Semiconductor structure in memory device

TW202638728APending Publication Date: 2026-09-16YANGTZE MEMORY TECH CO LTD
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Patent Information

Application Number
TW114131403
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-03
Filing Date
2025-08-18
Publication Date
2026-09-16

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Abstract

A method, device, and system for managing a layout of a semiconductor structure in a memory device are provided. In an aspect, the memory device includes a first semiconductor structure and a second semiconductor structure. The first semiconductor structure includes a first memory bank and a second memory bank. The second semiconductor structure includes a first memory bank circuit and a second memory bank circuit arranged along a first direction. The first memory bank circuit is coupled to the first memory bank, and the second memory bank circuit is coupled to the second memory bank. The first memory bank circuit includes a first driver circuit on a boundary of the first memory bank circuit, and the second memory bank circuit includes a second driver circuit on a boundary of the second memory bank circuit. At least a portion of the first driver circuit is adjacent to and overlaps with at least a portion of the second driver circuit along a second direction perpendicular to the first direction.
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