Transparent display module and manufacturing method thereof

Abstract

A transparent display module includes a transparent substrate, light-emitting diode elements, a first protective layer, a wiring structure, integrated circuit elements and a second protective layer. The transparent substrate has a first surface and a second surface opposite to each other. The light-emitting diode elements are disposed on the first surface. The first protective layer is connected to the first surface, and the light-emitting diode elements are embedded in the first protective layer. The wiring structure is connected to the second surface. The integrated circuit elements are arranged on a surface of the wiring structure away from the transparent substrate. The second protective layer is connected to the surface of the wiring structure, and the integrated circuit elements are embedded in the second protective layer. Therefore, the transparent display module can have good transparency through the specific structural configuration.

Description

Technical Field

[0001] This disclosure relates to a display module and its manufacturing method, and more particularly to a transparent display module with good transparency and its manufacturing method. Prior Technology

[0002] Conventional display modules electrically connect light-emitting diode (LED) elements to integrated circuit elements to control the light emission of the LED elements. Conventional display modules involve wiring on the substrate surface to form the circuit structure between the LED elements and the integrated circuit elements. However, even when a transparent substrate is used, the aforementioned circuit structure still blocks light from passing through the display module, resulting in poor transparency and making it unsuitable for applications requiring high transparency, such as glass facades or display windows. Summary of the Invention

[0003] The purpose of this disclosure is to provide a display module and its manufacturing method, which, through a specific structural configuration, helps to improve the effect of light penetration through the transparent display module.

[0004] One embodiment of this disclosure provides a transparent display module, comprising a transparent substrate, a plurality of light-emitting diode (LED) elements, a first protective layer, a wiring structure, a plurality of integrated circuit elements, and a second protective layer. The transparent substrate has a first surface and a second surface opposite to each other, and includes a first wiring structure and a second wiring structure. The first wiring structure extends from the first surface to the second surface. The second wiring structure is disposed on the first surface. The LED elements are disposed on the first surface and electrically connected to the first wiring structure and the second wiring structure. The first protective layer is connected to the first surface, and the LED elements are embedded within the first protective layer. The wiring structure is connected to the second surface, such that the transparent substrate is located between the first protective layer and the wiring structure. The wiring structure includes a third wiring structure, and the third wiring structure is electrically connected to the first wiring structure. The integrated circuit elements are disposed on a surface of the wiring structure away from the transparent substrate and are electrically connected to the third wiring structure. The second protective layer is connected to the surface of the wiring structure, such that the wiring structure is located between the transparent substrate and the second protective layer, and the integrated circuit elements are embedded within the second protective layer.

[0005] According to the aforementioned transparent display module, the first circuit structure may include a plurality of conductive pads, and the light-emitting diode element may be electrically connected to the first circuit structure through the conductive pads.

[0006] According to the aforementioned transparent display module, the number of conductive pads can be 1 to 4 times the number of light-emitting diode elements.

[0007] Based on the aforementioned transparent display module, the second circuit structure on the first surface can be arranged in a grid pattern or in a straight line pattern.

[0008] According to the aforementioned transparent display module, the second circuit structure may include a plurality of wires, and the width of each wire may be from 10 μm to 100 μm.

[0009] Another embodiment of this disclosure provides a method for manufacturing a transparent display module, comprising the following steps: A first circuit structure and a second circuit structure are formed on a transparent substrate, wherein the transparent substrate has a first surface and a second surface opposite to each other, the first circuit structure extends from the first surface to the second surface, and the second circuit structure is disposed on the first surface. A wiring structure is formed on the second surface, the wiring structure including a third circuit structure, and the third circuit structure is electrically connected to the first circuit structure. A plurality of light-emitting diode (LED) elements are disposed on the first surface, and the LED elements are electrically connected to the first circuit structure and the second circuit structure. A plurality of integrated circuit (IC) elements are disposed on a surface of the wiring structure away from the transparent substrate, and the IC elements are electrically connected to the third circuit structure. A first protective layer is formed on the first surface, such that the LED elements are embedded within the first protective layer, and the transparent substrate is located between the first protective layer and the wiring structure. A second protective layer is formed on the surface of the wiring structure, such that the wiring structure is located between the transparent substrate and the second protective layer, and the IC elements are embedded within the second protective layer, thereby obtaining a transparent display module.

[0010] According to the aforementioned manufacturing method of the transparent display module, the first circuit structure may include a plurality of conductive pads, and the light-emitting diode element may be electrically connected to the first circuit structure through the conductive pads.

[0011] According to the aforementioned manufacturing method of the transparent display module, the number of conductive pads can be 1 to 4 times the number of light-emitting diode elements.

[0012] According to the aforementioned manufacturing method of the transparent display module, the second circuit structure on the first surface can be arranged in a grid pattern or in a straight line pattern.

[0013] According to the aforementioned manufacturing method of the transparent display module, the second circuit structure may include a plurality of wires, and the width of each wire may be from 10 μm to 100 μm.

[0014] Accordingly, the transparent display module and its manufacturing method disclosed herein, by setting a transparent substrate, a first protective layer, a wiring structure and a second protective layer, and by using a first circuit structure, a second circuit structure and a third circuit structure for electrical configuration, enables the transparent display module disclosed herein to have good transparency. Simple Explanation of the Diagram

[0015] Figure 1 is a top view of a transparent display module according to one embodiment of this disclosure; Figure 2 is a cross-sectional view of the transparent display module in Figure 1 along line segment 2-2; and Figure 3 is a flowchart of the manufacturing method of the transparent display module according to one embodiment of this disclosure. Implementation

[0016] The various embodiments of this disclosure will be discussed in more detail below. However, this embodiment can be an application of various disclosed concepts and can be implemented in various different specific scopes. The specific embodiments are for illustrative purposes only and are not limited to the scope of the disclosure.

[0017] In addition, for the sake of simplifying the diagrams, some commonly used structures and components will be drawn in a simple schematic manner, and repeated components may be represented by the same or similar numbers.

[0018] Please refer to Figures 1 and 2. Figure 1 is a top view of a transparent display module 100 according to one embodiment of this disclosure, and Figure 2 is a cross-sectional view of the transparent display module 100 in Figure 1 along line segment 2-2. The transparent display module 100 includes a transparent substrate 110, a plurality of light-emitting diode elements 120, a first protective layer 130, a wiring structure 140, a plurality of integrated circuit elements 150, and a second protective layer 160.

[0019] The transparent substrate 110 has a first surface 110a and a second surface 110b opposite to each other, and includes a first circuit structure 111 and a second circuit structure 112. The first circuit structure 111 extends from the first surface 110a to the second surface 110b, and the second circuit structure 112 is disposed on the first surface 110a. Thus, the first circuit structure 111 and the second circuit structure 112 can respectively transmit signals and current, avoiding mutual interference; however, this disclosure is not limited thereto.

[0020] In detail, the transparent substrate 110 can be a through glass via (TGV) substrate, which has good light transmittance and has through holes for the first circuit structure 111 to be set. However, the detailed structure and position of the first circuit structure 111 can be adjusted as needed, so the present invention is not limited thereto.

[0021] The second circuit structure 112 on the first surface 110a can be arranged in a grid or in a straight line. Alternatively, the second circuit structure 112 can contain a plurality of wires (unlabeled), and the width of each wire can be from 10 μm to 100 μm. By adjusting the arrangement of the second circuit structure 112 or the width of the wires, the problem of the second circuit structure 112 blocking light can be reduced, thereby improving the transparency of the transparent display module 100.

[0022] A light-emitting diode (LED) element 120 is disposed on a first surface 110a and electrically connected to a first circuit structure 111 and a second circuit structure 112. For example, the first circuit structure 111 may include a plurality of conductive pads 111a, and the LED element 120 can be electrically connected to the first circuit structure 111 through the conductive pads 111a. Furthermore, the number of conductive pads 111a may be 1 to 4 times the number of LED elements 120. This helps to improve the convenience of installing the LED element 120.

[0023] The first protective layer 130 is connected to the first surface 110a, and the light-emitting diode element 120 is embedded in the first protective layer 130. Furthermore, the first protective layer 130 may be made of a transparent encapsulation material to avoid affecting the light-emitting effect of the light-emitting diode element 120, while providing good protection.

[0024] Wiring structure 140 connects to second surface 110b, such that transparent substrate 110 is located between first protective layer 130 and wiring structure 140. Wiring structure 140 includes a third circuit structure 141, and the third circuit structure 141 is electrically connected to first circuit structure 111. In detail, wiring structure 140 may be a redistribution layer (RDL) structure, which can be formed by providing patterned circuit layers, vias, and dielectric layers to form the required third circuit structure 141. However, the number and structure of patterned circuit layers, vias, and dielectric layers can be determined as needed, and this disclosure does not limit them.

[0025] Integrated circuit element 150 is disposed on a surface of wiring structure 140 away from transparent substrate 110 (not labeled) and electrically connected to third circuit structure 141. The integrated circuit element 150 may be a driving integrated circuit element or a control integrated circuit element, but the present disclosure is not limited thereto.

[0026] The second protective layer 160 connects to the surface of the wiring structure 140, such that the wiring structure 140 is located between the transparent substrate 110 and the second protective layer 160, and the integrated circuit element 150 is embedded within the second protective layer 160. Furthermore, the second protective layer 160 may be made of a transparent encapsulation material to avoid affecting the overall transparency of the transparent display module 100, while providing good protection.

[0027] Please refer to Figure 3, which is a flowchart of the manufacturing method 200 for a transparent display module according to one embodiment of this disclosure. The manufacturing method 200 for the transparent display module includes steps 210, 220, 230, 240, 250, and 260.

[0028] Please refer to Figures 1 and 2 together. Step 210 involves forming a first circuit structure 111 and a second circuit structure 112 on a transparent substrate 110. The transparent substrate 110 has opposing first surfaces 110a and second surfaces 110b. The first circuit structure 111 extends from the first surface 110a to the second surface 110b, and the second circuit structure 112 is disposed on the first surface 110a. Specifically, the first circuit structure 111 can be formed using vias in the transparent substrate 110, and a conductive pad 111a can be disposed on the first surface 110a for subsequent electrical connections. The second circuit structure 112 can be fabricated using printing technology and can be arranged in a grid or linear pattern on the first surface 110a; however, this disclosure is not limited to the above-described process or structure.

[0029] Step 220 involves forming a wiring structure 140 on the second surface 110b. The wiring structure 140 includes a third circuit structure 141, which is electrically connected to the first circuit structure 111. The wiring structure 140 can be formed by repeatedly stacking patterned circuit layers and dielectric layers to create the third circuit structure 141. The number and structure of the patterned circuit layers and dielectric layers can be determined depending on the type of electrically connected components.

[0030] Step 230 involves placing the light-emitting diode element 120 on the first surface 110a, and electrically connecting the light-emitting diode element 120 to the first circuit structure 111 and the second circuit structure 112. This allows the first circuit structure 111 and the second circuit structure 112 to transmit signals and current respectively, avoiding mutual interference.

[0031] Step 240 involves placing the integrated circuit element 150 on the surface of the wiring structure 140 away from the transparent substrate 110, and electrically connecting the integrated circuit element 150 to the third wiring structure 141. Since the integrated circuit element 150 has a large number of pins, placing it on the wiring structure 140 allows adjustment of the third wiring structure 141 to accommodate the pin distribution of the integrated circuit element 150, facilitating the electrical connection of the integrated circuit element 150.

[0032] Step 250 involves forming a first protective layer 130 on the first surface 110a, embedding the light-emitting diode element 120 within the first protective layer 130, and placing the transparent substrate 110 between the first protective layer 130 and the wiring structure 140. Step 260 involves forming a second protective layer 160 on the surface of the wiring structure 140, placing the wiring structure 140 between the transparent substrate 110 and the second protective layer 160, and embedding the integrated circuit element 150 within the second protective layer 160 to obtain a transparent display module 100. Here, the first protective layer 130 and the second protective layer 160 provide good protection, and both the first protective layer 130 and the second protective layer 160 can be made of a transparent encapsulation material to avoid affecting the overall transparency of the transparent display module 100.

[0033] It should be noted that the transparent substrate 110, light-emitting diode element 120, first protective layer 130, wiring structure 140, integrated circuit element 150 and second protective layer 160 manufactured by the transparent display module manufacturing method 200 have the same or similar structure or size as the aforementioned transparent display module 100, so they will not be described again.

[0034] In summary, the transparent display module and its manufacturing method disclosed herein, by setting a transparent substrate, a first protective layer, a wiring structure, and a second protective layer, and by using a first circuit structure, a second circuit structure, and a third circuit structure for electrical configuration, enable the transparent display module of this disclosure to possess good transparency. Furthermore, the transparent display module of this disclosure has a specific structural design, allowing it to be cut and segmented according to requirements, thereby improving its space utilization.

[0035] Although the present disclosure has been presented above with reference to embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art may make various modifications and alterations without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims.

[0036] 100: Transparent Display Module 110:Transparent substrate 110a: First surface 110b: Second surface 111: First line structure 111a: Conductive pad 112: Second line structure 120: Light Emitting Diode Component 130: First protective layer 140: Wiring Structure 141: Third line structure 150: Integrated circuit elements 160: Second protective layer 200: Manufacturing method of transparent display module 210, 220, 230, 240, 250, 260: Steps

Claims

1. A transparent display module, comprising: a transparent substrate having a first surface and a second surface opposite to each other, and the transparent substrate comprising: a first circuit structure extending from the first surface to the second surface; and a second circuit structure disposed on the first surface; a plurality of light-emitting diode elements disposed on the first surface and electrically connected to the first circuit structure and the second circuit structure; a first protective layer connected to the first surface, and the light-emitting diode elements embedded in the first protective layer; a wiring structure connected to the second surface, such that the transparent substrate is located between the first protective layer and the wiring structure, the wiring structure comprising a third circuit structure electrically connected to the first circuit structure; a plurality of integrated circuit elements disposed on a surface of the wiring structure away from the transparent substrate and electrically connected to the third circuit structure; and a second protective layer connected to the surface of the wiring structure, such that the wiring structure is located between the transparent substrate and the second protective layer, and the integrated circuit elements embedded in the second protective layer; The second circuit structure is arranged in a grid pattern or a straight line pattern on the first surface.

2. The transparent display module as claimed in claim 1, wherein the first circuit structure includes a plurality of conductive pads, and the light-emitting diode elements are electrically connected to the first circuit structure through the conductive pads.

3. The transparent display module as claimed in claim 2, wherein the number of the conductive pads is 1 to 4 times the number of the light-emitting diode elements.

4. The transparent display module as claimed in claim 1, wherein the second circuit structure comprises a plurality of conductors, and each conductor has a width of 10 μm to 100 μm.

5. A method for manufacturing a transparent display module, comprising: forming a first circuit structure and a second circuit structure on a transparent substrate, wherein the transparent substrate has a first surface and a second surface opposite to each other, the first circuit structure extending from the first surface to the second surface, and the second circuit structure being disposed on the first surface; forming a wiring structure on the second surface, the wiring structure including a third circuit structure, and the third circuit structure being electrically connected to the first circuit structure; disposing a plurality of light-emitting diode elements on the first surface, and the light-emitting diode elements being electrically connected to the first circuit structure and the second circuit structure; and disposing a plurality of integrated circuit elements on a surface of the wiring structure away from the transparent substrate, and the integrated circuit elements being electrically connected to the third circuit structure; A first protective layer is formed on the first surface, and the light-emitting diode elements are embedded in the first protective layer, with the transparent substrate located between the first protective layer and the wiring structure; and a second protective layer is formed on the surface of the wiring structure, with the wiring structure located between the transparent substrate and the second protective layer, and the integrated circuit elements are embedded in the second protective layer, to obtain a transparent display module; wherein the second circuit structure is arranged in a grid pattern or a straight line pattern on the first surface.

6. A method for manufacturing a transparent display module as claimed in claim 5, wherein the first circuit structure includes a plurality of conductive pads, and the light-emitting diode elements are electrically connected to the first circuit structure through the conductive pads.

7. The method of manufacturing a transparent display module as claimed in claim 6, wherein the number of the conductive pads is 1 to 4 times the number of the light-emitting diode elements.

8. The method of manufacturing a transparent display module as claimed in claim 5, wherein the second circuit structure comprises a plurality of wires, and each wire has a width of 10 μm to 100 μm.

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