Semiconductor memory device and method for forming the same

TW202638730APending Publication Date: 2026-09-16WINBOND ELECTRONICS CORP
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Patent Information

Application Number
TW115102939
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-14
Filing Date
2026-01-26
Publication Date
2026-09-16

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Abstract

A semiconductor structure is provided. The semiconductor memory device includes memory transistors disposed in respective levels stacked in a first direction, and first conductive lines extending in a second direction. The second direction is perpendicular to the first direction. The first conductive lines are disposed in the respective levels, and are electrically coupled to the first terminals of the memory transistors. The semiconductor memory device further includes second conductive lines extending in the first direction and electrically coupled to the second terminals of the memory transistors, and third conductive lines extending in the first direction and electrically coupled to the third terminals of the memory transistors.
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