Substrate processing method, substrate processing apparatus and program

Abstract

[Problem] To provide a method and apparatus for "easily filling the gap between substrates with a liquid medicine". [Solution] The substrate processing method includes: supplying a liquid medicine (F1) to the gap (G) between the first substrate (W1) and the second substrate (W2) at the periphery (W3a) of a laminated substrate (W3) formed by bonding a first substrate (W1) and a second substrate (W2); after supplying the liquid medicine (F1), heating the laminated substrate (W3) at a first temperature lower than a second temperature for hardening the liquid medicine (F1); after heating at the first temperature, cleaning the periphery (W3a) of the laminated substrate (W3) with a cleaning solution (F2) in a manner that removes the dried liquid medicine (F1) from the periphery (W3a) of the laminated substrate (W3); and after cleaning, heating the laminated substrate (W3) at the second temperature.

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