Surface mounting method for protective elements and protective elements

TW202638467APending Publication Date: 2026-09-16SCHOTT JAPAN CORP
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Patent Information

Application Number
TW115104921
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-21
Filing Date
2026-02-09
Publication Date
2026-09-16

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Abstract

The objective of this invention is to provide a surface-mount protective element that offers excellent quick-break performance and is easy to process. The solution comprises an insulating substrate, a plurality of electrodes spaced apart on one side of the insulating substrate, and a fusible element that is bonded to and electrically connected to each electrode. The fusible element has a bonding portion that bonds to each electrode and a fusible portion that connects to each electrode. The solidus temperature of the fusible element is lower than the reflow soldering temperature. The fusible element is configured to partially melt by reflow soldering, causing the fusible portion to neck.
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