Electronic device

Abstract

An electronic device includes an immersion tank and at least one server. The at least one server includes a casing, a circuit board, at least one main heat source, at least one secondary heat source and at least one heat sink. The shell is vertically disposed in the immersion tank, and has a side plate. The circuit board is disposed on the side plate, and has a front surface and a back surface facing away from each other. The back surface faces the side plate. The at least one main heat source is disposed on the side surface. The at least one secondary heat source is disposed on the front surface. The heating amount of the at least one secondary heat source is less than the heating amount of the at least one main heat source. The at least one heat sink is disposed on the bottom plate, and is thermally coupled to the at least one main heat source.

Description

[Technical Field]

[0001] This invention relates to an electronic device, particularly a server whose main heat source is located on the back of a circuit board. [Previous Technology]

[0002] With the advent of the big data era and the continuous development of cloud technology, the requirements of various industries for high-performance servers are getting higher and higher, and the amount of data that needs to be processed by servers is getting bigger and bigger, which makes the heat flux density and heat generation of servers increase significantly. Therefore, the heat dissipation problem needs to be solved urgently.

[0003] Generally, servers can be cooled using liquid cooling systems. However, current cooling efficiency for high-power electronic components within servers is still insufficient, which can affect server operation. Therefore, improving the cooling efficiency for high-power electronic components within servers is one of the problems that researchers should solve. [Summary of the Invention]

[0004] The present invention provides an electronic device for improving the heat dissipation efficiency of a heat source within a server.

[0005] An embodiment of the present invention discloses an electronic device comprising an immersion tank and at least one server. The at least one server comprises a housing, a circuit board, at least one main heat source, at least one secondary heat source, and at least one heat sink. The housing is erected in the immersion tank and has a side panel. The circuit board is disposed on the side panel and has a front and a back facing each other. The back faces the side panel. At least one main heat source is disposed on the back. At least one secondary heat source is disposed on the front. The heat generated by the at least one secondary heat source is less than the heat generated by the at least one main heat source. At least one heat sink is disposed on the side panel and thermally coupled to the at least one main heat source.

[0006] In the electronic device according to the above embodiment, since the main heat sources and the secondary heat sources are respectively disposed on the back and front of the circuit board, the main heat sources can be kept away from the secondary heat sources to distinguish the heat dissipation areas dedicated to the main heat sources. Therefore, the main heat sources can have more space for heat dissipation, so as to avoid the heat generated by the main heat sources and the secondary heat sources from concentrating in one place and being difficult to dissipate. In this way, the heat dissipation efficiency of the main heat sources in the server can be improved.

[0007] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

Implementation Method

[0008] Please refer to Figures 1 to 4. Figure 1 is a side view of the electronic device according to an embodiment of the present invention. Figure 2 is a perspective view of the server of the electronic device of Figure 1. Figure 3 is an exploded view of the server of the electronic device of Figure 1. Figure 4 is a cross-sectional view of the server of the electronic device of Figure 1.

[0009] The electronic device 10 of this embodiment is applied, for example, to a single-phase immersion liquid cooling system and includes an immersion tank 20 and a plurality of servers 30. The immersion tank 20 is used to contain a cooling fluid (not shown). The cooling fluid is, for example, water or refrigerant. The servers 30 are arranged side by side, and each server 30 includes a housing 31, a tray 32, a circuit board 33, a plurality of main heat sources 34, a plurality of secondary heat sources 35, a plurality of secondary heat sources 36, and a plurality of heat sinks 37. The housing 31 is erected in the immersion tank 20 and is immersed in the cooling fluid. The housing 31 has a side plate 311. The tray 32 is disposed in the housing 31 and carries the circuit board 33. The circuit board 33 has a front side 331 and a back side 332 facing each other. The back side 332 faces the side plate 311.

[0010] The main heat sources 34 are, for example, CPU chips. The secondary heat sources 35 are, for example, electronic components such as VR MOS chips. The main heat sources 34 and the secondary heat sources 35 are disposed on the back side 332. The secondary heat sources 36 are, for example, low-power electronic components such as DIMMs, as well as, for example, taller capacitors and inductors, and are disposed on the front side 331. That is, the main heat sources 34, the secondary heat sources 35, and the secondary heat sources 36 are respectively disposed on opposite sides of the circuit board 33, that is, the main heat sources 34, the secondary heat sources 35, and the secondary heat sources 36 are layered, and the main heat sources 34 and the secondary heat sources 35 are located on the bottom side (lower layer) of the circuit board 33. The heat generated by the secondary heat sources 36 is less than the heat generated by the main heat sources 34. The heat sinks 37 are disposed on the side plate 311 and are thermally coupled to the main heat sources 34 and the secondary heat sources 35, respectively.

[0011] Please refer to Figures 5 and 6 together. Figure 5 is a three-dimensional schematic diagram of the heat sink of the electronic device in Figure 1. Figure 6 is a three-dimensional schematic diagram of the heat sink of the electronic device in Figure 1 without the thermally conductive substrate.

[0012] In detail, each heat sink 37 includes a thermally conductive substrate 371, a fin 372, a plurality of heat pipes 373, a plurality of first thermally conductive elements 374, and a plurality of second thermally conductive elements 375. The fins 372 and the heat pipes 373 are disposed on the thermally conductive substrate 371. The heat pipes 373 are disposed, for example, in layers on the thermally conductive substrate 371, but are not limited thereto. The tray 32 has a plurality of first clearance openings 321, 321A, and the thermally conductive substrate 371 has a plurality of second clearance openings 3711. The second clearance openings 3711 correspond to the first clearance openings 321 respectively. The main heat sources 34 pass through the first clearance openings 321 and the second clearance openings 3711 and are thermally coupled to the heat pipes 373.

[0013] In this embodiment, the thermally conductive substrate 371 has a plurality of protrusions 3712, and the secondary heat sources 35 pass through the first relief openings 321A and are thermally coupled to the protrusions 3712 respectively. Since the height of the secondary heat sources 35 is less than the height of the main heat sources 34, by providing the protrusions 3712, the heat sink 37 can be thermally coupled more tightly to the secondary heat sources 35.

[0014] The first thermally conductive element 374 is, for example, a thermally conductive interface material such as thermally conductive adhesive, and is thermally coupled between the main heat sources 34 and the heat pipes 373. The second thermally conductive element 375 is, for example, a thermally conductive pad, and is thermally coupled between the secondary heat sources 35 and the protrusions 3712.

[0015] The housing 31 has a fluid inlet 312 and a fluid outlet 313. The fluid inlet 312 is used to allow cooling fluid to flow into the housing 31 to dissipate heat from the main heat sources 34 and the secondary heat sources 36, while the fluid outlet 313 is used to allow cooling fluid to flow out of the housing 31.

[0016] In this embodiment, since the main heat sources 34 and the secondary heat sources 36 are respectively disposed on the back side 332 and the front side 331 of the circuit board 33, the main heat sources 34 can be moved away from the secondary heat sources 36 to distinguish the heat dissipation areas dedicated to the main heat sources 34. Therefore, the main heat sources 34 can have more space for heat dissipation, so as to avoid the heat generated by the main heat sources 34 and the secondary heat sources 36 from concentrating in one place and being difficult to dissipate. In this way, the heat dissipation efficiency of the main heat sources 34 in the server 30 can be improved.

[0017] In this embodiment, the server 30 may further include two flow limiting plates 38. The two flow limiting plates 38 are disposed between the fluid inlet 312 and the secondary heat sources 36. Specifically, one of the two flow limiting plates 38 is disposed on the housing 31 near the fluid inlet 312, and the other of the two flow limiting plates 38 is disposed on the front side 331 of the circuit board 33. The material of the flow limiting plates 38 is, for example, metal.

[0018] Each flow restrictor 38 has multiple flow restricting holes 381. These flow restricting holes 381 are used to limit the flow rate of cooling fluid through these secondary heat sources 36. In this way, a portion of the cooling fluid can be diverted to these primary heat sources 34. Since the heat dissipation capacity required by these primary heat sources 34 is higher than that required by these secondary heat sources 36, by setting the flow restrictor 38, a larger flow rate of cooling fluid can be allocated to these primary heat sources 34, thereby improving the heat dissipation capacity of these primary heat sources 34.

[0019] In this embodiment, the server 30 may also include multiple flow guides 39. These flow guides 39 are, for example, baffles and are disposed on the front side 331 of the circuit board 33. By providing these flow guides 39, the flow path of the cooling fluid can be blocked and changed to guide the cooling fluid to these secondary heat sources 36. In this way, heat dissipation from these secondary heat sources 36 can be more precise.

[0020] In this embodiment, the server 30 includes a tray 32, and the tray 32 carries the circuit board 33, but this is not a limitation. In other embodiments, the server may not include a tray, and the circuit board may be disposed, for example, on a side panel.

[0021] In this embodiment, the number of main heat source 34, secondary heat source 35, secondary heat source 36, first clearance port 321, 321A, second clearance port 3711, and radiator 37 is multiple, but not limited thereto. In other embodiments, the number of main heat source, secondary heat source, secondary heat source, first clearance port, second clearance port, and radiator may be only a single one.

[0022] In this embodiment, each heat sink 37 has multiple heat pipes 373, but this is not a limitation. In other embodiments, the number of heat pipes may be only a single one.

[0023] In this embodiment, each heat sink 37 includes a heat pipe 373, but is not limited thereto. In other embodiments, the heat pipe may be replaced with a vapor chamber.

[0024] In this embodiment, the number of protrusions 3712 in each heat sink 37 is multiple, but not limited thereto. In other embodiments, the number of protrusions may be only a single one, as long as the number of protrusions corresponds to the number of secondary heat sources.

[0025] In this embodiment, there are multiple first heat-conducting elements 374 and second heat-conducting elements 375, but this is not a limitation. In other embodiments, the number of first heat-conducting elements and second heat-conducting elements may be only a single one.

[0026] In this embodiment, there are two flow limiting plates 38, one of which is disposed on the housing 31 near the fluid inlet 312, and the other is disposed on the front side 331 of the circuit board 33, but this is not a limitation. In other embodiments, the number of flow limiting plates may be only one, and the flow limiting plate may be disposed on the housing near the fluid inlet or on the front side of the circuit board, or the number of flow limiting plates may be three or more.

[0027] According to the electronic device of the above embodiment, since the main heat sources and the secondary heat sources are respectively disposed on the back and front of the circuit board, the main heat sources can be kept away from the secondary heat sources to distinguish the heat dissipation areas dedicated to the main heat sources. Therefore, the main heat sources can have more space for heat dissipation, so as to avoid the heat generated by the main heat sources and the secondary heat sources from concentrating in one place and being difficult to dissipate. In this way, the heat dissipation efficiency of the main heat sources in the server can be improved.

[0028] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification. [Simplified Explanation of the Diagram]

[0029] Figure 1 is a side view of the electronic device according to an embodiment of the present invention. Figure 2 is a perspective view of the server of the electronic device of Figure 1. Figure 3 is an exploded view of the server of the electronic device of Figure 1. Figure 4 is a cross-sectional view of the server of the electronic device of Figure 1. Figure 5 is a perspective view of the heat sink of the electronic device of Figure 1. Figure 6 is a perspective view of the heat sink of the electronic device of Figure 1 without the thermally conductive substrate.

Claims

1. An electronic device comprising: an immersion tank; and at least one server comprising: a housing erected in the immersion tank and having a side panel; a circuit board disposed on the side panel and having a front side and a back side facing away from each other, the back side facing the side panel; at least one main heat source disposed on the back side; at least one secondary heat source disposed on the front side, wherein the heat generated by the at least one secondary heat source is less than the heat generated by the at least one main heat source; at least one heat sink disposed on the side panel and thermally coupled to the at least one main heat source; and a tray disposed within the housing and supporting the circuit board, the tray having at least one first clearance hole through which the at least one main heat source passes.

2. The electronic device as claimed in claim 1, wherein the at least one heat sink includes a thermally conductive substrate, a fin, and at least one heat pipe, the fin and the at least one heat pipe being disposed on the thermally conductive substrate, the thermally conductive substrate having a second clearance opening corresponding to the at least one first clearance hole, and the at least one main heat source passing through the second clearance opening and thermally coupled to the at least one heat pipe.

3. The electronic device as claimed in claim 2, wherein the at least one server further includes at least one heat source disposed on the back side, and the thermally conductive substrate has at least one protrusion to which the at least one heat source is thermally coupled.

4. The electronic device as claimed in claim 3, wherein the at least one heat sink further comprises at least one first heat conductor and at least one second heat conductor, the at least one first heat conductor being thermally coupled between the at least one main heat source and the at least one heat pipe, and the at least one second heat conductor being thermally coupled between the at least one secondary heat source and the at least one protrusion.

5. The electronic device as claimed in claim 1, wherein the housing further comprises a fluid inlet and a fluid outlet, the fluid inlet being for a cooling fluid to flow into the housing and the fluid outlet being for the cooling fluid to flow out of the housing.

6. The electronic device as claimed in claim 5, wherein the at least one server further includes a flow restrictor disposed between the fluid inlet and the at least one primary heat source, and having a plurality of flow restrictor orifices for restricting the flow rate of the cooling fluid through the at least one primary heat source.

7. The electronic device as claimed in claim 5, wherein the immersion tank has a bottom, the fluid inlet is close to the bottom, and the fluid outlet is away from the bottom.

8. The electronic device as claimed in claim 1, wherein the at least one server further includes at least one flow guide disposed on the front side to guide a cooling fluid to the at least one primary heat source.

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