The first heat exchange structure 400 can exchange heat with the cooling liquid in the first liquid cooling cavity 211. The first heat exchange structure 400 abuts against the second side 120, thereby realizing heat exchange with the second side 120 of the cover body 100, and further realizing heat exchange between the cooling liquid and the second side 120 of the cover body 100, improving the heat exchange effect between the cooling liquid and the first region 21 of the heat dissipation part 20.

[0057] Optionally, the first heat exchange structure 400 can be a heat exchange fin, a heat exchange tooth or other structures that can increase the heat exchange area with the cooling liquid, and specific limitations are not made here.

[0058] Furthermore, the first heat exchange structure 400 can block and divert the coolant to a certain extent, thereby further enhancing the heat exchange effect of the coolant.

[0059] Referring to Figure 4, in one embodiment, the first heat exchange structure 400 includes at least two first fin groups 410, all of which surround the outer periphery of the first infusion port 231.

[0060] With this configuration, when the coolant enters the first liquid cooling tank 210 through the first inlet 231, it can pass through the first fin group 410, thereby enabling the coolant to exchange heat fully with the first fin group 410, ensuring the cooling effect of the coolant in the first liquid cooling chamber 211 on the first area 21 of the heat sink 20.

[0061] Optionally, the two adjacent first fin groups 410 can be spaced apart along the width direction of the mounting member 200 or along the length direction of the mounting member 200; no specific limitation is made here.

[0062] Furthermore, the first fin group 410 includes at least two first fins. In some embodiments, two adjacent first fin groups 410 are spaced apart along the width direction of the mounting member 200, and all the first fins are spaced apart along the length direction of the mounting member 200. In other embodiments, two adjacent first fin groups 410 are spaced apart along the length direction of the mounting member 200, and all the first fins are spaced apart along the width direction of the mounting member 200.

[0063] Referring to Figure 4, in one embodiment, the first heat exchange structure 400 further includes two first fin groups 410 and a baffle 420, wherein one first fin group 410 is spaced apart from the other first fin group 410 to form a heat exchange channel 430, and the baffle 420 is located at at least one end of the heat exchange channel 430.

[0064] Coolant enters heat exchange channel 430 through first connecting hole 121. A blocking member 420 disposed at at least one end of heat exchange channel 430 can block the coolant, preventing the coolant from flowing out directly from heat exchange channel 430, ensuring that the coolant can fully exchange heat with first fin group 410, thereby further enhancing the heat exchange effect between the coolant in first liquid cooling tank 210 and the heat dissipation component 20.

[0065] Further, referring to Figure 4, in one embodiment, one end of the heat exchange channel 430 is disposed toward the first flow groove 240, and the blocking member 420 is located between one end of the heat exchange channel 430 and the first flow groove 240, thereby preventing the coolant entering the heat exchange channel 430 from the first connecting hole 121 from directly entering the first flow channel 241, ensuring that the coolant can fully exchange heat with the first fin assembly 410.

[0066] In other embodiments, two blocking members 420 are provided, and the two blocking members 420 are respectively provided at opposite ends of the heat exchange channel 430, thereby preventing the coolant entering the heat exchange channel 430 from the first connecting hole 121 from not fully exchanging heat with the first fin group 410.

[0067] Please refer to Figures 2 and 4. In one embodiment, the heat dissipation device 10 further includes a second heat exchange structure 500, which is disposed in the second liquid cooling tank 220 and abuts against the second side 120.

[0068] The second heat exchange structure 500 can exchange heat with the coolant in the second liquid cooling cavity 221. The second heat exchange structure 500 abuts against the second side 120, thereby realizing heat exchange with the second side 120 of the cover 100, and thus realizing heat exchange between the coolant and the second side 120 of the cover 100, improving the heat exchange effect between the coolant and the second area 22 of the heat dissipation component 20.

[0069] Optionally, the second heat exchange structure 500 can be a structure such as heat exchange fins or heat exchange teeth that can increase the heat exchange area with the coolant; no specific limitation is made here.

[0070] Furthermore, the second heat exchange structure 500 can block and divert the coolant to a certain extent, thereby further enhancing the heat exchange effect of the coolant.

[0071] Referring to Figure 4, in one embodiment, the second heat exchange structure 500 includes at least two second fin groups 510, all of which surround the outer periphery of the second inlet 232.

[0072] With this configuration, when the coolant needs to be discharged from the second liquid cooling chamber 221 through the second inlet 232, it needs to pass through the second fin assembly 510, thereby achieving sufficient heat exchange with the second fin assembly 510 and ensuring the heat dissipation effect of the coolant in the second liquid cooling chamber 221 on the second area 22 of the heat sink 20.

[0073] Optionally, two adjacent second fin groups 510 can be spaced apart along the width direction of the mounting member 200 or along the length direction of the mounting member 200; no specific limitation is made here.

[0074] Furthermore, in the embodiment shown in Figure 4, two second fin groups 510 are provided and spaced apart along the width direction of the mounting member 200. Two second flow channels 250 are provided, one of which is located on the side of one second fin group 510 away from the second liquid inlet 232, and the other is located on the side of the other second fin group 510 away from the second liquid inlet 232. In this way, when the coolant in the cooling chamber 112 flows to the second liquid cooling chamber 221 through the two second flow channels 251, it will pass through the two second fin groups 510 and then flow out from the second liquid inlet 232, ensuring sufficient heat exchange between the coolant and the second fin groups 510.

[0075] Furthermore, the second fin group 510 includes at least two second fins. In some embodiments, two adjacent second fin groups 510 are spaced apart along the width direction of the mounting member 200, and all the second fins are spaced apart along the length direction of the mounting member 200. In other embodiments, the second fin groups 510 are spaced apart along the length direction of the mounting member 200, and all the second fins are spaced apart along the width direction of the mounting member 200.

[0076] Please refer to Figure 3. In one embodiment, the cooling component 300 includes a cooling plate 310 and a toothed radiator 320. The cooling plate 310 and the cooling groove 111 surround to form a cooling cavity 112. The toothed radiator 320 is disposed on one side of the cooling plate 310 and located in the cooling cavity 112.

[0077] The shovel-tooth radiator 320 can increase the heat exchange area between the coolant and the cooling plate 310, improve the heat exchange efficiency between the coolant and the heat-dissipating component 20, and ensure the heat dissipation effect of the heat dissipation device 10 on the heat-dissipating component 20.

[0078] Another embodiment of the present invention provides a server, the server including a heat-dissipating component 20 and a heat dissipation device 10 of any of the above embodiments, the heat dissipation device 10 being disposed on the heat-dissipating component 20.

[0079] In the aforementioned server, a cooling tank 111 is located on the first side 110 of the cover 100. A cooling component 300 covers the cooling tank 111 to form a cooling cavity 112 on the first side 110. The second side 120 of the cover 100 covers the first liquid cooling tank 210 and the second liquid cooling tank 220, thereby forming the first liquid cooling cavity 211 and the second liquid cooling cavity 221 on the second side 120. Coolant enters the first liquid cooling cavity 211 from the first inlet 231, and then enters the cooling cavity 112 through the first connecting hole 121. Subsequently, it enters the second cooling cavity 112 through the second connecting hole 122, and finally exits through the second inlet 232. When the first side 110 of the cover 100 is in contact with the component 200 to be cooled, the cooling tank 111 is cooled. During connection, since at least two of the projections of the cooling chamber 112, the first liquid cooling chamber 211, and the second liquid cooling chamber 221 toward the heat-dissipating component 20 are misaligned, a more stable heat dissipation effect can be provided to the heat-dissipating component 20. In addition, since the cooling chamber 112 is located on the first side 110 of the cover 100, the heat dissipation device 10 can achieve more sufficient heat dissipation in the area of ​​the heat-dissipating component 20 corresponding to the cooling component 300. Compared with conventional technology, the above-mentioned heat dissipation device 10 can perform targeted heat dissipation in the high-heat area of ​​the heat-dissipating component 20, improve the heat dissipation effect of the heat-dissipating component 20, and ensure that the heat-dissipating component 20 can be at a normal operating temperature and operate normally.

[0080] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended patent application scope.

[0082] 10: Heat dissipation device 100: Cover 110: First side 111: Cooling tank 112: Cooling chamber 120: Second side 121: First connecting hole 122: Second connecting hole 200: Installation components 210: First Liquid Cooling Tank 211: First liquid cooling chamber 212: First branch section 220: Second liquid cooling tank 221: Second liquid cooling chamber 222: Second Diversion Section 231: First infusion port 232: Second infusion port 240: First flow channel 241: First flow channel 250: Second flow channel 251: Second flow channel 300: Cooling components 310: Cooling plate 320: Shovel-tooth radiator 400: First heat exchange structure 410: First fin group 420: Blocking component 430: Heat exchanger flow channel 500: Second heat exchange structure 510: Second fin group 20: Components to be cooled 21: Area 1 22: Second Zone 23: Third Zone

Claims

1. A heat dissipation device, characterized in that it comprises: A cover has a first side and a second side facing each other. The first side is provided with a cooling groove for connecting to a component to be cooled. The second side is provided with a first connecting hole and a second connecting hole, both of which are connected to the cooling groove. A mounting component is assembled with the second side. The mounting component has a first liquid cooling groove and a second liquid cooling groove on the side facing the cover. The first liquid cooling groove and the second side surround each other to form a first liquid cooling cavity. The second liquid cooling groove and the second side surround each other to form a second liquid cooling cavity. The first liquid cooling cavity is connected to the first connecting hole, and the second liquid cooling cavity is connected to the second connecting hole. The mounting component also has a first inlet and a second inlet. The first inlet is connected to the first liquid cooling cavity, and the second inlet is connected to the second liquid cooling cavity. A cooling component, which is assembled with the first side, and the cooling component and the cooling tank surround to form a cooling cavity, wherein at least two of the projections of the cooling cavity toward the component to be scaldredged, the projections of the first liquid cooling cavity toward the component to be scaldredged, and the projections of the second liquid cooling cavity toward the component to be scaldredged are misaligned.

2. The heat dissipation device as claimed in claim 1, wherein the mounting member is provided with a first flow groove, the first flow groove is connected to the first liquid cooling tank, the first flow groove and the second side are arranged to form a first flow channel, the first connecting hole is a strip-shaped through hole, the first direction of the strip-shaped through hole matches the extension direction of the first flow channel, and the strip-shaped through hole is connected to the first flow channel.

3. The heat dissipation device as claimed in claim 1, wherein the mounting member is provided with a second flow groove, the second flow groove is connected to the second liquid cooling tank, the second flow groove and the second side are arranged to form a second flow channel, the second connecting hole is a strip-shaped through hole, the second direction of the strip-shaped through hole matches the extension direction of the second flow channel, and the strip-shaped through hole is connected to the second flow channel.

4. The heat dissipation device as claimed in claim 1, wherein the heat dissipation device further includes a first heat exchange structure disposed in the first liquid cooling tank and abutting against the second side.

5. The heat dissipation device as claimed in claim 4, wherein the first heat exchange structure includes at least two first fin groups, all of which surround the outer periphery of the first infusion port.

6. The heat dissipation device as claimed in claim 4, wherein the first heat exchange structure further includes two first fin groups and a blocking member, wherein one of the first fin groups is spaced apart from the other to form a heat exchange channel, and the blocking member is located at at least one end of the heat exchange channel.

7. The heat dissipation device as claimed in claim 1, wherein the heat dissipation device further comprises a second heat exchange structure disposed in the second liquid cooling tank and abutting against the second side.

8. The heat dissipation device as claimed in claim 7, wherein the second heat exchange structure includes at least two second fin groups, all of which surround the outer periphery of the second inlet.

9. The heat dissipation device as claimed in claim 1, wherein the cooling element includes a cooling plate and a toothed radiator, the cooling plate and the cooling groove forming the cooling cavity, and the toothed radiator is disposed on one side of the cooling plate and located within the cooling cavity.

10. A server, characterized in that the server includes a heat-dissipating component and a heat dissipation device as described in any one of claims 1-9, the heat dissipation device being disposed on the heat-dissipating component.

Images