Semiconductor memory devices and methods for manufacturing semiconductor memory devices
TW202638741APending Publication Date: 2026-09-16KIOXIA CORP
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Patent Information
- Application Number
- TW114127753
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-28
- Filing Date
- 2025-07-22
- Publication Date
- 2026-09-16
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Abstract
An embodiment provides a semiconductor memory device that can improve the crystallinity of a channel layer and a method for manufacturing the semiconductor memory device. The semiconductor memory device of the embodiment includes: a stacked body in which a plurality of conductive layers and a plurality of insulating layers are alternately stacked; and a pillar extending within the stacked body in the stacking direction; and the pillar includes: a first semiconductor layer extending within the stacked body in the stacking direction; a second semiconductor layer disposed above the first semiconductor layer; and a third semiconductor layer disposed between the first and second semiconductor layers; and the second semiconductor layer includes at least one additive of carbon, nitrogen, oxygen, and fluorine.
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