Method and apparatus for bonding substrates

TW202638843APending Publication Date: 2026-09-16ASML NETHERLANDS BV
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Patent Information

Application Number
TW114142763
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-04
Filing Date
2025-11-04
Publication Date
2026-09-16

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Abstract

A method for bonding substrates, the method comprising: applying a first bending force to bend a first substrate along a first axis; bringing the first substrate into contact with a second substrate to provide a zone of contact between the first substrate and the second substrate along the first axis; and releasing the first substrate from the first bending force.
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