Semiconductor devices and method of fabricating thereof

TW202638791APending Publication Date: 2026-09-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114145919
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-09-29
Filing Date
2025-11-25
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001076515_001
    Figure TWG2TA001076515_001
  • Figure TWG2TA001076515_002
    Figure TWG2TA001076515_002
  • Figure TWG2TA001076515_003
    Figure TWG2TA001076515_003
Patent Text Reader

Abstract

A semiconductor device and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes a substrate, first and second nanostructured channel regions, and a gate structure. The gate structure includes first and second metal layers surrounding the first and second nanostructured channel regions and a gate metal layer disposed on the first and second metal layers. The first and second metal layers are different from each other. The semiconductor device further includes an isolation structure disposed between and in contact with the first and second nanostructured channel regions and a first contact structure disposed on surfaces of the isolation structure and the first and second metal layers that face the substrate.
Need to check novelty before this filing date? Find Prior Art