Liquid cooling heat dissipation assembly and server device including the same

Abstract

A liquid cooling heat dissipation assembly is configured for cooling a central processing unit, multiple voltage regulators, and one or more dual in-line memory modules. The liquid cooling heat dissipation assembly includes at least one processor cold plate, at least one inlet distribution pipe, and at least one memory cold plate. The processor cold plate is configured to be in thermal contact with the central processing unit and allow coolant to flow through. The inlet distribution pipe is in fluid communication with the processor cold plate and is configured to be in thermal contact with the voltage regulators. The memory cold plate is in fluid communication with the inlet distribution pipe and is configured to be in thermal contact with the dual in-line memory module(s). In addition, the processor cold plate, the inlet distribution pipe and the memory cold plate collectively form a cooling loop, allowing the coolant to sequentially flow through the processor cold plate, the inlet distribution pipe and the memory cold plate within the cooling loop.

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