Tbps data throughput at thz freq using chiplet architecture

Abstract

Transmitters, receivers, transceivers, transceiver arrays, and methods of use are described herein, including a transmitter comprising a carrier substrate comprising conductive pads, a client-side input comprising conductive traces disposed on the carrier substrate and operable to receive baseband signals and provide the baseband signals to the conductive pads, an interposer substrate abutting the carrier substrate and defining vias extending through the interposer substrate, a baseband transmitter circuit disposed on the interposer substrate and operable to receive the baseband signals from the conductive pads via the vias and generate intermediate signals, an up-conversion circuit operable to receive the intermediate signals from the baseband transmitter circuit and generate antenna feed signals having a frequency in a range between

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