Manufacturing method of multilayer wiring board

Abstract

This invention discloses a method for manufacturing a multilayer wiring board. The method comprises: a preparation step of preparing a wiring substrate having a stack of an organic insulating film and a metal film on the organic insulating film; a laser processing step of forming openings in the metal film of the wiring substrate using laser processing; and an etching step of etching the organic insulating film while using the metal film with the openings as a mask to form through-holes and trenches in the stack. In the laser processing step, a portion of the organic insulating film at a predetermined location forming the through-hole is removed to form a recess, while the predetermined location of the organic insulating film at the location forming the trench is not removed, or a recess with a depth dimension smaller than the recess formed at the predetermined location forming the through-hole is formed at the predetermined location of the trench. This allows for the manufacture of multilayer wiring boards with high productivity and low cost.

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