Integrated circuit device and method of manufacturing the same
TW202638771APending Publication Date: 2026-09-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114115139
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-03
- Filing Date
- 2025-04-22
- Publication Date
- 2026-09-16
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Abstract
In some embodiments, the present disclosure relates to an IC device including an array of cells. A semiconductor channel overlays the back gate, isolated from a back gate by a first dielectric layer. A lower portion of a top gate overlays and is in contact with the back gate. The top gate is isolated from the semiconductor channel by a first sidewall spacer; an upper portion overlays the semiconductor channel, isolated by a second dielectric layer, and isolated laterally from adjoining structures by a second sidewall spacer. A cascading portion connects the upper portion and the lower portion and overlays the first sidewall spacer. A first electrode is on a first side of the upper portion and in contact with the semiconductor channel. A second electrode is on the opposite side of the upper portion and in contact with the semiconductor channel.
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