Electronic component transfer apparatus, semiconductor manufacturing apparatus and fixture

Abstract

According to one embodiment, an electronic component transfer device includes a chuck and a retainer. The chuck has: an adsorption surface, which, when viewed from above, has a rectangular shape including a first side extending along a first direction and a second side extending along a second direction intersecting the first direction, and adsorbs and holds electronic components; a first side surface intersecting the adsorption surface along the first direction; and a second side surface intersecting the adsorption surface along the second direction. The retainer has: a first sidewall contacting the first side surface and having a first height, and a second sidewall contacting the second side surface and having a second height lower than the first height, and holds the chuck.

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