Integrated circuit and method of forming the same
TW202638775APending Publication Date: 2026-09-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114136201
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-07-23
- Filing Date
- 2025-09-19
- Publication Date
- 2026-09-16
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Figure TWG2TA001076272_001 
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Figure TWG2TA001076272_003
Abstract
An integrated circuit includes a transistor including a pair of source / drain regions and a plurality of stacked first channels extending in a first lateral direction between the pair of first source / drain regions. The integrated circuit includes a pair of gate spacer layers adjacent to the first channels and a gate metal between the pair of gate spacer layers and between the first channels. The gate metal has a first length in the first lateral direction between the gate spacer layers and a second length in the first lateral direction between the first channels. The first length is greater than the second length.
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