Semiconductor device with air gap and support pattern
TW202638407APending Publication Date: 2026-09-16SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- TW114143796
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-13
- Filing Date
- 2025-11-10
- Publication Date
- 2026-09-16
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Abstract
A semiconductor device includes a bit line extending in a first direction, a word line extending in a second direction intersecting the first direction, a plurality of semiconductor patterns on the bit line and extending in a third direction orthogonal to the first direction and the second direction and spaced apart from each other, a plurality of connection structures respectively disposed on corresponding semiconductor patterns among the plurality of semiconductor patterns, a support pattern between the connection structures, and an air gap below the support pattern. Each of the connection structures comprises a storage node contact and a protection pattern in contact with a sidewall of the storage node contact. A level of a bottom surface of the protection pattern is higher than a level of a bottommost surface of the storage node contact.
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