Heat dissipation module, radiator and server

Abstract

The present invention relates to a heat dissipation module, a radiator and a server, including a condenser, wherein the condenser is provided with a first air inlet, a liquid outlet and a second air inlet, the first air inlet and the second air inlet are respectively arranged at opposite ends of the heat dissipation module along a first direction, and the liquid outlet is positioned at a center of the condenser and between the first air inlet and the second air inlet; a liquid flow pipeline, with one end connected to the liquid outlet; a first airflow pipeline and a second airflow pipeline, wherein one end of the first airflow pipeline is connected to the first air inlet, and one end of the second airflow pipeline is connected to the second air inlet; and a first heat dissipation plate and a second heat dissipation plate, wherein the first liquid inlet of the first heat dissipation plate is connected to another end of the liquid flow pipeline, the second liquid inlet of the second heat dissipation plate is connected to another end of the liquid flow pipeline, a first exhaust port of the first heat dissipation plate is connected to another end of the first airflow pipeline, and a second exhaust port of the second heat dissipation plate is connected to another end of the second airflow pipeline.

Description

Technical Field

[0001] This invention relates to the technical field of server heat dissipation, and more particularly to a heat dissipation module, a heat sink, and a server. Prior Technology

[0002] With the rapid development of information technology, the demand for AI computing power is gradually increasing, thus the market demand for edge AI servers is also constantly growing. Correspondingly, the power density of chips used for AI computing is constantly increasing. The increase in power is accompanied by an increase in heat generation. When electronic components operate in a high-temperature environment for a long time, their performance and stability will be greatly reduced.

[0003] Traditional technologies typically employ unidirectional cold plate liquid cooling and phase change cold plate liquid cooling to provide heat dissipation for high heat flux density chips. However, unidirectional cold plate liquid cooling has extremely limited heat dissipation capacity, making it difficult to meet the heat dissipation needs of chips with progressively increasing heat generation. While phase change cold plate liquid cooling can meet the heat dissipation needs of high-heat-generating chips through the latent heat of phase change of the liquid, the high flow resistance of the liquid affects heat dissipation efficiency, and the gas phase is prone to blockage, increasing the internal operating pressure of the system. Summary of the Invention

[0004] Therefore, it is necessary to provide a heat dissipation module to address the problems of high liquid flow resistance and high internal operating pressure of the system.

[0005] A first aspect of the present invention provides a heat dissipation module, comprising:

[0006] The condenser has a first air inlet, a liquid outlet, and a second air inlet. The first air inlet and the second air inlet are respectively arranged at opposite ends of the heat dissipation module in a first direction. The liquid outlet is arranged in the middle of the condenser and is located between the first air inlet and the second air inlet.

[0007] A liquid flow pipeline, one end of which is connected to the liquid outlet;

[0008] A first airflow conduit and a second airflow conduit, wherein one end of the first airflow conduit is connected to the first air inlet, and one end of the second airflow conduit is connected to the second air inlet; and

[0009] A first heat sink and a second heat sink, wherein the first liquid inlet of the first heat sink is connected to the other end of the liquid flow pipeline, the second liquid inlet of the second heat sink is connected to the other end of the liquid flow pipeline, the first exhaust port of the first heat sink is connected to the other end of the first airflow pipeline, and the second exhaust port of the second heat sink is connected to the other end of the second airflow pipeline.

[0010] This heat dissipation module is used in servers to cool down chips that generate a lot of heat. In use, the heat dissipation module is mounted on the motherboard. The first and second heat sinks are respectively in heat transfer contact with the corresponding chips (e.g., direct or indirect contact to achieve heat conduction). During operation, the heat generated by the chips is conducted to the first and second heat sinks, causing the coolant inside the first and second heat sinks to absorb heat, heat up, and vaporize into gas. The gas then flows through the first and second airflow pipes to the first and second air inlets of the condenser, respectively. The gas then disperses through the first and second air inlets. The gas does not flow into the condenser from either end of the first direction. Inside the condenser, the gas exchanges heat with the cooling medium and cools down, causing the gas to condense into liquid. The liquid gathers at the outlet and eventually flows back to the first and second heat sinks through the liquid flow pipe. Through the continuous cycle of the above process, efficient heat dissipation and cooling of the chip can be achieved by means of phase change liquid cooling. Moreover, the flow path of the gas condensing into liquid in the condenser is shortened by at least half, which effectively reduces the liquid flow resistance and helps to improve the heat dissipation efficiency of the heat dissipation module. At the same time, it avoids the phenomenon of gas phase blockage and ensures normal internal operating pressure of the system.

[0011] The technical solution of the present invention will be further described below:

[0012] In one embodiment, the heat dissipation module further includes a first splitter, which is installed at the first air inlet and connected to the end of the first airflow duct away from the first heat sink.

[0013] In one embodiment, the heat dissipation module further includes a second splitter, which is installed at the second air inlet and connected to the end of the second airflow duct away from the second heat sink.

[0014] In one embodiment, the heat dissipation module further includes a water distributor installed at the liquid outlet, and the liquid flow pipeline includes a first liquid flow branch pipe and a second liquid flow branch pipe, with the water distributor connected to the first liquid flow branch pipe and the second liquid flow branch pipe.

[0015] In one embodiment, the condenser includes a condenser shell and a partition plate. The partition plate is installed inside the condenser shell to divide the inner cavity of the condenser shell into a first condenser chamber and a second condenser chamber. The medium flow direction in the first condenser chamber is from the first air inlet to the liquid outlet, and the medium flow direction in the second condenser chamber is from the second air inlet to the liquid outlet.

[0016] In one embodiment, the condenser further includes at least two first condensing plates and at least two second condensing plates. The at least two first condensing plates are installed in the first condensing chamber and arranged side-by-side at intervals along the second direction of the heat dissipation module, with a first condensation channel formed between adjacent first condensing plates. The at least two second condensing plates are installed in the second condensing chamber and arranged at intervals along the second direction of the heat dissipation module, with a second condensation channel formed between adjacent second condensing plates; wherein the second direction intersects the first direction.

[0017] Alternatively, the condenser may further include at least two first condensing plates and at least two second condensing plates. The at least two first condensing plates are installed in the first condensing chamber and arranged side-by-side at intervals along the second direction of the heat dissipation module. A first condensing channel is formed between two adjacent first condensing plates, and a first cavity is formed inside each first condensing plate, with a cooling medium disposed in the first cavity. The at least two second condensing plates are installed in the second condensing chamber and arranged at intervals along the second direction of the heat dissipation module. A second condensing channel is formed between two adjacent second condensing plates, and a second cavity is formed inside each second condensing plate, with a cooling medium disposed in the second cavity. The second direction intersects with the first direction.

[0018] In one embodiment, both the first heat sink and the second heat sink include a heat sink housing and at least two heat sink fins. An installation cavity is formed inside the heat sink housing, and at least two heat sink fins are installed in the installation cavity and arranged side by side at intervals along the second direction of the heat sink module. A liquid flow channel is formed between two adjacent heat sink fins.

[0019] In one embodiment, both the first heat sink and the second heat sink further include a mounting assembly, the mounting assembly including a mounting member and an elastic member, the heat sink housing having a mounting through hole, the mounting member being movably inserted into the mounting through hole, and the elastic member abutting between the heat sink housing and the mounting member.

[0020] In a second aspect, the present invention also provides a heat sink comprising at least two heat sink modules as described above, wherein the at least two heat sink modules are arranged side by side along a predetermined direction.

[0021] A third aspect of the present invention also provides a server comprising:

[0022] Functional component modules; and

[0023] As described above, the heat sink is in thermal cooperation with the functional component module.

[0024] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Simple Explanation of the Diagram

[0025] The drawings that form part of this invention are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort. Figure 1 is a schematic diagram of the heat dissipation module according to an embodiment of the present invention. Figure 2 is a schematic diagram of the heat dissipation module according to another embodiment of the present invention. Figure 3 is a magnified schematic diagram of the structure at point A in Figure 1. Figure 4 is an exploded view of the first and second heat sinks according to an embodiment. Implementation

[0027] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] In the description of this invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0029] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a mechanical connection or an electrical connection; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly defined. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0031] In this invention, unless otherwise explicitly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "under," and "below" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only possible implementation.

[0033] Referring to Figures 1 and 2, a heat dissipation module 100 is shown in two different embodiments of the present invention, which includes a condenser 10, a liquid flow pipeline 20, a first air flow pipeline 30, a second air flow pipeline 40, a first heat dissipation plate 50, and a second heat dissipation plate 60.

[0034] The condenser 10 has a first air inlet 11, a liquid outlet 12, and a second air inlet 13. The first air inlet 11 and the second air inlet 13 are respectively arranged at opposite ends of the heat dissipation module 100 in a first direction. The liquid outlet 12 is arranged in the middle of the condenser 10 and is located between the first air inlet 11 and the second air inlet 13. One end of the liquid flow pipe 20 is connected to the liquid outlet 12. One end of the first air flow pipe 30 is connected to the first air inlet 11, and one end of the second air flow pipe 40 is connected to the second air inlet 13. The first liquid inlet of the first heat sink 50 is connected to the other end of the liquid flow pipe 20, the second liquid inlet of the second heat sink 60 is connected to the other end of the liquid flow pipe 20, the first exhaust port of the first heat sink 50 is connected to the other end of the first air flow pipe 30, and the second exhaust port of the second heat sink 60 is connected to the other end of the second air flow pipe 40.

[0035] The heat dissipation module 100 in this solution is used in a server to cool down chips that generate a lot of heat. In use, the heat dissipation module 100 is mounted on the motherboard. The first heat sink 50 and the second heat sink 60 are respectively in heat transfer contact with the corresponding chips (e.g., direct or indirect contact to achieve heat conduction). During operation, the heat generated by the chips is conducted to the first heat sink 50 and the second heat sink 60, causing the coolant inside the first heat sink 50 and the second heat sink 60 to absorb heat, rise in temperature, and vaporize into gas. The gas can then flow through the first airflow pipe 30 and the second airflow pipe 40 to the first air inlet 11 and the second air inlet 13 of the condenser 10, respectively. The gas then flows through the first air inlet 11 and the second air inlet 13 of the condenser 10. Two air inlets 13 flow into the condenser 10 from both ends in the first direction. The gas exchanges heat with the cooling medium inside the condenser 10 and is cooled down, causing the gas to condense into liquid. The liquid gathers at the liquid outlet 12 and finally flows back to the first heat sink 50 and the second heat sink 60 through the liquid flow pipe 20. Through the continuous cycle of the above working process, efficient heat dissipation and cooling of the chip can be achieved by means of phase change liquid cooling. Moreover, the flow path of the gas condensing into liquid in the condenser 10 is shortened by at least half, which effectively reduces the liquid flow resistance and helps to improve the heat dissipation efficiency of the heat dissipation module 100. At the same time, it avoids the phenomenon of gas phase blockage and ensures normal internal operating pressure of the system.

[0036] It should be noted that the first direction of the heat dissipation module 100 corresponds to the length direction of the condenser 10. At this time, the first air inlet 11 and the second air inlet 13 are respectively arranged at both ends of the length direction of the condenser 10, while the liquid outlet 12 is arranged in the middle of the condenser 10. This makes it possible for the length of the coolant flowing from the first air inlet 11 to the liquid outlet 12 and from the second air inlet 13 to the liquid outlet 12 during the process of the gas liquefying into liquid in the condenser 10 only half the length of the condenser 10. This greatly shortens the length of the coolant return flow path in the condenser 10, thereby reducing the liquid flow resistance.

[0037] It is also necessary to explain that the principle by which condenser 10 condenses gas into liquid is based on the principle of heat exchange. When high-temperature gas enters condenser 10, it exchanges heat with the cooling medium (usually coolant or air; in this case, it is coolant, such as water), and the gas temperature gradually decreases. As the temperature decreases, the thermal motion of gas molecules slows down, the distance between molecules decreases, and the gaseous substance gradually transforms into a liquid, completing the condensation process. The arrows in Figure 1 indicate the direction of the phase change circulation flow of gas and coolant.

[0038] The second direction of the heat dissipation module 100 specifically corresponds to the width direction of the condenser 10.

[0039] The opening size of the first air inlet 11 and the second air inlet 13 is smaller than the width of the condenser 10.

[0040] Please continue to refer to Figures 1 and 2. Based on the above embodiment, the heat dissipation module 100 also includes a first diverter 70. The first diverter 70 is installed at the first air inlet 11 and is connected to the end of the first airflow pipe 30 away from the first heat sink 50.

[0041] Similarly, the heat dissipation module 100 also includes a second splitter 80, which is installed at the second air inlet 13 and is connected to the end of the second airflow pipe 40 away from the second heat sink 60.

[0042] By setting the first distributor 70 and the second distributor 80, the gas input into the condenser 10 through the first gas flow pipe 30 and the second gas flow pipe 40 can be divided and diffused, so that the gas can be evenly distributed in the cross-sectional space of the condenser 10 as soon as it enters the condenser 10, thereby increasing the heat exchange area of ​​the gas and improving the condensation efficiency of the gas.

[0043] Furthermore, in another embodiment, the heat dissipation module 100 also includes a water distributor 90, which is installed at the liquid outlet 12. The liquid flow pipeline 20 includes a first liquid flow branch pipe 21 and a second liquid flow branch pipe 22. The water distributor 90 is connected to the first liquid flow branch pipe 21 and the second liquid flow branch pipe 22. The water distributor 90 can distribute the coolant that has been condensed and gathered inside the water distributor 90 relatively evenly to the first liquid flow branch pipe 21 and the second liquid flow branch pipe 22, so as to ensure that the flow rate of coolant returning to the first heat sink 50 and the second heat sink 60 is equal and sufficient. On the one hand, this ensures that the first heat sink 50 and the second heat sink 60 have the same cooling effect on the chip and ensures effective heat dissipation for the chip; on the other hand, it ensures that the first heat sink 50 and the second heat sink 60 are replenished with coolant in a timely manner, avoiding the phenomenon of burning dry and affecting the service life of the first heat sink 50, the second heat sink 60 and the chip.

[0044] Please continue referring to Figure 1. In an optional embodiment, the condenser 10 includes a condenser shell 14 and a partition plate 15. The partition plate 15 is installed inside the condenser shell 14 to divide the inner cavity of the condenser shell 14 into a first condenser chamber and a second condenser chamber. The medium flow direction in the first condenser chamber is from the first air inlet 11 to the liquid outlet 12, and the medium flow direction in the second condenser chamber is from the second air inlet 13 to the liquid outlet 12.

[0045] With this configuration, the partition plate 15 can prevent the liquid or gas-liquid mixture flowing in opposite directions in the first and second condensing chambers from colliding and causing noise, while ensuring that the two streams of liquid formed after condensation can flow directly to the liquid outlet 12 and converge into the water distributor 90, thereby improving the effectiveness of the coolant flow in the condenser 10.

[0046] Furthermore, based on the above embodiments, the condenser 10 further includes at least two first condensing plates and at least two second condensing plates. The at least two first condensing plates are installed in the first condensing chamber and arranged side by side at intervals along the second direction of the heat dissipation module 100, forming a first condensing flow channel between two adjacent first condensing plates. The at least two second condensing plates are installed in the second condensing chamber and arranged at intervals along the second direction of the heat dissipation module 100, forming a second condensing flow channel between two adjacent second condensing plates. The second direction intersects with the first direction.

[0047] After flowing into the condenser 10 from the first air inlet 11 and the second air inlet 13, the gas will be diverted to each of the first condensing channels and the second condensing channels, and then simultaneously contact and exchange heat with multiple first condensing plates and second condensing plates, greatly improving the cooling efficiency, so that the gas can be condensed into coolant more quickly and recycled.

[0048] It is easy to understand that the cooling medium in the condenser 10 in the above embodiment is specifically the air in the first condensation channel and the second condensation channel. The air transfers the heat of the gas to the first condensation plate and the second condensation plate, and then dissipates the heat to the external environment through the condensation shell 14.

[0049] Alternatively, as an alternative to the above embodiments, the condenser 10 further includes at least two first condensing plates and at least two second condensing plates. The at least two first condensing plates are installed in the first condensing chamber and arranged side by side at intervals along the second direction of the heat dissipation module 100. A first condensing flow channel is formed between two adjacent first condensing plates, and a first cavity is formed inside each first condensing plate, with a cooling medium disposed in the first cavity. The at least two second condensing plates are installed in the second condensing chamber and arranged at intervals along the second direction of the heat dissipation module 100. A second condensing flow channel is formed between two adjacent second condensing plates, and a second cavity is formed inside each second condensing plate, with a cooling medium disposed in the second cavity. The second direction intersects with the first direction.

[0050] The difference from the above embodiment is that the gas exchanges heat with the cooling medium contained in the first and second condensing plates, thereby absorbing heat and cooling the gas, so that the gas condenses into a coolant.

[0051] It should be noted that flow sensors 90a can also be installed in the first liquid flow branch pipe 21, the second liquid flow branch pipe 22, the first air flow pipeline 30, and the second air flow pipeline 40 to monitor the flow of gas and coolant, thereby enabling timely detection of problems such as poor flow.

[0052] Please continue to refer to Figures 3 and 4. In addition, based on any of the above embodiments, the first heat sink 50 and the second heat sink 60 both include a heat sink housing 60a and at least two heat sink fins 60b. An installation cavity is formed inside the heat sink housing 60a, and at least two heat sink fins 60b are installed in the installation cavity and arranged side by side at intervals along the second direction of the heat sink module 100. A liquid flow channel is formed between two adjacent heat sink fins 60b.

[0053] In use, the heat sink 60a is directly attached to the chip to be cooled or indirectly contacted through a heat transfer medium (such as thermally conductive adhesive), so that the high temperature heat generated by the chip can be conducted to the heat sink 60a. The heat is further conducted to the heat sink fins 60b and exchanged with the coolant in the mounting cavity. The coolant absorbs heat, heats up and vaporizes into gas, thereby cooling the chip. The generated high temperature gas flows into the condenser 10 and is condensed back into coolant, and then flows back into the heat sink 60a, realizing recycling and continuous heat dissipation for the chip.

[0054] Furthermore, both the first heat sink 50 and the second heat sink 60 include a mounting assembly 60c. The mounting assembly 60c includes a mounting member 61c and a spring member 62c. The heat sink housing 60a has a mounting through hole, and the mounting member 61c is movably inserted into the mounting through hole. The spring member 62c abuts against the heat sink housing 60a and the mounting member 61c. Therefore, the first heat sink 50 and the second heat sink 60 can be mounted on the motherboard through the mounting assembly 60c, so that the heat sink housing 60a and the chip can cooperate in heat transfer.

[0055] Specifically, the mounting component 61c is inserted into the mounting through hole and connected and fixed to the motherboard. At this time, the elastic element 62c is compressed and stores energy. When the first heat sink 50 and the second heat sink 60 are removed, the mounting component 61c is released from the motherboard, and the elastic element 62c releases its elastic force, which allows the mounting component 61c to move away automatically.

[0056] For example, mounting component 61c uses one of the threaded elements such as screws or bolts to reduce the difficulty of installation and disassembly while ensuring connection strength.

[0057] Preferably, there are multiple mounting components 60c, such as four; the four mounting components 60c are arranged in a rectangle around the outer periphery of the heat sink 60a, thereby further improving the connection reliability by increasing the number of connection points with the motherboard.

[0058] In addition to the above, the present invention also provides a server, including a functional component module and a heat sink, wherein the heat sink and the functional component module cooperate for heat transfer. The heat sink includes at least two heat dissipation modules 100 as described in any of the above embodiments, and the at least two heat dissipation modules 100 are arranged side by side along a predetermined direction.

[0059] The functional component module specifically includes a motherboard and a chip, with the chip mounted on the motherboard.

[0060] The chips on the motherboard can be multiple chips arranged in an array, so a heat sink consisting of at least two heat dissipation modules 100 can simultaneously meet the heat dissipation and cooling needs of multiple chips.

[0061] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the patent protection scope of the present invention should be determined by the appended patent application scope.

[0063] 100: Heat dissipation module 10: Condenser 11: First air intake 12:Liquid outlet 13: Second air intake 14: Condenser Shell 15: Divider 20: Liquid flow pipeline 21: First fluid flow branch pipe 22: Second fluid flow branch pipe 30: First airflow pipeline 40: Second airflow pipeline 50: First heat sink 60: Second heat sink 60a: Heat sink housing 60b: Heat dissipation fins 60c: Install Components 61c: Installation component 62c: Elastic element 70: First shunt 80: Second splitter 90: Water distributor 90a: Flow sensor

Claims

1. A heat dissipation module, characterized in that it comprises: A condenser, comprising a first air inlet, a liquid outlet, and a second air inlet, the first and second air inlets being respectively arranged at opposite ends of the heat dissipation module in a first direction, and the liquid outlet being arranged in the middle of the condenser and located between the first and second air inlets; a liquid flow pipeline, one end of which is connected to the liquid outlet, the liquid flow pipeline including a first liquid flow branch pipe and a second liquid flow branch pipe; a first airflow pipeline and a second airflow pipeline, one end of which is connected to the first air inlet, and one end of which is connected to the second air inlet; a first heat sink and a second heat sink, the first heat sink having a first liquid inlet connected to the other end of the liquid flow pipeline, the second heat sink having a second liquid inlet connected to the other end of the liquid flow pipeline, the first heat sink having a first exhaust port connected to the other end of the first airflow pipeline, and the second heat sink having a second exhaust port connected to the other end of the second airflow pipeline; and a water distributor, the water distributor being installed at the liquid outlet and connected to the first and second liquid flow branch pipes.

2. The heat dissipation module as described in claim 1, wherein the heat dissipation module further includes a first splitter, the first splitter being installed at the first air inlet, and the first splitter being connected to the end of the first airflow duct away from the first heat sink.

3. The heat dissipation module as claimed in claim 1, wherein the heat dissipation module further includes a second splitter, the second splitter being installed at the second air inlet, and the second splitter being connected to the end of the second airflow duct away from the second heat sink.

4. The heat dissipation module as described in claim 1, wherein the condenser includes a condensation shell and a partition plate, the partition plate being installed inside the condensation shell to divide the inner cavity of the condensation shell into a first condensation chamber and a second condensation chamber, wherein the medium flow direction in the first condensation chamber is from the first air inlet toward the liquid outlet, and the medium flow direction in the second condensation chamber is from the second air inlet toward the liquid outlet.

5. The heat dissipation module as described in claim 4, wherein the condenser further comprises at least two first condensing plates and at least two second condensing plates, the at least two first condensing plates being installed in the first condensing chamber and arranged side-by-side at intervals along the second direction of the heat dissipation module, a first condensation channel being formed between adjacent two first condensing plates, and the at least two second condensing plates being installed in the second condensing chamber and arranged at intervals along the second direction of the heat dissipation module, a second condensation channel being formed between adjacent two second condensing plates; wherein... The second direction intersects with the first direction; or, the condenser further includes at least two first condensing plates and at least two second condensing plates, the at least two first condensing plates are installed in the first condensing chamber and arranged side by side at intervals along the second direction of the heat dissipation module, a first condensing flow channel is formed between two adjacent first condensing plates, and a first cavity is formed inside each first condensing plate, the first cavity being provided with a cooling medium; at least two second condensing plates are installed in the second condensing chamber and arranged at intervals along the second direction of the heat dissipation module, a second condensing flow channel is formed between two adjacent second condensing plates, and a second cavity is formed inside each second condensing plate, the second cavity being provided with a cooling medium; wherein, the second direction intersects with the first direction.

6. The heat dissipation module as claimed in claim 1, wherein both the first heat dissipation plate and the second heat dissipation plate include a heat dissipation housing and at least two heat dissipation fins, an installation cavity is formed inside the heat dissipation housing, at least two of the heat dissipation fins are installed in the installation cavity and arranged side by side at intervals along the second direction of the heat dissipation module, and a liquid flow channel is formed between two adjacent heat dissipation fins.

7. The heat dissipation module as described in claim 6, wherein the first heat dissipation plate and the second heat dissipation plate further include a mounting assembly, the mounting assembly includes a mounting member and an elastic member, the heat dissipation housing has a mounting through hole, the mounting member is movably inserted into the mounting through hole, and the elastic member abuts between the heat dissipation housing and the mounting member.

8. A heat sink, characterized in that it comprises at least two heat dissipation modules as described in any one of claims 1 to 7, wherein the at least two heat dissipation modules are arranged side by side along a predetermined direction.

9. A server, characterized in that it comprises: Functional component modules; And a heat sink as described in claim 8, the heat sink being thermally coupled with the functional element module.

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