Molded articles, wiring boards, manufacturing methods for molded articles, and manufacturing methods for wiring boards

Abstract

Issue: To provide a molded article that allows for greater design freedom. Solution: The molded article 10 includes: a film-like substrate 30 and a wiring layer 50 held on the substrate 30. The substrate 30 includes: a pair of molded portions 31A and 31B with a convex cross-sectional shape that hold the wiring layer 50 on the inside, and a connecting portion 32 that connects the pair of molded portions 31A and 31B. The substrate 30 is bent around the connecting portion 32 as the center, and the pair of molded portions 31A and 31B face each other.

Images