Microwave irradiation apparatus, heating apparatus, semiconductor wafer grinding apparatus, retreaded tire manufacturing apparatus, heating method, semiconductor device manufacturing method, semiconductor wafer grinding method, and retreaded tire manufacturing method.

Abstract

A heating device capable of heating a localized area is provided. The heating device 1 includes: a microwave generator 10; a coaxial cable 20 for transmitting the generated microwaves; and a microwave irradiation device 30 for irradiating the transmitted microwaves. The microwave irradiation device 30 includes: an inner line 31; first and second outer lines 32 and 33, which are equally spaced on both sides of the inner line 31; and a connecting line 34, which connects to the ends of the first and second outer lines 32 and 33 that are opposite to the microwave inlet side, i.e., the front ends.

Images