Cold plate mechanism, heat dissipation module and server

Abstract

The invention relates to a cold plate mechanism, a heat dissipation module and a server. The cold plate mechanism of the present invention includes a transmission assembly, a memory cold plate and a voltage regulator cold plate. The transmission assembly includes a first inlet pipe, a first outlet pipe, a first connecting plate and a second connecting plate. The first inlet pipe includes a first opening and a second opening. The first opening is connected to the first connecting plate. The first outlet pipe includes a third opening and a fourth opening. The third opening is connected to the second connecting plate. One end of the memory cold plate is connected to the first connecting plate. The other end of the memory cold plate is connected to the second connecting plate. The first inlet pipe, the first connecting plate, the memory cold plate, the second connecting plate and the first outlet pipe sequentially form a connected liquid cooling channel. A liquid cooling medium is disposed in the liquid cooling channel. The voltage regulator cold plate is disposed on the first connecting plate and / or the second connecting plate. The cold plate mechanism, the heat dissipation module and the server of the present invention have the advantages of good heat dissipation effect, small space occupation and high energy efficiency.

Description

[Technical Field]

[0001] This invention relates to the field of computing device technology, and in particular to a cold plate mechanism, a heat dissipation module and a server. [Previous Technology]

[0002] With the upgrading of server core computing chips, the power consumption of server chips is also increasing, and therefore the heat generated by server chips is also increasing accordingly.

[0003] Traditional air cooling methods are no longer sufficient to meet the heat dissipation requirements of modern server chips. Furthermore, air cooling occupies a significant amount of space within the server, failing to meet the high integration requirements of server designs. Additionally, as fans serve as the primary heat dissipation component for servers, their power consumption accounts for an increasingly larger proportion of the total power consumption, conversely increasing the overall PUE (Power Usage Effectiveness) of the device (the ratio of all energy consumed by the data center to the energy consumed by the IT load). This results in poor heat dissipation, large space requirements, and low energy efficiency. [Summary of the Invention]

[0004] Based on this, it is necessary to provide a cold plate mechanism, a heat dissipation module and a server to address the problems of poor heat dissipation effect, large space occupation and low energy efficiency of server heat dissipation.

[0005] This invention provides a cold plate mechanism, comprising:

[0006] Transmission component, the transmission component includes a first inlet pipe, a first outlet pipe, a first connecting plate and a second connecting plate, the first inlet pipe includes a first port and a second port, the first port is connected to the first connecting plate, the first outlet pipe includes a third port and a fourth port, the third port is connected to the second connecting plate;

[0007] Memory cold plate, one end of the memory cold plate is connected to the first connecting plate, and the other end of the memory cold plate is connected to the second connecting plate. The first water inlet pipe, the first connecting plate, the memory cold plate, the second connecting plate and the first water outlet pipe form a connected liquid cooling channel in sequence. The liquid cooling channel is provided with liquid cooling fluid.

[0008] and a voltage regulator cold plate, wherein the voltage regulator cold plate is disposed on the first connecting plate and / or the second connecting plate.

[0009] In one embodiment, the cold plate mechanism further includes a processor cold plate, and the transmission component further includes a connecting water pipe. The first pipe port is connected to the processor cold plate, and the connecting water pipe includes a fifth pipe port and a sixth pipe port. The fifth pipe port is connected to the processor cold plate, and the sixth pipe port is connected to the first connecting plate, so that the processor cold plate and the connecting water pipe are connected between the first water inlet pipe of the liquid cooling channel and the first connecting plate.

[0010] In one embodiment, the memory cold plate includes a plurality of memory cold plates, which are arranged at intervals along a first direction, and a memory installation interval is provided between two adjacent memory cold plates.

[0011] In one embodiment, the memory cold plate is provided with a thermal pad and a film, the thermal pad is connected to at least one side surface of the memory cold plate, and the film is wrapped around the outside of the memory cold plate and the thermal pad.

[0012] In one embodiment, the cold plate mechanism further includes a first guide cover and a second guide cover. The first guide cover is movably mounted on the first connecting plate and has a plurality of first mounting slots. The second guide cover is movably mounted on the second connecting plate and has a plurality of second mounting slots. The first mounting slots and the second mounting slots are arranged opposite to each other, and the first mounting slots and the second mounting slots are arranged at positions corresponding to the memory mounting interval.

[0013] In one embodiment, the transmission component further includes a first liquid receiving tray, a second liquid receiving tray, a third liquid receiving tray, and a fourth liquid receiving tray. The first liquid receiving tray is connected to the first connecting plate and is disposed at the bottom of the sixth port. The second liquid receiving tray is connected to the second connecting plate and is disposed at the bottom of the third port. The third liquid receiving tray is disposed at the bottom of the first port. The fourth liquid receiving tray is disposed at the bottom of the fifth port.

[0014] In one embodiment, the first port, the third port, the fifth port and the sixth port are all provided with leakage detection devices.

[0015] In one embodiment, the cold plate mechanism further includes an installation handle, the installation handle including a first connecting part, a second connecting part and a third connecting part, the first connecting part being detachably connected to the first connecting plate through a first fastener, the second connecting part being detachably connected to the processor cold plate through a second fastener, and the third connecting part being detachably connected to the second connecting plate through a third fastener.

[0016] The present invention also provides a heat dissipation module, including a second water inlet pipe, a second water outlet pipe, a first water distributor, a second water distributor, and at least two cold plate mechanisms as described in any of the above embodiments. The first water distributor is provided with a fifth water inlet and at least two fifth water outlets, and the fifth water inlet is connected to the fifth water outlet. The second water distributor is provided with a sixth water outlet and at least two sixth water inlets, and the sixth water outlet is connected to the sixth water inlet. The second water inlet pipe is connected to the fifth water inlet. The second port of the first water inlet pipe is connected to the fifth water outlet one by one. The fourth port of the first water outlet pipe is connected to the sixth water inlet one by one. The second water outlet pipe is connected to the sixth water outlet.

[0017] The present invention also provides a server, including a cabinet, a motherboard, a processor, memory, and a heat dissipation module as described in the above embodiments. The cabinet has a receiving cavity, the motherboard is disposed in the receiving cavity, and the processor and the memory are mounted on the motherboard. The first connecting plate has a first guide hole, the second connecting plate has a second guide hole, the motherboard has a first guide post and a second guide post, and when the cold plate mechanism is mounted on the motherboard, the first guide post is connected to the first guide hole, and the second guide post is connected to the second guide hole. The memory is disposed in the memory mounting interval of the cold plate mechanism, and both ends of the memory are respectively engaged in the first mounting slot and the second mounting slot of the cold plate mechanism, and both sides of the memory abut against the memory cold plate. The processor cold plate abuts against the processor. The motherboard has a voltage regulator, and the voltage regulator cold plate abuts against the voltage regulator.

[0018] The aforementioned cold plate mechanism, heat dissipation module, and server form a liquid cooling channel by sequentially connecting the first inlet pipe, the first connecting plate, the memory cold plate, the second connecting plate, and the first outlet pipe. The memory cold plate is used to abut the memory for mounting. By introducing liquid cooling fluid into the liquid cooling channel, the heat from the memory is transferred to the liquid cooling fluid through the memory cold plate. A voltage regulator cold plate is also provided on one side of the first connecting plate and / or one side of the second connecting plate to cool the voltage regulator. The liquid cooling fluid exchanges heat efficiently with the memory and the voltage regulator, thereby significantly improving the server's heat dissipation efficiency and system reliability. Furthermore, the memory cold plate is located between the first and second connecting plates, and the voltage regulator cold plate is located on one side of the first and / or second connecting plates, thus integrating all components into a single unit. This results in a small overall space requirement, suitable for the assembly space requirements and heat dissipation needs of 1U and above general-purpose servers, and offers advantages such as good heat dissipation, small space requirement, and high energy efficiency.

Implementation Method

[0019] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0020] In the description of the present invention, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0021] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] In this invention, unless otherwise explicitly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only possible implementation.

[0025] Referring to Figures 1 and 2, a schematic diagram of the cold plate mechanism 10 in an embodiment of the present invention is shown. The cold plate mechanism 10 includes a transmission component 100, a memory cold plate 300, and a voltage regulator cold plate 400. The transmission component 100 includes a first water inlet pipe 110, a first water outlet pipe 120, a first connecting plate 140, and a second connecting plate 150. The first water inlet pipe 110 includes a first port 111 and a second port 112. The first port 111 is connected to the first connecting plate 140. The first water outlet pipe 120 includes a third port 121 and a fourth port 122. The third port 121 is connected to the second connecting plate 150.

[0026] One end of the memory cold plate 300 is connected to the first connecting plate 140, and the other end of the memory cold plate 300 is connected to the second connecting plate 150. The first water inlet pipe 110, the first connecting plate 140, the memory cold plate 300, the second connecting plate 150 and the first water outlet pipe 120 form a connected liquid cooling channel in sequence, and a liquid cooling working fluid is provided in the liquid cooling channel.

[0027] The voltage regulator cold plate 400 is disposed on the first connecting plate 140 and / or the second connecting plate 150.

[0028] The cold plate mechanism 10 of this embodiment of the invention forms a liquid cooling channel by sequentially connecting the first water inlet pipe 110, the first connecting plate 140, the memory cold plate 300, the second connecting plate 150, and the first water outlet pipe 120. The memory cold plate 300 of the cold plate mechanism 10 is used to abut against the memory module. By introducing liquid cooling fluid into the liquid cooling channel, the liquid cooling fluid circulates in the memory cold plate 300, allowing the heat of the memory module to be transferred to the liquid cooling fluid through the memory cold plate 300, thereby achieving the purpose of heat dissipation. Moreover, depending on the position of the voltage regulator, a voltage regulator cold plate 400 can be set on one side of the first connecting plate 140 and / or one side of the second connecting plate, allowing the heat of the voltage regulator 33 to be transferred to the liquid cooling fluid through the voltage regulator cold plate 400 and carried away, thereby cooling the voltage regulator 33.

[0029] The cold plate mechanism 10 described in this embodiment of the invention achieves efficient heat exchange between the memory cold plate 300 and the memory, and between the voltage regulator cold plate 400 and the voltage regulator 33, thereby significantly improving the server's heat dissipation efficiency and system reliability. Furthermore, the memory cold plate 300 is disposed between the first connecting plate 140 and the second connecting plate 150, and the voltage regulator cold plate 400 is disposed on one side of the first connecting plate 140 and / or one side of the second connecting plate 150, thus integrating all components into a single unit. This arrangement is reasonable, occupies a small overall space, and is suitable for the assembly space requirements and heat dissipation needs of 1U and above general-purpose servers. It has the advantages of good heat dissipation, small space occupation, and high energy efficiency.

[0030] In an optional embodiment, as shown in Figures 1 and 2, the cold plate mechanism 10 further includes a processor cold plate 200, and the transmission component 100 further includes a connecting water pipe 130. A first port 111 is connected to the processor cold plate 200. The connecting water pipe 130 includes a fifth port 131 and a sixth port 132. The fifth port 131 is connected to the processor cold plate 200, and the sixth port 132 is connected to a first connecting plate 140, so that the processor cold plate 200 and the connecting water pipe 130 are connected between the first water inlet pipe 110 and the first connecting plate 140 of the liquid cooling channel. By inserting the processor cold plate 200 into the liquid cooling channel, the liquid cooling medium passes through the processor cold plate 200, and the processor cold plate 200 is used to abut against the processor for mounting. The heat of the processor is transferred to the liquid cooling medium through the processor cold plate 200, thereby achieving efficient heat exchange for the processor and improving the server's heat dissipation power and system reliability.

[0031] In an exemplary embodiment, as shown in FIG1, the processor cold plate 200 is disposed between the first connecting plate 140 and the second connecting plate 150, and the memory cold plate 300 is disposed on both sides of the processor cold plate 200 along a first direction, wherein the first direction is the extension direction of the first connecting plate 140 and the second connecting plate 150.

[0032] In one optional embodiment, the processor cold plate 200, memory cold plate 300, voltage regulator cold plate 400, first connecting plate 140, and second connecting plate 150 are all made of highly thermally conductive metals, such as copper or copper-aluminum alloy, thereby improving the thermal conductivity of the cold plate structure 10 and thus improving heat dissipation efficiency. In other embodiments, the processor cold plate 200, memory cold plate 300, voltage regulator cold plate 400, first connecting plate 140, and second connecting plate 150 may also be made of aluminum to suit certain lightweight applications.

[0033] In an optional embodiment, the liquid cooling medium may be selected from water-based medium, propylene glycol and ethylene glycol solution, oil and fluorinated liquid.

[0034] In some embodiments, as shown in Figures 1 and 2, the first connecting plate 140 is provided with a first water inlet 141 and a first water outlet 142, which are connected. The second connecting plate 150 is provided with a second water outlet 151 and a second water inlet 152, which are connected. A sixth pipe 132 is connected to the first water inlet 141, and a fourth pipe 122 is connected to the second water outlet 151. The processor cold plate 200 is provided with a third water inlet 210 and a third water outlet 220. A first pipe 111 is connected to the third water inlet 210, and a fifth pipe 131 is connected to the third water outlet 220. The memory cold plate 300 is provided with a fourth water inlet 310 and a fourth water outlet 320. The fourth water inlet 310 is connected to the first water outlet 142 in a one-to-one correspondence, and the fourth water outlet 320 is connected to the second water inlet 152 in a one-to-one correspondence. The water inlet of the first water outlet pipe 120 is connected to the second water outlet 151.

[0035] In this embodiment, liquid cooling medium is input into the processor cold plate 200 through the third water inlet 210, and then input into the connecting water pipe 130 through the third water outlet 220. A first water inlet 141 is provided on the first connecting plate 140, so that the connecting water pipe 130 inputs liquid cooling medium into the first connecting plate 140 through the first water inlet 141. Then, the first connecting plate 140 inputs liquid cooling medium into the memory cold plate 300 through the first water outlet 142 and the fourth water inlet 310. After the memory cold plate 300 and the memory exchange heat, the liquid cooling medium is input into the second connecting plate 150 through the fourth water outlet 320 and the second water inlet 152. Then, the second connecting plate 150 inputs liquid cooling medium into the first water outlet pipe 120 through the second water outlet 151, thereby forming a complete liquid cooling channel, so that the cold plate mechanism 10 has a high-efficiency heat dissipation capability.

[0036] Referring to Figure 3, a cross-sectional schematic diagram of the memory cold plate 300 of the cold plate mechanism 10 in one embodiment of the present invention is shown. In an optional embodiment, the memory cold plate 300 includes multiple memory cold plates, which are arranged at intervals along a first direction, and a memory mounting interval 300A is provided between two adjacent memory cold plates 300. The first direction is the extension direction of the first connecting plate 140 and the second connecting plate 150. Since multiple memory modules are usually installed in a server, by arranging multiple memory cold plates 300 at intervals, multiple memory mounting intervals 300A are provided between two adjacent memory cold plates 300, and the memory modules can be installed one-to-one in the memory mounting intervals 300A. Each memory module has memory cold plates 300 abutting on both sides, thereby exchanging heat between the two sides of the memory module, so that the memory cold plates 300 can fully dissipate heat from the memory module, and have excellent heat dissipation effect.

[0037] In an exemplary embodiment, as shown in FIG1, the processor cold plate 200 is disposed between the first connecting plate 140 and the second connecting plate 150. Both sides of the processor cold plate 200 are provided with a plurality of memory cold plates 300 of the same number, so that the processor cold plate 200 and the memory cold plate 300 form a symmetrical structure, thereby ensuring that the temperature difference of the liquid cooling medium entering the processor cold plate 200 and the memory cold plate 300 is small and the heat dissipation performance is more balanced.

[0038] In an optional embodiment, as shown in FIG4, the memory cold plate 300 is provided with a thermal pad 330 and a film 340. The thermal pad 330 is connected to at least one side surface of the memory cold plate 300, and the film 340 is wrapped around the outer surface of the memory cold plate 300 and the thermal pad 330. Specifically, the memory cold plate 300 may have a thermal pad 330 on one side or both sides, so that the memory and the thermal pad 330 are installed with an interference fit. By providing a thermal pad 330 on the side of the memory cold plate 300, there is good heat transfer contact between the memory and the memory cold plate 300, ensuring the heat dissipation effect of the memory cold plate 300. Furthermore, the film 340 is wrapped around the outer surface of the memory cold plate 300 and the thermal pad 330 to prevent the thermal pad 330 from scratching the memory and to ensure the stability of the server operation.

[0039] In an optional embodiment, as shown in Figures 1 and 2, the cold plate mechanism 10 further includes a first guide cover plate 143 and a second guide cover plate 153. The first guide cover plate 143 is movably mounted on the first connecting plate 140 and is provided with a plurality of first mounting slots 143A. The second guide cover plate 153 is movably mounted on the second connecting plate 150 and is provided with a plurality of second mounting slots 153A. The first mounting slots 143A and the second mounting slots 153A are arranged opposite to each other, and the first mounting slots 143A and the second mounting slots 153A are arranged at positions corresponding to memory mounting intervals 300A. By providing a first guide cover 143 on the first connecting plate 140 and a second guide cover 153 on the second connecting plate 150, the first mounting groove 143A of the first guide cover 143 and the second mounting groove 153A of the second guide cover 153 are set to correspond to the memory installation interval 300A. This allows the memory to be assembled along the guide openings of the first mounting groove 143A and the second mounting groove 153A during installation, making the installation position of the memory more accurate, avoiding damage to the memory due to incorrect positioning during installation, and making the installation of the memory more convenient and improving the ease of use.

[0040] In an optional embodiment, as shown in FIG2, the first guide cover 143 is hinged above the first connecting plate 140. The first guide cover 143 is provided with a fourth fastener for fixing the first guide cover 143 above the first connecting plate 140. The second guide cover 153 is hinged above the second connecting plate 150. The second guide cover 153 is provided with a fifth fastener for fixing the second guide cover 153 above the second connecting plate 150. Specifically, both the fourth and fifth fasteners are screws or bolts. When the memory is installed in the cold plate mechanism 10, the first guide cover 143 is fixed to the first connecting plate through the fourth fastener, and the second guide cover 153 is fixed to the second connecting plate 150 through the fifth fastener. At this time, the memory is limited in the first mounting groove 143A and the second mounting groove 153A. When it is necessary to remove the memory, remove the fourth and fifth fasteners, then rotate the first guide cover 143 and the second guide cover 153 to release the restriction on the memory, and then use a jig to remove the memory.

[0041] In an optional embodiment, as shown in FIG1, the transmission component 100 further includes a first liquid receiving tray 161, a second liquid receiving tray 162, a third liquid receiving tray 163 and a fourth liquid receiving tray 164. The first liquid receiving tray 161 is connected to the first connecting plate 140 and is disposed at the bottom of the sixth port 132. The second liquid receiving tray 162 is connected to the second connecting plate 150 and is disposed at the bottom of the third port 121. The third liquid receiving tray 163 is disposed at the bottom of the first port 111 and the fourth liquid receiving tray 164 is disposed at the bottom of the fifth port 131. By setting a first liquid receiving tray 161 and a fourth liquid receiving tray 164 at the two connection interfaces of the sixth pipe port 132 and the fifth pipe port 131 respectively, setting a second liquid receiving tray 162 at the third pipe port 121, and setting a third liquid receiving tray 163 at the first pipe port 111, each connection node of the cold plate mechanism 10 is equipped with a liquid receiving tray. When liquid leakage occurs at the connection node, the liquid receiving tray can absorb the leakage, reduce the risk of equipment damage when leakage occurs, and improve the stability of operation.

[0042] In an optional embodiment, the first port 111, the third port 121, the fifth port 131, and the sixth port 132 are all equipped with leakage detection devices. Specifically, the leakage detection device is a leakage detection line. By setting leakage detection lines at each connection node of the cold plate mechanism 10, and connecting the leakage detection lines to the control module of the server, the detected leakage signal can be transmitted to the control module. When leakage occurs in the cold plate mechanism 10, it can be detected in time, thereby reducing the risk of leakage damaging the equipment and improving the stability of operation.

[0043] In other embodiments, the leakage detection element is a leakage detection patch. By setting leakage detection patches at each connection node of the cold plate mechanism 10, leakage can be detected in a timely manner by periodically checking the leakage detection patches, reducing the risk of leakage damaging the equipment and improving operational stability.

[0044] In an optional embodiment, as shown in FIG6, the cold plate mechanism 10 further includes a mounting handle 500. The mounting handle 500 includes a first connecting portion 510, a second connecting portion 520, and a third connecting portion 530. The first connecting portion 510 is detachably connected to the first connecting plate 140 through a first fastener 511. The second connecting portion 520 is detachably connected to the processor cold plate 200 through a second fastener 521. The third connecting portion 530 is detachably connected to the second connecting plate 150 through a third fastener 531. Specifically, the first fastener 511, the second fastener 521, and the third fastener 531 are screws or bolts. In this embodiment, the first water inlet pipe 110, the first water outlet pipe 120, and the connecting water pipe 130 are flexible hoses. Flexible hoses are easy to manufacture, and the connection between the flexible hoses and the processor cold plate 200 and the memory cold plate 300 is not easily damaged. When installing the cold plate mechanism 10, the relative positions of the processor cold plate 200 and the memory cold plate 300 are difficult to fix due to the flexible hose connecting them, making positioning difficult and requiring multiple people to operate. Furthermore, it is easy to damage important components on the motherboard. This embodiment uses an installation handle 500 to connect the first connecting plate 140, the second connecting plate 150, and the processor cold plate 200, thereby connecting the various parts of the cold plate mechanism into a rigid whole. After installation, the installation handle 500 can be removed, facilitating the installation of the cold plate mechanism. Moreover, the installation handle 500 can be reused for subsequent disassembly and assembly, offering advantages such as simple manufacturing, convenient operation, and low cost.

[0045] On the other hand, the present invention also provides a heat dissipation module, as shown in Figures 5 and 6, including a second water inlet pipe 11, a second water outlet pipe 12, a first water distributor 13, a second water distributor 14, and at least two cold plate mechanisms 10 as described in the above embodiments. The first water distributor 13 is provided with a fifth water inlet 13A and at least two fifth water outlets 13B, and the fifth water inlet 13A and the fifth water outlet 13B are connected. The second water distributor 14 is provided with a sixth water outlet 14A and at least two sixth water inlets 14B, and the sixth water outlet 14A and the sixth water inlet 14B are connected. The second water inlet pipe 11 is connected to the fifth water inlet 13A. The second pipe port 112 of the first water inlet pipe 110 is connected to the fifth water outlet 13B one by one. The fourth pipe port 122 of the first water outlet pipe 120 is connected to the sixth water inlet 14B one by one. The second water outlet pipe 12 is connected to the sixth water outlet 14A.

[0046] The heat dissipation module 1 described in this embodiment of the invention, by setting a first water distributor 13 and a second water distributor 14, allows two or more cold plate mechanisms 10 to be connected in parallel to the second water inlet pipe 11 through the first water distributor 13 when they are installed, thereby ensuring that the temperature difference of the liquid cooling working fluid entering each cold plate mechanism 10 is small, making the heat dissipation performance of each cold plate mechanism 10 more balanced and having the advantage of high stability.

[0047] The heat dissipation module 1 described in this embodiment of the invention allows for efficient heat exchange between the processor and the processor via the processor cold plate 200, the memory cold plate 300 and the memory via efficient heat exchange, and the voltage regulator cold plate 400 and the voltage regulator 33 via efficient heat exchange, thereby significantly improving the server's heat dissipation efficiency and system reliability. Furthermore, the memory cold plate 300 is positioned between the first connecting plate 140 and the second connecting plate 150, and the voltage regulator cold plate 400 is positioned on one side of the first connecting plate 140 and / or one side of the second connecting plate 150, thus integrating all components into a single unit with a reasonable layout and small overall space requirement. This design is suitable for the assembly space requirements and heat dissipation needs of 1U and above general-purpose servers, offering advantages such as good heat dissipation, small space requirement, and high energy efficiency.

[0048] In an optional embodiment, as shown in Figures 5 and 6, the heat dissipation module 1 further includes a first quick connector 15 and a second quick connector 16, with a second water inlet pipe 11 connected to the first quick connector 15 and a second water outlet pipe 12 connected to the second quick connector 16. By providing the first quick connector 15 on the second water inlet pipe 11 and the second quick connector 16 on the second water outlet pipe 12, the heat dissipation module 1 can be more conveniently connected to the liquid cooling cabinet.

[0049] In an exemplary embodiment, the first quick connector 15 is a hand-plug quick connector or a blind-plug quick connector, and the second quick connector 16 is a hand-plug quick connector or a blind-plug quick connector.

[0050] On the other hand, this embodiment of the invention also provides a server, as shown in FIG7, including a cabinet 2, a motherboard 3, a processor, memory, and a heat dissipation module 1 as described in any of the above embodiments. The cabinet 2 is provided with a receiving cavity 2A, the motherboard 3 is disposed in the receiving cavity 2A, and the processor and memory are mounted on the motherboard 3. A first connecting plate 140 is provided with a first guide hole 140A, a second connecting plate 150 is provided with a second guide hole 150A, and the motherboard 3 is provided with a first guide post 31 and a second guide post 32. When the cold plate mechanism 10 is mounted on the motherboard 3, the first guide post 31 is connected to the first guide hole 140A, and the second guide post 32 is connected to the second guide hole 150A. The memory is disposed at the memory mounting interval 300A of the cold plate mechanism 10, and the two ends of the memory are respectively engaged in the first mounting slot 143A and the second mounting slot 153A of the cold plate mechanism 10. Both sides of the memory abut against the memory cold plate 300. The processor cold plate 200 abuts against the processor. The motherboard 3 is equipped with a voltage regulator 33, and the voltage regulator cold plate 400 abuts against the voltage regulator 33.

[0051] The server described in this embodiment of the invention, by installing a heat dissipation module 1 on the motherboard 3, allows the cold plate mechanism 10 of the heat dissipation module 1 to exchange heat efficiently with the processor through the processor cold plate 200, the memory cold plate 300 through the memory, and the voltage regulator cold plate 400 through the voltage regulator 33, thereby significantly improving the server's heat dissipation efficiency and system reliability. Furthermore, the memory cold plate 300 is disposed between the first connecting plate 140 and the second connecting plate 150, and the voltage regulator cold plate 400 is disposed on one side of the first connecting plate 140 and / or one side of the second connecting plate 150, thus integrating all components into a single unit. This results in a reasonable layout, a small overall footprint, and suitability for the assembly space requirements and heat dissipation needs of 1U and above general-purpose servers. It offers advantages such as good heat dissipation, small footprint, and high energy efficiency.

[0052] The server described in this embodiment of the invention, by setting a first guide post 31 and a second guide post 32 on the motherboard 3, allows the cold plate mechanism 10 to be installed with the first guide hole 140A of the first connecting plate 140 corresponding to the first guide post 31 and the second guide hole 150A of the second connecting plate 150 corresponding to the second guide post 32. This facilitates the positioning of the cold plate mechanism 10 during installation, ensures high positioning accuracy of the cold plate mechanism 10, and ensures heat dissipation effect. It has the advantages of convenient installation and good heat dissipation effect.

[0053] The technical features of the above embodiments can be combined in any way. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The above-described embodiments are merely illustrative of several implementations of the present invention, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended patent application scope. [Simplified Explanation of the Diagram]

[0055] Figure 1 is a structural schematic diagram of the cold plate mechanism according to an embodiment of the present invention. Figure 2 is an exploded structural schematic diagram of the cold plate mechanism according to an embodiment of the present invention. Figure 3 is a cross-sectional view at point AA in Figure 1. Figure 4 is an enlarged view of Figure 3. Figure 5 is a structural schematic diagram of the heat dissipation module according to an embodiment of the present invention. Figure 6 is a structural schematic diagram of the heat dissipation module according to another embodiment of the present invention. Figure 7 is a structural schematic diagram of the server according to an embodiment of the present invention.

Claims

1. A cold plate mechanism, characterized in that it comprises: A transmission component (100) includes a first inlet pipe (110), a first outlet pipe (120), a first connecting plate (140), and a second connecting plate (150). The first inlet pipe (110) includes a first port (111) and a second port (112), the first port (111) being connected to the first connecting plate (140). The first outlet pipe (120) includes a third port (121) and a fourth port (122), the third port (121) being connected to the second connecting plate (150). A memory cooling plate (300) is also included. One end of the plate (300) is connected to the first connecting plate (140), and the other end of the memory cold plate (300) is connected to the second connecting plate (150). The first water inlet pipe (110), the first connecting plate (140), the memory cold plate (300), the second connecting plate (150), and the first water outlet pipe (120) sequentially form a connected liquid cooling channel, and a liquid cooling working fluid is provided in the liquid cooling channel; and a voltage regulator cold plate (400), which is disposed on the first connecting plate (140) and / or the second connecting plate (150).

2. The cold plate mechanism as described in claim 1, wherein: The cold plate mechanism (10) further includes a processor cold plate (200), and the transmission component (100) further includes a connecting water pipe (130). The first pipe port (111) is connected to the processor cold plate (200). The connecting water pipe (130) includes a fifth pipe port (131) and a sixth pipe port (132). The fifth pipe port (131) is connected to the processor cold plate (200), and the sixth pipe port (132) is connected to the first connecting plate (140), so that the processor cold plate (200) and the connecting water pipe (130) are connected between the first water inlet pipe (110) and the first connecting plate (140) of the liquid cooling channel.

3. The cold plate mechanism as described in claim 1, wherein: The memory cold plate (300) includes a plurality of them, and the memory cold plates (300) are arranged at intervals along a first direction, and a memory installation interval (300A) is provided between two adjacent memory cold plates (300).

4. The cold plate mechanism as described in claim 1, wherein: The memory cold plate (300) is provided with a thermal pad (330) and a film (340). The thermal pad (330) is connected to at least one side surface of the memory cold plate (300), and the film (340) is wrapped around the outside of the memory cold plate (300) and the thermal pad (330).

5. The cold plate mechanism as described in claim 3, wherein: The cold plate mechanism (10) further includes a first guide cover plate (143) and a second guide cover plate (153). The first guide cover plate (143) is movably mounted on the first connecting plate (140). The first guide cover plate (143) is provided with a plurality of first mounting slots (143A). The second guide cover plate (153) is movably mounted on the second connecting plate (150). The second guide cover plate (153) is provided with a plurality of second mounting slots (153A). The first mounting slots (143A) and the second mounting slots (153A) are arranged opposite to each other, and the first mounting slots (143A) and the second mounting slots (153A) are positioned corresponding to the memory mounting interval (300A).

6. The cold plate mechanism as described in claim 2, wherein: The transmission component (100) further includes a first liquid receiving tray (161), a second liquid receiving tray (162), a third liquid receiving tray (163), and a fourth liquid receiving tray (164). The first liquid receiving tray (161) is connected to the first connecting plate (140) and is located at the bottom of the sixth port (132). The second liquid receiving tray (162) is connected to the second connecting plate (150) and is located at the bottom of the third port (121). The third liquid receiving tray (163) is located at the bottom of the first port (111). The fourth liquid receiving tray (164) is located at the bottom of the fifth port (131).

7. The cold plate mechanism as described in claim 2, wherein: The first port (111), the third port (121), the fifth port (131) and the sixth port (132) are all equipped with leakage monitoring devices.

8. The cold plate mechanism as described in claim 2, wherein: The cold plate mechanism (10) further includes an installation handle (500), which includes a first connecting part (510), a second connecting part (520) and a third connecting part (530). The first connecting part (510) is detachably connected to the first connecting plate (140) through a first fastener (511), the second connecting part (520) is detachably connected to the processor cold plate (200) through a second fastener (521), and the third connecting part (530) is detachably connected to the second connecting plate (150) through a third fastener (531).

9. A heat dissipation module, characterized in that: it includes a second water inlet pipe (11), a second water outlet pipe (12), a first water distributor (13), a second water distributor (14), and at least two cold plate mechanisms (10) as described in any one of claims 1-8, wherein the first water distributor (13) is provided with a fifth water inlet (13A) and at least two fifth water outlets (13B), the fifth water inlet (13A) being connected to the fifth water outlet (13B), and the second water distributor (14) is provided with a sixth water outlet (14A) and at least two sixth water inlets (14B). 4B), the sixth outlet (14A) is connected to the sixth inlet (14B), the second inlet pipe (11) is connected to the fifth inlet (13A), the second port (112) of the first inlet pipe (110) is connected to the fifth outlet (13B), the fourth port (122) of the first outlet pipe (120) is connected to the sixth inlet (14B), and the second outlet pipe (12) is connected to the sixth outlet (14A).

10. A server, characterized in that: it includes a cabinet (2), a motherboard (3), a processor, memory, and a heat dissipation module (1) as described in claim 9, wherein the cabinet (2) is provided with a receiving cavity (2A), the motherboard (3) is disposed in the receiving cavity (2A), and the processor and the memory are mounted on the motherboard (3); a first connecting plate (140) is provided with a first guide hole (140A), a second connecting plate (150) is provided with a second guide hole (150A), the motherboard (3) is provided with a first guide post (31) and a second guide post (32), and when the cold plate mechanism (10) is mounted on the motherboard (3), the first guide post (31) is connected to the first guide hole (140A). 140A), the second guide post (32) is connected to the second guide hole (150A); the memory is set in the memory mounting interval (300A) of the cold plate mechanism (10), and the two ends of the memory are respectively locked in the first mounting groove (143A) and the second mounting groove (153A) of the cold plate mechanism (10), and both sides of the memory abut against the memory cold plate (300); the processor cold plate (200) abuts against the processor; the motherboard (3) is provided with a voltage regulator (33), and the voltage regulator cold plate (400) abuts against the voltage regulator (33).

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