Wiring substrate and its manufacturing method

TW202638687APending Publication Date: 2026-09-16V TECH CO LTD
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Patent Information

Application Number
TW114151456
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-13
Filing Date
2025-12-26
Publication Date
2026-09-16

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Abstract

A wiring board has an insulating layer of resin material formed on the surface and the inside of a glass substrate. The periphery of the insulating layer in the surface direction is located further inward than the periphery of the glass substrate. The periphery of the glass substrate has an exposed area that exposes the surface and the inside of the glass substrate. This prevents cracks or scratches from spreading on the glass substrate, thereby ensuring a wiring board with sufficient manufacturing yield and durability.
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