Technologies for servicing and operating liquid cooling systems for high-performance computing systems

TW202638720APending Publication Date: 2026-09-16ECOLAB USA INC
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Patent Information

Application Number
TW114118550
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-18
Filing Date
2025-05-16
Publication Date
2026-09-16

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Abstract

A system includes a liquid monitoring system adapted to be coupled to a secondary coolant loop that connects a high-performance computing system and a cooling distribution unit. The liquid monitoring system includes one or more liquid sensors fluidly coupled to the secondary coolant loop. The system includes a controller coupled to the liquid sensors. The system may include features that improve servicing or operations. The system may include modularity features for the cooling distribution unit. The system may include additional servicing equipment. The system may provide maintenance system improvements.
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