Semiconductor device with air gap and support pattern

TW202638407APending Publication Date: 2026-09-16SAMSUNG ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114143796
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-13
Filing Date
2025-11-10
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001076405_001
    Figure TWG2TA001076405_001
  • Figure TWG2TA001076405_002
    Figure TWG2TA001076405_002
  • Figure TWG2TA001076405_003
    Figure TWG2TA001076405_003
Patent Text Reader

Abstract

A semiconductor device includes a bit line extending in a first direction, a word line extending in a second direction intersecting the first direction, a plurality of semiconductor patterns on the bit line and extending in a third direction orthogonal to the first direction and the second direction and spaced apart from each other, a plurality of connection structures respectively disposed on corresponding semiconductor patterns among the plurality of semiconductor patterns, a support pattern between the connection structures, and an air gap below the support pattern. Each of the connection structures comprises a storage node contact and a protection pattern in contact with a sidewall of the storage node contact. A level of a bottom surface of the protection pattern is higher than a level of a bottommost surface of the storage node contact.
Need to check novelty before this filing date? Find Prior Art