Submount structures of light-emitting diodes and related methods

TW202638822APending Publication Date: 2026-09-16CREELED INC
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Patent Information

Application Number
TW114150177
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-09
Filing Date
2025-12-19
Publication Date
2026-09-16

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Abstract

Light-emitting diode （LED） devices and more particularly submount structures in LED devices and related methods are disclosed. Submount structures include submounts with sidewall connectors along perimeter sidewalls that electrically couple chip bonding pads on top submount surfaces to package bonding pads on submount bottom surfaces. LED devices include LED packages, such as chip-scale LED packages, with reduced footprints where electrically conductive paths are provided as one or more metal layers on the perimeter sidewalls. Exemplary methods include various sequences for depositing the sidewall connectors.
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