Hard disk module and serve

TW202638700AActive Publication Date: 2026-09-16INVENTEC CORP
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Patent Information

Application Number
TW114108168
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-05
Publication Date
2026-09-16
Estimated Expiration
2045-03-04

AI Technical Summary

Technical Problem

The airflow generated by fans in traditional servers cannot directly contact hard drives due to the presence of the backplane, leading to inadequate heat dissipation.

Method used

A hard disk module design that includes a heat sink with a first recess allowing electrical connection and a back plate with a second electrical connection part, enabling direct electrical connection and heat dissipation while using a liquid cooling cavity for enhanced heat removal.

Benefits of technology

Ensures effective heat dissipation and electrical connectivity between the hard drive and backplane, improving the thermal management of hard drives.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The present invention relates to a hard disk module and a server. A hard disk body is provided with a first electrical connection portion. A heat sink is connected to the hard disk body, and has a first side and a second side opposite to each other. The first side is disposed toward the hard disk body. The heat sink is provided with a first gap penetrating through the first side and the second side. The position of the first gap corresponds to the position of the first electrical connection portion. A backplane is located on the second side, and is provided with a second electrical connection portion. At least one of the second electrical connection portion and the first electrical connection portion is inserted through the first gap, so that the second electrical connection portion is electrically connected to the first electrical connection portion. Compared with the conventional technology, the hard disk module can ensure the electrical connection between the backplane and the hard disk body, and can also fully dissipate the heat generated by the hard disk body through the heat sink, thereby ensuring the heat dissipation effect.
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Description

[Technical Field]

[0001] This invention relates to the technical field of servers, and in particular to a hard disk module and a server. [Previous Technology]

[0002] A hard drive is a device used to store data in a server. The backplane connects to the hard drive through the interface on the hard drive for data transmission and power supply. As the power consumption of hard drives gradually increases, the heat generated by hard drives also increases. In traditional technology, fans are usually installed in the server chassis to dissipate heat from the hard drive through the airflow generated by the fans. However, due to the presence of the backplane, the airflow cannot directly contact the hard drive, thus affecting the heat dissipation effect of the hard drive. [Summary of the Invention]

[0003] Based on this, it is necessary to provide a hard disk module and server to address the problem that the airflow generated by the fan in traditional technology cannot directly contact the hard disk, thus affecting the heat dissipation effect of the hard disk.

[0004] The technical solution is as follows:

[0005] One embodiment provides a hard disk module, including:

[0006] A hard disk body, wherein the hard disk body is provided with a first electrical connection portion;

[0007] A heat sink, the heat sink being connected to the hard disk body and having a first side and a second side facing each other, the first side being disposed facing the hard disk body, the heat sink being having a first recess penetrating the first side and the second side, the position of the first recess corresponding to the position of the first electrical connection portion; and

[0008] Back plate, the back plate is located on the second side and is provided with a second electrical connection part, at least one of the second electrical connection part and the first electrical connection part is inserted through the first clearance opening so that the second electrical connection part is electrically connected to the first electrical connection part.

[0009] In the above-mentioned hard disk module, the heat sink is connected to the hard disk body and has a first side and a second side. The first side of the heat sink faces the hard disk body to achieve sufficient heat dissipation for the hard disk body. The first recess of the heat sink passes through the first side and the second side. The back plate is located on the second side of the heat sink and is provided with a second electrical connection part. The second electrical connection part and the first electrical connection part are electrically connected through the first recess, thereby realizing the electrical connection between the back plate and the hard disk body. Then, the second electrical connection part of the back plate enables the hard disk body to perform functions such as power supply and data transmission. Compared with the conventional technology, the above-mentioned hard disk module can ensure the electrical connection between the back plate and the hard disk body, and can also achieve sufficient heat dissipation for the hard disk body through the heat sink, thereby ensuring the heat dissipation effect.

[0010] In one embodiment, the heat sink has a liquid cooling cavity, and the second side is provided with a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are both connected to the liquid cooling cavity. The back plate is provided with a second clearance port and a third clearance port. The liquid inlet passes through the second clearance port, and the liquid outlet passes through the third clearance port.

[0011] In one embodiment, the hard disk body is provided with at least two, the first recess is provided with at least two and is arranged one-to-one with the hard disk body, and the second electrical connection part is provided with at least two and is arranged one-to-one with the hard disk body.

[0012] In one embodiment, the hard disk module further includes a mounting member having a communicating mounting cavity and a mounting port. The mounting cavity is used to mount the hard disk body. The first electrical connection portion is disposed facing the mounting port. The heat sink is disposed on the mounting member and located at the mounting port. The backplate is connected to the mounting member.

[0013] In one embodiment, the mounting member is provided with a first mounting portion, the heat sink is provided with a second mounting portion, the first mounting portion and the second mounting portion are assembled together, the mounting member is also provided with a third mounting portion, the back plate is provided with a fourth mounting portion, the third mounting portion is located on the second side, and the fourth mounting portion is assembled with the third mounting portion.

[0014] In one embodiment, the hard disk module further includes a first threaded component, the first mounting portion is provided with a first threaded hole, the second mounting portion is provided with a first through hole, and the first threaded component passes through the first through hole and is screwed to the first threaded hole.

[0015] In one embodiment, the hard disk module further includes a second threaded component, the third mounting portion is provided with a second threaded hole, the fourth mounting portion is provided with a second through hole, and the second threaded component passes through the second through hole and is screwed into the second threaded hole.

[0016] In one embodiment, the mounting component is further provided with a positioning hook, the back plate is provided with a strip-shaped through hole, the radial direction of the strip-shaped through hole extends along a first direction of the back plate, and the positioning hook is used to assemble with the strip-shaped through hole;

[0017] Wherein, when the hook belly of the positioning hook abuts against the wall of the strip-shaped through hole, the axis of the second screw hole is collinear with the axis of the second through hole;

[0018] Alternatively, the back plate is also provided with a positioning hook, the mounting member is provided with a strip-shaped through hole, the radial direction of the strip-shaped through hole extends along the second direction of the mounting member, and the positioning hook is used to assemble with the strip-shaped through hole;

[0019] Wherein the hook belly of the positioning hook abuts against the wall of the strip-shaped through hole, the axis of the second screw hole is collinear with the axis of the second through hole.

[0020] In one embodiment, the back panel is provided with an assembly through hole, the assembly through hole includes a first hole segment and a second hole segment, the first hole segment and the second hole segment are connected along a first direction of the back panel, the diameter of the first hole segment is smaller than the diameter of the second hole segment, the hard disk module also includes a limiting rod, one end of the limiting rod is provided on the mounting member, the other end of the limiting rod is provided with a limiting part, the limiting part can pass through the second hole segment, and the limiting rod can reciprocate between the first hole segment and the second hole segment;

[0021] Wherein, when the limiting rod passes through the first hole section, the limiting part abuts against the side of the back plate away from the heat sink, and the axis of the second screw hole is collinear with the axis of the second through hole.

[0022] Another embodiment provides a server including a chassis and a hard disk module as described in any of the above embodiments, the hard disk module being disposed within the chassis.

Implementation Method

[0023] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] In the description of the present invention, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0025] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0027] In this invention, unless otherwise explicitly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only possible implementation.

[0029] Please refer to Figures 1 to 6. An embodiment of the present invention provides a hard disk module, including a hard disk body 100, a heat sink 200, and a back plate 300. The hard disk body 100 is provided with a first electrical connection portion 110. The heat sink 200 is connected to the hard disk body 100 and has a first side 210 and a second side 220 opposite to each other. The first side 210 is disposed facing the hard disk body 100. The heat sink 200 is provided with a first recess 230 that penetrates the first side 210 and the second side 220. The position of the first recess 230 corresponds to the position of the first electrical connection portion 110. The back plate 300 is located on the second side 220 and is provided with a second electrical connection portion 310. At least one of the second electrical connection portion 310 and the first electrical connection portion 110 passes through the first recess 230 so that the second electrical connection portion 310 is electrically connected to the first electrical connection portion 110.

[0030] In the aforementioned hard disk module, the heat sink 200 is connected to the hard disk body 100 and has a first side 210 and a second side 220 facing each other. The first side 210 of the heat sink 200 faces the hard disk body 100 to achieve sufficient heat dissipation for the hard disk body 100. The first recess 230 of the heat sink 200 passes through the first side 210 and the second side 220. The back plate 300 is located on the second side 220 of the heat sink 200 and is provided with a second electrical connection part 310. The second electrical connection part 310 is connected to... The first electrical connection parts 110 are electrically connected through the first recess 230, thereby realizing the electrical connection between the back panel 300 and the hard disk body 100. Then, the second electrical connection part 310 of the back panel 300 enables the hard disk body 100 to perform functions such as power supply and data transmission. Compared with the conventional technology, the above-mentioned hard disk module can not only ensure the electrical connection between the back panel 300 and the hard disk body 100, but also fully dissipate heat from the hard disk body 100 through the heat sink 200, thereby ensuring the heat dissipation effect.

[0031] Optionally, the heat sink 200 can be a fan device used to drive the airflow in the vicinity to remove the heat of the hard disk body 100, or it can be a liquid cooling device with flowing coolant inside, without specific limitation here.

[0032] Please refer to Figures 4 to 6. In one embodiment, the back panel 300 has a third side and a fourth side. The third side is provided with a second electrical connection portion 310, and the fourth side is provided with a signal terminal 320 and a power terminal 330. The signal terminal 320 is used to connect a signal line, and the power terminal 330 is used to connect a power line. Both the signal terminal 320 and the power terminal 330 are electrically connected to the second electrical connection portion 310. Thus, when the second electrical connection portion 310 is electrically connected to the first electrical connection portion 110 of the hard disk body 100, data transmission and power supply to the hard disk body 100 can be performed through the signal terminal 320 and the power terminal 330, respectively.

[0033] Optionally, the second electrical connection part 310 can be inserted through the first clearance opening 230 and electrically connected to the first electrical connection part 110. The first electrical connection part 110 can also be inserted through the first clearance opening 230 and electrically connected to the second electrical connection part 310. In addition, the second electrical connection part 310 and the first electrical connection part 110 can be inserted through the first clearance opening 230 at the same time to realize the electrical connection between the two. No specific limitation is made here.

[0034] Further, please refer to Figures 3 and 6. The first electrical connection part 110 includes gold fingers, and the second electrical connection part 310 includes a connector that protrudes from the third side of the back plate 300. The connector can pass through the first recess 230 and be electrically connected to the gold fingers to realize the electrical connection between the back plate 300 and the hard disk body 100.

[0035] As a further explanation, in the conventional technology, the side of the hard disk body 100 with the first connection part (hereinafter referred to as the electrical connection side) is in close contact with the back plate 300, resulting in poor heat dissipation effect of the electrical connection side of the hard disk body 100. As the first electrical connection part 110 is a data transmission component, it usually generates a lot of heat, resulting in a lot of heat generation on the electrical connection side, which in turn leads to a high temperature on the electrical connection side. In the present invention, the heat sink 200 is disposed between the hard disk body 100 and the back plate 300, and the electrical connection between the back plate 300 and the hard disk body 100 is achieved by opening the first clearance opening 230. This not only allows the heat sink 200 to directly remove the heat from the electrical connection side of the hard disk body 100, but also facilitates the electrical connection between the back plate 300 and the hard disk body 100.

[0036] Please refer to Figures 7 and 8. In one embodiment, the heat sink 200 has a liquid cooling cavity. The second side 220 is provided with a liquid inlet 221 and a liquid outlet 222, both of which are in communication with the liquid cooling cavity. The back plate 300 is provided with a second clearance port 370 and a third clearance port 380. The liquid inlet 221 passes through the second clearance port 370, and the liquid outlet 222 passes through the third clearance port 380.

[0037] With this configuration, the coolant can enter the liquid cooling chamber through the inlet 221. The coolant in the liquid cooling chamber can exchange heat with the hard disk body 100 to dissipate heat from the hard disk body 100. After exchanging heat with the hard disk body 100, the coolant flows out through the outlet 222, thereby keeping the coolant in the liquid cooling chamber in a flowing state and further ensuring the heat dissipation effect on the hard disk body 100. The second clearance port 370 and the third clearance port 380 on the back plate 300 respectively avoid the inlet 221 and the outlet 222 so that the inlet 221 and the outlet 222 can communicate with the equipment used to provide coolant.

[0038] Furthermore, the device for providing coolant can deliver coolant to the inlet section 221 and recover and cool the coolant output from the outlet section 222, so that the coolant in the cooling chamber always has a low temperature, thereby ensuring the heat dissipation effect on the hard disk body 100.

[0039] Referring to FIG7, in one embodiment, the liquid inlet 221 and the liquid outlet 222 have a circumferentially through flow channel for coolant flow.

[0040] Furthermore, both the liquid inlet 221 and the liquid outlet 222 are cylindrical structures, preferably cylindrical bodies. The liquid inlet 221 and the liquid outlet 222 of the cylindrical body pass through the second clearance port 370 and the third clearance port 380 respectively to communicate with the equipment that provides coolant, and the connection effect is reliable.

[0041] Please refer to Figures 2 to 6. In one embodiment, the hard disk body 100 is provided with at least two first recesses 230, which are provided with at least two and are configured one-to-one with the hard disk body 100, and the second electrical connection part 310 is provided with at least two and is configured one-to-one with the hard disk body 100.

[0042] With this configuration, the hard disk module can dissipate heat from at least two hard disk bodies 100 and ensure electrical connection between at least two hard disk bodies 100 and the backplate 300, simplifying the overall assembly steps of the server and saving the production cost of the server.

[0043] Further, please refer to Figures 2 to 6. In one embodiment, a plurality of hard disk bodies 100 are provided. The plurality of hard disk bodies 100 are divided into at least two columns of hard disk groups in the height direction of the hard disk module. Each column of hard disk groups includes at least two hard disk bodies 100. At least two heat sinks 200 are provided and are arranged one-to-one with the hard disk groups. The number of first clearance ports 230 on each heat sink 200 corresponds one-to-one with the number of hard disk bodies 100 in the hard disk group corresponding to the heat sink 200. A back plate 300 is provided and the number of second electrical connection portions 310 on the back plate 300 corresponds to the number of hard disk bodies 100.

[0044] Please refer to Figures 1, 2 and 5. In one embodiment, the hard disk module further includes a mounting member 400. The mounting member 400 has a communicating mounting cavity 410 and a mounting port 420. The mounting cavity 410 is used to mount the hard disk body 100. The first electrical connection part 110 is disposed facing the mounting port 420. The heat sink 200 is disposed on the mounting member 400 and located in the mounting port 420. The back plate 300 is connected to the mounting member 400.

[0045] The mounting cavity 410 is used to accommodate the hard disk body 100 to prevent the hard disk body 100 from being damaged by collision with external objects. The heat sink 200 located in the mounting port 420 can not only dissipate heat from the hard disk body 100 in the mounting cavity 410, but also facilitate the disassembly and assembly of the heat sink 200 and the back plate 300, saving disassembly and assembly time and improving installation efficiency.

[0046] Please refer to Figure 5. In one embodiment, the mounting member 400 is a cuboid frame structure, and the mounting cavity 410 is also cuboid in shape to accommodate multiple hard disk bodies 100.

[0047] Please refer to Figures 1 to 5. In one embodiment, the mounting member 400 is provided with a first mounting portion 430, the heat sink 200 is provided with a second mounting portion 240, the first mounting portion 430 and the second mounting portion 240 are assembled together, the mounting member 400 is also provided with a third mounting portion 440, the back plate 300 is provided with a fourth mounting portion 340, the third mounting portion 440 is located on the second side 220, and the fourth mounting portion 340 is assembled with the third mounting portion 440.

[0048] The heat sink 200 is assembled with the first mounting part 430 on the mounting member 400 through the second mounting part 240 to realize the connection between the heat sink 200 and the mounting member 400. The mounting member 400 is provided with a third mounting part 440. The back plate 300 is assembled with the third mounting part 440 located on the second side 220 through the fourth mounting part 340 to set the back plate 300 on the mounting member 400 and located on the second side 220 of the heat sink 200.

[0049] Optionally, the connection method between the first mounting part 430 and the second mounting part 240 can be snap-fit, welding, screwing, etc., without specific limitation here; similarly, the connection method between the third mounting part 440 and the fourth mounting part 340 can also be snap-fit, welding, screwing, etc., without specific limitation here.

[0050] Please refer to Figures 2 and 3. In one embodiment, the hard disk module further includes a first threaded component 500, a first mounting portion 430 is provided with a first screw hole 431, a second mounting portion 240 is provided with a first through hole 241, and the first threaded component 500 passes through the first through hole 241 and is screwed to the first screw hole 431.

[0051] The first threaded component 500 can pass through the first through hole 241 of the second mounting part 240 and be screwed into the first threaded hole 431 of the first mounting part 430 to realize the connection between the first mounting part 430 and the second mounting part 240, thereby realizing the connection between the heat sink 200 and the mounting part 400. The implementation cost is low and the connection effect is reliable. It is easy to disassemble and assemble, and facilitates the later maintenance of the hard disk body 100.

[0052] Please refer to Figures 4 and 5. In one embodiment, the hard disk module further includes a second threaded component, a third mounting portion 440 is provided with a second screw hole 441, a fourth mounting portion 340 is provided with a second through hole 341, and the second threaded component passes through the second through hole 341 and is screwed into the second screw hole 441.

[0053] The second threaded component can pass through the second through hole 341 of the fourth mounting part 340 and be screwed into the second screw hole 441 of the third mounting part 440 to realize the connection between the third mounting part 440 and the fourth mounting part 340, thereby realizing the connection between the back plate 300 and the mounting part 400. The implementation cost is low and the connection effect is reliable. It is easy to disassemble and assemble, and facilitates the later maintenance of the hard disk body 100.

[0054] In one embodiment, both the first threaded component 500 and the second threaded component are bolts, which have low implementation costs and reliable connection effects.

[0055] Furthermore, both the first mounting part 430 and the third mounting part 440 are provided at the mounting port 420 to facilitate the connection between the first mounting part 430 and the second mounting part 240, and between the third mounting part 440 and the fourth mounting part 340.

[0056] Please refer to Figures 3 to 5 and Figure 9. In one embodiment, the mounting component 400 is further provided with a positioning hook 450, and the back plate 300 is provided with a strip-shaped through hole 350. The radial direction of the strip-shaped through hole 350 extends along the first direction of the back plate 300. The positioning hook 450 is used to assemble with the strip-shaped through hole 350. When the hook belly of the positioning hook 450 abuts against the hole wall of the strip-shaped through hole 350, the axis of the second screw hole 441 is collinear with the axis of the second through hole 341.

[0057] When the back plate 300 needs to be installed on the mounting part 400, the positioning hook 450 is first passed through the strip-shaped through hole 350, and then the positioning hook 450 is moved along the first direction so that the hook belly of the positioning hook 450 abuts against the hole wall of the strip-shaped through hole 350. At this time, the positioning hook 450 can provide a certain positioning effect for the back plate 300. The axis of the second screw hole 441 is collinear with the axis of the second through hole 341 so that the second threaded part can pass through the second through hole 341 and the second screw hole 441. This setting can simplify the installation process of the back plate 300 and improve the installation efficiency.

[0058] As an alternative embodiment of the above embodiment, the back plate 300 is further provided with a positioning hook 450, and the mounting member 400 is provided with a strip-shaped through hole 350. The radial direction of the strip-shaped through hole 350 extends along the second direction of the mounting member 400. The positioning hook 450 is used to assemble with the strip-shaped through hole 350. When the hook belly of the positioning hook 450 abuts against the hole wall of the strip-shaped through hole 350, the axis of the second screw hole 441 is collinear with the axis of the second through hole 341.

[0059] Similar to the above embodiments, the details will not be repeated here.

[0060] As an explanation, the hook belly of the positioning hook 450 refers to the bottom of the groove of the positioning hook 450.

[0061] Please refer to Figures 3 to 5 and Figure 9. In one embodiment, the back plate 300 is provided with an assembly through hole 360. The assembly through hole 360 ​​includes a first hole segment 361 and a second hole segment 362. The first hole segment 361 and the second hole segment 362 are connected along a first direction of the back plate 300. The diameter of the first hole segment 361 is smaller than the diameter of the second hole segment 362. The hard disk module also includes a limiting rod 600. One end of the limiting rod 600 is provided on the mounting member 400, and the other end of the limiting rod 600 is provided with a limiting part 610. The limiting part 610 can pass through the second hole segment 362, and the limiting rod 600 can reciprocate between the first hole segment 361 and the second hole segment 362.

[0062] When the limiting rod 600 passes through the first hole section 361, the limiting part 610 abuts against the side of the back plate 300 away from the heat sink 200, and the axis of the second screw hole 441 is collinear with the axis of the second through hole 341.

[0063] When the back plate 300 needs to be installed on the mounting component 400, the limiting rod 600 is first inserted through the second hole section 362 and the limiting part 610 passes through the second hole section 362. Then the limiting rod 600 is moved from the second hole section 362 to the first hole section 361. Since the diameter of the first hole section 361 is smaller than the diameter of the second hole section 362, when the limiting rod 600 is inserted through the first hole section 361, the limiting part 610 can abut against the side of the back plate 300 away from the heat sink 200 to prevent the limiting part 610 from disengaging from the first hole section 361. At this time, the axis of the second screw hole 441 is collinear with the axis of the second through hole 341 so that the second threaded component can pass through the second through hole 341 and the second screw hole 441. This setting can simplify the installation process of the back plate 300 and improve the installation efficiency.

[0064] For illustrative purposes, the first direction in the above embodiments can be either the length direction of the back panel 300 or the width direction of the back panel 300. It can be flexibly adjusted according to the actual situation, and no specific limitation is made here. In the embodiment shown in FIG4, the first direction is the width direction of the back panel 300 (that is, direction C in FIG4) to facilitate the installation of the back panel 300. Similarly, the second direction in the above embodiments can be either the length direction of the mounting member 400 or the width direction of the mounting member 400, and no specific limitation is made here.

[0065] Further, the limiting part 610 is circular in shape, and the diameter of the circular limiting part 610 is larger than the diameter of the first hole segment 361 and smaller than the diameter of the second hole segment 362.

[0066] Another embodiment of the present invention provides a server, the server including a chassis and a hard disk module as described in any of the above embodiments, the hard disk module being disposed within the chassis.

[0067] In the aforementioned server, the heat sink 200 is connected to the hard disk body 100 and has a first side 210 and a second side 220 facing each other. The first side 210 of the heat sink 200 is positioned towards the hard disk body 100 to achieve sufficient heat dissipation for the hard disk body 100. The first recess 230 of the heat sink 200 passes through the first side 210 and the second side 220. The back plate 300 is located on the second side 220 of the heat sink 200 and is provided with a second electrical connection portion 310. The second electrical connection portion 310 is connected to the first side 210 and the second side 220. Electrical connection is achieved between the electrical connection parts 110 through the first recess 230, thereby realizing the electrical connection between the back panel 300 and the hard disk body 100. Then, the second electrical connection part 310 of the back panel 300 enables the hard disk body 100 to perform functions such as power supply and data transmission. Compared with conventional technology, the above-mentioned hard disk module can not only ensure the electrical connection between the back panel 300 and the hard disk body 100, but also fully dissipate heat from the hard disk body 100 through the heat sink 200, thereby ensuring the heat dissipation effect.

[0068] The technical features of the above embodiments can be combined in any way. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The above embodiments only illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended patent application scope. [Simplified Explanation of the Diagram]

[0070] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 is a schematic diagram of the overall structure of a hard disk module in an embodiment of the present invention. Figure 2 is an exploded view of a hard disk module in an embodiment of the present invention. Figure 3 is a partial enlarged view of part A in Figure 2. Figure 4 is a partial enlarged view of part B in Figure 2. Figure 5 is a schematic diagram of the installation of a backplate in an embodiment of the present invention. Figure 6 is a schematic diagram of the structure of a backplate in an embodiment of the present invention. Figure 7 is a schematic diagram of the structure of the second side of a heat sink in an embodiment of the present invention. Figure 8 is a schematic diagram of the structure of the first side of a heat sink in an embodiment of the present invention. Figure 9 is a front view of a backplate in an embodiment of the present invention.

Claims

1. A hard disk module, characterized in that it comprises: The hard disk body is provided with a first electrical connection part; A heat sink is connected to the hard drive body and has a first side and a second side facing each other. The first side faces the hard drive body. The heat sink has a first recess through the first side and the second side. The position of the first recess corresponds to the position of the first electrical connection. The heat sink has a liquid cooling cavity. The second side has a liquid inlet and a liquid outlet, both of which are in communication with the liquid cooling cavity. A backplate is located on the second side and has a second electrical connection. At least one of the second electrical connection and the first electrical connection passes through the first recess to make the second electrical connection electrically connected to the first electrical connection.

2. The hard disk module as claimed in claim 1, wherein the back panel is provided with a second clearance port and a third clearance port, the liquid inlet portion passes through the second clearance port, and the liquid outlet portion passes through the third clearance port.

3. The hard disk module as claimed in claim 1, wherein the hard disk body is provided with at least two, the first recess is provided with at least two and is configured to correspond one-to-one with the hard disk body, and the second electrical connection part is provided with at least two and is configured to correspond one-to-one with the hard disk body.

4. The hard disk module as claimed in claim 1, wherein the hard disk module further includes a mounting member having a communicating mounting cavity and a mounting port, the mounting cavity being used to mount the hard disk body, the first electrical connection portion being disposed toward the mounting port, the heat sink being disposed on the mounting member and located at the mounting port, and the backplate being connected to the mounting member.

5. The hard drive module as claimed in claim 4, wherein the mounting component has a first mounting portion, the heat sink has a second mounting portion, the first mounting portion and the second mounting portion are assembled together, the mounting component also has a third mounting portion, the backplate has a fourth mounting portion, the third mounting portion is located on the second side, and the fourth mounting portion is assembled together with the third mounting portion.

6. The hard disk module as claimed in claim 5, wherein the hard disk module further includes a first threaded component, the first mounting portion is provided with a first threaded hole, the second mounting portion is provided with a first through hole, and the first threaded component passes through the first through hole and is screwed into the first threaded hole.

7. The hard disk module as claimed in claim 5, wherein the hard disk module further includes a second threaded component, the third mounting portion is provided with a second threaded hole, the fourth mounting portion is provided with a second through hole, and the second threaded component passes through the second through hole and is screwed into the second threaded hole.

8. The hard drive module as claimed in claim 7, wherein the mounting member further comprises a positioning hook, the back plate has a strip-shaped through hole, the strip-shaped through hole extending radially along a first direction of the back plate, and the positioning hook is used to mate with the strip-shaped through hole; wherein, When the hook belly of the positioning hook abuts against the wall of the strip-shaped through hole, the axis of the second screw hole is collinear with the axis of the second through hole; or, the back plate is further provided with a positioning hook, the mounting member is provided with a strip-shaped through hole, the radial direction of the strip-shaped through hole extends along the second direction of the mounting member, and the positioning hook is used to assemble with the strip-shaped through hole; wherein, when the hook belly of the positioning hook abuts against the wall of the strip-shaped through hole, the axis of the second screw hole is collinear with the axis of the second through hole.

9. The hard drive module as claimed in claim 7, wherein the back panel is provided with an assembly through hole, the assembly through hole including a first hole segment and a second hole segment, the first hole segment and the second hole segment being connected along a first direction of the back panel, the diameter of the first hole segment being smaller than the diameter of the second hole segment, the hard drive module further including a limiting rod, one end of the limiting rod being disposed on the mounting member, the other end of the limiting rod being provided with a limiting portion, the limiting portion being able to pass through the second hole segment, and the limiting rod being able to reciprocate between the first hole segment and the second hole segment; wherein, When the limiting rod passes through the first hole section, the limiting part abuts against the side of the back plate away from the heat sink, and the axis of the second screw hole is collinear with the axis of the second through hole.

10. A server, characterized in that the server includes a chassis and a hard disk module as described in any one of claims 1-9, the hard disk module being disposed within the chassis.